Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Package with Top Exposed Pad (LQFP-TEP) Q128.14x20B 4 D NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB 3 SYMBOL A B 3 D2 E 4 e E2 N/4 TIPS 0.20 C A-B D 4X SEE DETAIL "A" TOP VIEW 5 7 D1/2 XX U NT RY E1/2 5 - - 1.60 0.05 - 0.15 A2 1.35 1.40 1.45 7 E1 NOTES 13 22 BSC 4 D1 20 BSC 7, 8 D2 12.20 BSC 14 E 16 BSC 4 E1 14 BSC 7, 8 L CO MAX A E2 D1 NOM A1 D E/2 PIN 1 ID MIN 8.35 BSC 0.45 0.60 N 128 e 0.50 BSC 14 0.75 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 ccc 0.08 ddd 0.08 9 Rev. 1 7/11 4X NOTES: BOTTOM VIEW 0.20 H A-B D 1. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 8 PLACES 11/13° 2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. A 2 H 0.05 / / 0.10 C ccc C 4. To be determined at seating plane C. SEE DETAIL "B" 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.254mm per side on D1 and E1 dimensions. ddd M C A-B S D S 9 WITH LEAD FINISH b 0.09/0.20 6. “N” is the total number of terminals. 7. These dimensions to be determined at datum plane H. 0.09/0.16 b 1 8. Package top dimensions are smaller than package bottom dimensions and top of package will not overhang bottom of package. BASE METAL 9. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located at the lower radius or the foot. 0° MIN. A2 - 0.08/0.20 R. DATUM PLANE H 0.05 S 3. Datums A-B and D to be determined at center lines between leads where leads exit plastic body at datum plane H. 10. Controlling dimension: millimeter. A1 0.08 R.MIN. 0-7° 11. Maximum allowable die thickness to be assembled in this package family is 0.38 millimeters. 0.25 GAUGE PLANE 12. This outline conforms to JEDEC publication 95 Registration MS-026, variations BHA & BHB. 0.20 MIN. L 1.00 REF. 13. A1 is defined as the distance from the seating plane to the lowest point of the package body. DETAIL "B" ODD LEAD SIDES EVEN LEAD SIDES 3 b 3 e/2 9 A, B, D A, B, D DETAIL "A" 1 14. Dimensions D2 and E2 represent the size of the exposed pad. The actual dimensions may be reduced up to 0.76mm due to mold flash.