Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Dual Flat No-Lead Package Family (DFN)
MDP0047
A
DUAL FLAT NO-LEAD PACKAGE FAMILY (JEDEC REG: MO-229)
D
MILLIMETERS
N N-1
0.075 C
2X
PIN #1
I.D.
E
1
2
0.075 C
B
2X
TOP VIEW
(D2)
4
L1
N-1
N
L
(N LEADS)
SYMBOL
DFN8
DFN10
TOLERANCE
A
0.85
0.90
±0.10
A1
0.02
0.02
+0.03/-0.02
b
0.30
0.25
±0.05
c
0.20
0.20
Reference
D
4.00
3.00
Basic
D2
3.00
2.25
±0.05
E
4.00
3.00
Basic
E2
2.20
1.50
±0.05
e
0.80
0.50
Basic
L
0.50
0.50
±0.10
L1
0.10
0
Maximum
Rev. 4 1/16
NOTES:
(E2)
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
PIN #1 I.D.
1
2
5
e
b
0.10 M C A B
C
6. N is the total number of leads on the device.
SEATING
PLANE
C
SEE DETAIL "X"
(N LEADS
& EXPOSED PAD)
2
C
A
3. Bottom-side pin #1 I.D. may be a diepad chamfer, an extended
tiebar tab, or a small square as shown.
5. Inward end of lead may be square or circular in shape with radius
(b/2) as shown.
C
0.08
2. Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
4. Exposed leads may extend to the edge of the package or be
pulled back. See dimension “L1”.
BOTTOM VIEW
0.10
3
(c)
A1
DETAIL X
1