MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN52 6x6, 0.65P CASE 485AV ISSUE B DATE 29 MAR 2016 SCALE 2:1 D ÉÉÉ ÉÉÉ ÉÉÉ PIN ONE REFERENCE PACKAGE EDGE A B E P DIM A A1 b D D2 D3 E E2 E3 eT eR L P 0.15 C 2X DETAIL A 0.15 C 2X TOP VIEW 0.10 C A 52X 0.08 C A1 SEATING PLANE C SIDE VIEW D3 A7 L 1 eT DETAIL A 52X MILLIMETERS NOM MAX 0.90 1.00 0.05 0.10 0.20 0.25 6.00 BSC 3.20 3.30 3.40 5.50 BSC 6.00 BSC 3.20 3.30 3.40 5.50 BSC 0.65 BSC 0.65 BSC 0.35 0.40 0.45 0.05 REF MIN 0.80 0.00 0.15 GENERIC MARKING DIAGRAM* D2 44X A8 B7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30mm FROM TERMINAL 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. E3/2 A14 B12 B13 B6 XXXXXXXX XXXXXXXX AWLYYWWG A15 E2 E3 A1 B18 B1 B24 A28 eR XXXXX A WL YY WW G A21 B19 A22 52X PIN 1 ID b 0.10 C A B 0.05 C BOTTOM VIEW NOTE 3 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. SOLDERING FOOTPRINT 6.20 4.65 3.35 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package DETAIL A A1 B1 3.35 4.65 6.20 52X 8X 0.25 MIN 0.35 26X DETAIL A 0.45 PACKAGE OUTLINE 26X 0.65 PITCH 0.58 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: 98AON32300E Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com QFN52 6x6, 0.65P DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 1 DOCUMENT NUMBER: 98AON32300E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY S. MOHAMMED. 02 SEP 2008 A ADDED SOLDERING FOOTPRINT. REQ. BY S. MOHAMMED. 29 OCT 2008 B CHANGED B DIMENSION FROM 0.25−0.35MM TO 0.15−0.25MM. REQ. BY C. MAGPANTAY. 29 MAR 2016 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2016 March, 2016 − Rev. B Case Outline Number: 485AV