Plastic Packages for Integrated Circuits Package Outline Drawing M8.15E 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 0, 08/09 4 4.90 ± 0.10 A DETAIL "A" 0.22 ± 0.03 B 6.0 ± 0.20 3.90 ± 0.10 4 PIN NO.1 ID MARK 5 (0.35) x 45° 4° ± 4° 0.43 ± 0.076 1.27 0.25 M C A B SIDE VIEW “B” TOP VIEW 1.75 MAX 1.45 ± 0.1 0.25 GAUGE PLANE C SEATING PLANE 0.10 C 0.175 ± 0.075 SIDE VIEW “A 0.63 ±0.23 DETAIL "A" (0.60) (1.27) NOTES: (1.50) (5.40) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. TYPICAL RECOMMENDED LAND PATTERN 1 5. The pin #1 identifier may be either a mold or mark feature. 6. Reference to JEDEC MS-012.