Plastic Packages for Integrated Circuits Package Outline Drawing L28.4x5 28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 9/06 4.00 A 2.65 0.40 23 22 1 3.65 5.00 PIN #1 INDEX AREA CHAMFER 0.400 X 45° 28 0.50 0.10 8 15 14 2X 4.20 B 0.5x7=3.50 REF PIN 1 INDEX AREA 9 0.50 0.25 TOP VIEW 0.10 M C A B 0.5x5=2.50 REF 3.20 REF BOTTOM VIEW SEE DETAIL ''X'' MAX. 1.00 0.10 C PACKAGE BOUNDARY C (0.40) SEATING PLANE 0.08 C 0.00-0.05 SIDE VIEW (3.65) (4.200) (28X 0.25) (0.50) C 0.20REF 5 0~0.05 (28X 0.60) (2.65) DETAIL "X" (3.20) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Controlling dimensions are in mm. Dimensions in ( ) for reference only. 2. Unless otherwise specified, tolerance : Decimal ±0.05 Angular ±2° 3. Dimensioning and tolerancing conform to AMSE Y14.5M-1994. 4. Bottom side Pin#1 ID is diepad chamfer as shown. 5. Tiebar shown (if present) is a non-functional feature. 1