Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q144.20x20C
144 LEAD THIN QUAD FLATPACK PACKAGE (TQFP)
Rev 0, 2/12
MILLIMETERS
D
SYMBOL
D1
D2
A
A2
A1
- 0.05 S
-D-
MIN
-B-
-A-
e
b
L1
E
E1
E2
4X
aaa C A-B D
bbb H A-B D
0.05
0.10
0.95
1.00 1.05 0.037 0.039 0.041
0.15 0.002 0.004 0.006
D
22.00 BSC
D1
20.00 BSC
0.866 BSC
0.787 BSC
E
22.00 BSC
0.866 BSC
20.00 BSC
0.787 BSC
R2
0.08
-
0.20 0.003
R1
0.08
-
-
0.003
-
-
θ
0°
3.5°
7°
0°
3.5°
7°
ccc C
-C- SEATING PLANE
-
0.008
θ1
0°
-
-
0°
-
-
θ2
11°
12°
13°
11°
12°
13°
θ3
11°
12°
13°
11°
12°
13°
c
0.09
-
-
0.008
L
0.45
L1
S
0.20 0.004
0.60
0.75 0.018 0.024 0.030
1.00 REF
0.20
-
0.039 REF
-
0.008
-
-
144L
MILLIMETERS
θ
MAX
A2
C
SEE DETAIL "X"
NOM
A1
ddd M C A-B s D s
θ1
θ2
MIN
1.00 1.10 1.20 0.039 0.043 0.047
TOP VIEW
SIDE VIEW
MILLIMETERS
MAX
A
E1
4X
NOM
MILLIMETERS
SYMBOL
MIN
NOM
MAX
MIN
NOM
MAX
b
0.17
0.20
0.27
0.007
0.008
0.011
e
0.50 BSC
0.020 BSC
D2
17.50
0.689
E2
17.50
0.689
TOLERANCES OF FORM AND POSITION
aaa
0.20
0.008
bbb
0.20
0.008
ccc
0.08
0.003
ddd
0.08
0.003
NOTES:
R1
R2 GAUGE
PLANE
0.25mm
-H-
L
θ3 S
DETAIL "X"
1. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm per side. D1 and E1 are
maximum plastic body size dimensions including mold
mismatch.
2. Dimension b does not include dambar protrusion.
Allowable dambar protrusion shall not cause the lead
width to exceed the maximum b dimension by more than
0.08mm. Dambar cannot be located on the lower radius
or the foot. Minimum space between protrusion and an
adjacent lead is 0.07mm for 0.4mm and 0.5mm pitch
packages.
3. Control dimensions are in millimeters.
1