Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L68.10x10C
68 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 04/09
10.00
A
B
4 X 8.00
51
6
6
PIN #1
INDEX AREA
68
52
1
PIN 1
INDEX AREA
10.00
(4X)
EXPOSED
PAD
7.70
64 X 0.50
0.15
68 X 0.25
68 X 0.55 ±0.10
TOP VIEW
BOTTOM VIEW
PACKAGE OUTLINE
SEE DETAIL “X”
1.00 MAX
C
0.10 C
64 X 0.50
MIN 0.00
MAX 0.05
7.70
0.08 C
SEATING PLANE
68 X 0.25
10.00
SIDE VIEW
68 X 0.20
C
68 X 0.55
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.23mm and 0.28mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1