Plastic Packages for Integrated Circuits Package Outline Drawing L6.1.6x1.6C 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD COL PLASTIC PACKAGE (UTDFN COL) Rev 1, 05/15 1.60 6 PIN 1 INDEX AREA 1X0. 60 ± 0. 1 A 1.60 B 4X 0.50 2X 1.00 (4X) 0.15 4 0. 25 ± 0. 05 / -0.07 0.10M C A B 5X 0. 50 ± 0. 1 TOP VIEW BOTTOM VIEW (1X 0.80) (5X 0.70) (6X 0.25) SEE DETAIL "X" 0.10 C 0.55 MAX C BASE PLANE SIDE VIEW SEATING PLANE 0.08 C (4X .050) C 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. 2.00 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.20mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.