Plastic Packages for Integrated Circuits Package Outline Drawing L15.3.5x3.5 15 LEAD THIN QUAD FLAT NO-LEAD PACKAGE (TQFN) Rev 1, 9/14 SEE PIN 1 ID DETAIL A 3.50 B PIN #1 4 INDEX AREA 10 x 0.50 BSC 5 12x 0.25±0.05 0.10 M C A B 0.05 M C 1 2 3 4 5 6 1.002 7 2x 0.45±0.05 0.749 BSC 8 0.10 M C A B 0.05 M C 3.50 0.653 BSC 9 0.258±0.05 (2X) 1.096 0.10 M C A B 0.05 M C 0.05 C 15 14 13 12 11 10 12 x 0.48±0.1 0.05 C (2X) BOTTOM VIEW TOP VIEW 0.15 PACKAGE OUTLINE (12x 0.25±0.05) (10x 0.50) 1 0.15 12x 0.68±0.1 (1.002) (2x 0.45±0.05) 0.37 (0.749) PIN 1 ID DETAIL (3.90) (0.653) (0.258±0.05) 0.10 C (1.096) 0.203 REF 0.75 ±0.05 (0.20 TYP) 6 15x 0.08 C (3.90) C 0.02 -0 +0.05 SEATING PLANE SIDE VIEW TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 2. All dimensions are in millimeters. 3. N is the total number of terminals. 4. The location of the marked terminal #1 identifier is within the hatched area. 5. Dimension applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. If the terminal has a radius on the other end of it, dimension b should not be measured in that radius area. 6. Coplanarity applies to the terminals and all other bottom surface metallization. 1