Plastic Packages for Integrated Circuits Package Outline Drawing M10.118A (JEDEC MO-187-BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE (MSOP) Rev 0, 9/09 A 3.0 ± 0.1 0.25 10 DETAIL "X" CAB 0.18 ± 0.05 SIDE VIEW 2 4.9 ± 0.15 3.0 ± 0.1 1.10 Max B PIN# 1 ID 1 2 0.95 BSC 0.5 BSC TOP VIEW Gauge Plane 0.86 ± 0.09 H 0.25 C 3°±3° SEATING PLANE 0.55 ± 0.15 0.10 ± 0.05 0.10 C 0.23 +0.07/ -0.08 0.08 C A B DETAIL "X" SIDE VIEW 1 5.80 4.40 3.00 NOTES: 0.50 0.30 1. Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. Plastic interlead protrusions of 0.25mm max per side are not included. 4. 1.40 5. Dimensions “D” and “E1” are measured at Datum Plane “H”. TYPICAL RECOMMENDED LAND PATTERN 6. This replaces existing drawing # MDP0043 MSOP10L. 1