Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L48.7x7F
48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 4/09
7.00
A
4X 5.50
6
PIN #1
INDEX AREA
B
48
37
36
6
PIN 1
INDEX AREA
7.00
(4X)
1
44X 0.50
EXP DAP 5.15 Sq
12
25
0.15
24
13
48X 0.25
48X 0.40
4
0.10 M C A B
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
// 0.10 C
C
BASE PLANE
PACKAGE OUTLINE
SEATING PLANE
0.08 C
0.90 Max
SIDE VIEW
44X 0.50
7.00 5.15
48X 0.25
C
48X 0.20
0.2 REF
5
0.00 MIN
0.05 MAX
48X 0.60
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.18mm and 0.28mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1