Plastic Packages for Integrated Circuits Package Outline Drawing Q208.28x28D 208 LEAD PLASTIC QUAD FLATPACK PACKAGE (PQFP) Rev 0, 12/12 MILLIMETERS D SYMBOL MIN NOM MAX MIN NOM MAX D2 A - - 4.10 - - 0.161 A1 0.25 - - 0.010 - - A2 3.20 3.32 3.60 -D- E2 D 30.60 BSC 28.00 BSC 1.102 BSC E 30.60 BSC 1.205 BSC 28.00 BSC - 0.25 0.003 - R1 0.08 - - 0.003 - - θ 0° 3.5° 7° 0° 3.5° 7° θ1 0° - - 0° - - 8° REF θ3 e b bbb H A-B D 0.09 L 0.45 TOP VIEW 16.00 0.010 8° REF 8° REF c L1 ddd M C A-B s D s 1.102 BSC 0.08 4X aaaC A-B D 4X 1.205 BSC R2 θ2 8° REF 0.15 0.20 0.004 0.006 0.008 0.60 0.75 0.018 0.024 0.030 1.30 REF 0.051 REF S 0.20 - - b 0.17 0.20 0.27 0.008 - - 0.007 0.008 0.011 4. R 00 e 0.50 BSC 0.020 BSC D2 25.50 1.004 E2 25.50 1.004 TOLERANCES OF FORM AND POSITION 16.00 E -B- 0.126 0.131 0.142 D1 E1 -AE1 INCHES D1 aaa 0.20 0.008 bbb 0.20 0.008 ccc - 0.08 - - 0.003 - ddd - 0.08 - - 0.003 - NOTES: 1. Dimensions D1 and E1 do not include mold protrusion. 2. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07mm. 3. The top package body size may be smaller than the bottom package body size. DROP IN EXPOSED HEAT SLUG BOTTOM VIEW θ1 θ θ2 -C- SEATING PLANE ccc C R1 R2 -H- 1 SIDE VIEW A L1 A1 θ3 DETAIL “X” S A2 L 0.05 c S - GAUGE PLANE 0.25mm