Plastic Packages for Integrated Circuits Package Outline Drawing Q128.14x20H 128 LEAD PLASTIC QUAD FLATPACK PACKAGE EXPOSED PAD (PQFP) Rev 0, 10/13 MILLIMETER D D1 D2 SYMBOL MIN NOM MAX MIN NOM MAX A2 A - - 3.40 - - 0.134 A1 0.25 - - 0.010 - - A2 2.50 2.72 - 0.10 S A1 -A- -B- 4X e b aaa C A-B D bbb C A-B D 4X ccc M C A-B s D s c D 23.20 BSC 0.913 BSC 20.00 BSC 0.787 BSC E 17.20 BSC 0.677 BSC E1 14.00 BSC SEE DETAIL X'' θ θ1 0.13 - R1 0.13 - - 0.005 - - θ 0° - 7° 0° - 7° θ1 0° - - 0° - - ddd C θ R 0.11 L 0.73 R2 GAGE PLANE θ 15° REF 0.15 0.23 0.004 0.006 0.009 0.88 1.03 0.029 0.035 0.041 1.60 REF - 0.063 REF S 0.20 - 0.008 b 0.170 0.200 0.270 0.007 0.008 0.011 DETAIL X e 0.50 BSC 0.020 BSC D2 18.50 0.728 E2 12.50 0.492 12.50 2X-R2.75 BOTTOM VIEW 1 - TOLERANCES OF FORM AND POSITION aaa 0.20 0.008 bbb 0.20 0.008 ccc 0.08 0.003 ddd 0.08 0.003 1. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 do include mold mismatch and are determined at datum plane -H- . 3. Control dimensions are in millimeters. 11.71 - 2. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius or the lead foot. 13.50 DROP IN EXPOSED HEAT SLUG 0.012 15° REF 15° REF c - NOTES: 0.25 mm -H- 0.30 0.005 15° REF θ3 -C- SEATING PLANE SIDE VIEW 0.551 BSC R2 L1 TOP VIEW 2.90 0.098 0.107 0.114 D1 θ2 L1 E E1 E2 -D- INCH A