Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L28.4x4
28 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 6/15
A
2.50 ±0.05
PIN #1 INDEX AREA
CHAMFER
0.400 ±0.05 x 45° ±2°
0.40 ±0.05
22
28
1
2.50 ±0.05
4.00 ±0.05
21
0.40 ±0.05
15
3.20 ±0.05
B
PIN 1
INDEX AREA
0.4 x 6 = 2.40 REF
4.00 ±0.05
7
0.10
2x
14
8
0.4 x 6 = 2.40 REF
3.20 ±0.05
TOP VIEW
0.20 ±0.05
0.10 M C A B
BOTTOM VIEW
SEE DETAIL X''
PACKAGE
OUTLINE
0.10 C
(3.20)
C
MAX. 0.80
(28x 0.20)
0.00 - 0.05
0.20 REF
SEATING PLANE
0.08 C
(3.20)
(2.50)
SIDE VIEW
(0.40)
(0.40)
C
0.20 REF
5
0 ~ 0.05
(2.50)
(28x 0.60)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Controlling dimensions are in mm.
Dimensions in ( ) are for reference only.
2. Unless otherwise specified, tolerance : Decimal ±0.05
Angular ±2°
3. Dimensioning and tolerancing conform to AMSE Y14.5M-1994.
4. Bottom side Pin#1 ID is diepad chamfer as shown.
5. Tiebar shown (if present) is a non-functional feature.
1