Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L24.4x4E
24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 2/14
4.00
6
PIN #1 INDEX
AREA
20X 0.50
A
B
24
19
6
PIN 1
INDEX AREA
18
4.00
1
(4X)
Exp. DAP
2.60 ±0.10
6
13
0.15
0.10 M C A B
24X 0.250 ±0.050 4
7
12
SIDE VIEW
TOP VIEW
24X 0.400 ±0.050
BOTTOM VIEW
SEE DETAIL "X"
( 3.80 )
( 2.60)
0.10 C
Max 0.80
SEATING PLANE
0.08 C
SIDE VIEW
( 20X 0.50)
( 3.80 )
( 2.60 )
C
(24X 0.250)
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 24 X 0.60)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1
C