Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q128.14x20C
128 LOW PLASTIC QUAD FLATPACK PACKAGE WITH TOP EXPOSED PAD (TEP-LQFP)
Rev 0, 4/10
22.00
4 5
20.00
12.81 ±0.10
D 3
3 A
16.00
B
3
8.38 ±0.10
0.50
4X
0.20 C A-B D
14.00 4 5
EXPOSED PAD
PIN 1 ID
4X
TOP VIEW
0.20 H A-B D
BOTTOM VIEW
0° MIN.
1.60 MAX
1.40 ±0.05
/ / 0.10 C
C
SIDE VIEW
0.08
H
11/13°
0.05
0.05/0.15
SEE DETAIL "A"
2
0.08
R. MIN.
0.20 MIN.
0.25
GAUGE PLANE
0.60 ± 0.15
0-7°
(1.00)
DETAIL "A"
SCALE: NONE
(21.4)
7
(12.81)
0.22 ± 0.05
0.09/0.20
0.20 ±0.03
0.08 M C A-B D
WITH LEAD FINISH
0.09/0.16
BASE METAL
NOTES:
(8.38)
(15.4)
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
3. Datums A-B and D to be determined at centerline between
leads where leads exit plastic body at datum plane H.
4. Dimensions do not include mold protrusion. Allowable mold
protrusion is 0.254mm.
5. These dimensions to be determined at datum plane H.
(0.28)
(1.40)
TYPICAL RECOMMENDED LAND PATTERN
6. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
7. Does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm total at maximum material
condition. Dambar cannot be located on the lower radius
or the foot.
8. Controlling dimension: millimeter.
9. This outline conforms to JEDEC publication 95 registration
MS-026, variation BHB-HU.
10. Dimensions in ( ) are for reference only.
1