Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L28.4x5C
28 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 9/08
2.50
4.00
B
22
5.00
PIN #1 INDEX AREA
28
23
6
PIN 1
INDEX AREA
(4X)
6
24X 0.50
A
1
3.50
Exp. DAP
3.50
0.10 M C A B
4
28X 0.25
0.15
8
15
9
14
2.50
Exp. DAP
SIDE VIEW
TOP VIEW
28X 0.400
BOTTOM VIEW
SEE DETAIL "X"
( 3.80 )
0.10 C
Max 0.80
( 2.50)
C
SEATING PLANE
0.08 C
SIDE VIEW
( 4.80 )
( 24X 0.50)
( 3.50 )
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
(28X .250)
DETAIL "X"
( 28 X 0.60)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must
be located within the zone indicated. The pin #1 identifier may
be either a mold or mark feature.
1