Plastic Packages for Integrated Circuits Package Outline Drawing Q128.14x20C 128 LOW PLASTIC QUAD FLATPACK PACKAGE WITH TOP EXPOSED PAD (TEP-LQFP) Rev 0, 4/10 22.00 4 5 20.00 12.81 ±0.10 D 3 3 A 16.00 B 3 8.38 ±0.10 0.50 4X 0.20 C A-B D 14.00 4 5 EXPOSED PAD PIN 1 ID 4X TOP VIEW 0.20 H A-B D BOTTOM VIEW 0° MIN. 1.60 MAX 1.40 ±0.05 / / 0.10 C C SIDE VIEW 0.08 H 11/13° 0.05 0.05/0.15 SEE DETAIL "A" 2 0.08 R. MIN. 0.20 MIN. 0.25 GAUGE PLANE 0.60 ± 0.15 0-7° (1.00) DETAIL "A" SCALE: NONE (21.4) 7 (12.81) 0.22 ± 0.05 0.09/0.20 0.20 ±0.03 0.08 M C A-B D WITH LEAD FINISH 0.09/0.16 BASE METAL NOTES: (8.38) (15.4) 1. All dimensioning and tolerancing conform to ANSI Y14.5-1982. 2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and D to be determined at centerline between leads where leads exit plastic body at datum plane H. 4. Dimensions do not include mold protrusion. Allowable mold protrusion is 0.254mm. 5. These dimensions to be determined at datum plane H. (0.28) (1.40) TYPICAL RECOMMENDED LAND PATTERN 6. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 7. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total at maximum material condition. Dambar cannot be located on the lower radius or the foot. 8. Controlling dimension: millimeter. 9. This outline conforms to JEDEC publication 95 registration MS-026, variation BHB-HU. 10. Dimensions in ( ) are for reference only. 1