Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q208.28x28E
208 LEAD PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (PQFP-EP)
Rev 1, 6/13
MILLIMETERS
D
SYMBOL
MIN
NOM
MAX
MIN
NOM
MAX
D2
A
-
-
4.10
-
-
0.161
A1
0.25
-
-
0.010
-
-
A2
3.20
3.32
3.60
0.126
0.131
0.142
-D-
D
30.60 BSC
D1
28.00 BSC
1.102 BSC
E
30.60 BSC
1.205 BSC
E1
-B-
E2
28.00 BSC
-
0.25
0.003
-
R1
0.08
-
-
0.003
-
-
q
0°
3.5°
7°
0°
3.5°
7°
q1
0°
-
-
0°
-
-
8° REF
q3
4X
e
b
bbb H A-B D
ddd M C A-B s D s
TOP VIEW
θ1
1.102 BSC
0.08
q2
4X
aaaC A-B D
1.205 BSC
R2
0.010
8° REF
8° REF
8° REF
c
0.09
0.15
0.20
0.004
0.006
0.008
L
0.45
0.60
0.75
0.018
0.024
0.030
L1
1.30 REF
0.051 REF
S
0.20
-
-
0.008
-
-
b
0.17
0.20
0.27
0.007
0.008
0.011
e
0.50 BSC
0.020 BSC
D2
25.50
1.004
E2
25.50
1.004
TOLERANCES OF FORM AND POSITION
θ
-C- SEATING
PLANE
ccc C
-
0.05
S
A1
SIDE VIEW
A
A2
c
L1
aaa
0.20
bbb
0.20
0.008
0.008
ccc
-
0.08
-
-
0.003
-
ddd
-
0.08
-
-
0.003
-
NOTES:
1. Dimensions D1 and E1 do not include mold protrusion.
2. Dimension b does not include dambar protrusion. Allowable dambar
protrusion shall not cause the lead width to exceed the maximum b
dimension by more than 0.08mm. Dambar cannot be located on the
lower radius or the foot. Minimum space between protrusion and an
adjacent lead shall not be less than 0.07mm.
3. The top package body size may be smaller than the bottom package
body size.
4. JEDEC Spec MS-0-029.
16.00
R4.00
θ2
R1
R2
-H-
GAUGE
PLANE
0.25mm
16.00
E
-AE1
INCHES
D1
S
L
θ3
DETAIL “X”
DROP IN EXPOSED HEAT SLUG
BOTTOM VIEW
1