Plastic Packages for Integrated Circuits Package Outline Drawing Q208.28x28E 208 LEAD PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (PQFP-EP) Rev 1, 6/13 MILLIMETERS D SYMBOL MIN NOM MAX MIN NOM MAX D2 A - - 4.10 - - 0.161 A1 0.25 - - 0.010 - - A2 3.20 3.32 3.60 0.126 0.131 0.142 -D- D 30.60 BSC D1 28.00 BSC 1.102 BSC E 30.60 BSC 1.205 BSC E1 -B- E2 28.00 BSC - 0.25 0.003 - R1 0.08 - - 0.003 - - q 0° 3.5° 7° 0° 3.5° 7° q1 0° - - 0° - - 8° REF q3 4X e b bbb H A-B D ddd M C A-B s D s TOP VIEW θ1 1.102 BSC 0.08 q2 4X aaaC A-B D 1.205 BSC R2 0.010 8° REF 8° REF 8° REF c 0.09 0.15 0.20 0.004 0.006 0.008 L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.30 REF 0.051 REF S 0.20 - - 0.008 - - b 0.17 0.20 0.27 0.007 0.008 0.011 e 0.50 BSC 0.020 BSC D2 25.50 1.004 E2 25.50 1.004 TOLERANCES OF FORM AND POSITION θ -C- SEATING PLANE ccc C - 0.05 S A1 SIDE VIEW A A2 c L1 aaa 0.20 bbb 0.20 0.008 0.008 ccc - 0.08 - - 0.003 - ddd - 0.08 - - 0.003 - NOTES: 1. Dimensions D1 and E1 do not include mold protrusion. 2. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07mm. 3. The top package body size may be smaller than the bottom package body size. 4. JEDEC Spec MS-0-029. 16.00 R4.00 θ2 R1 R2 -H- GAUGE PLANE 0.25mm 16.00 E -AE1 INCHES D1 S L θ3 DETAIL “X” DROP IN EXPOSED HEAT SLUG BOTTOM VIEW 1