Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L28.6x6A
28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 3/09
3.90
6.00
24X 0.65
A
B
6
PIN 1
INDEX AREA
1
21
6.00
3.90
Exp. DAP
4.10 ±0.050 Sq
15
(4X)
6
PIN #1 INDEX AREA
28
22
7
0.15
8
14
TOP VIEW
28 X 0.30 ±0.050
0.10M C A B
28 X 0.60 ±0.50
SIDE VIEW
4
BOTTOM VIEW
( 5.60 )
SEE DETAIL "X"
( 3.90)
( 24X 0.65)
0.10 C
0.85 ±0.050
C
SEATING PLANE
0.08 C
SIDE VIEW
( 5.60 )
( 3.90)
( 4.10 sq)
(28 X .30)
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 28 X 0.80)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1