Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L72.10x10C
72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN)
Rev 0, 7/07
10.00
A
9.75
X
B
EXPOSED PAD AREA
Z
72
72
1
6
PIN 1
INDEX AREA
1
9.75
8.50 REF.
(4X)
6
PIN #1 INDEX AREA
10.00
68X 0.50
4 0.23
(4X)
0.15
72X 0.50 ±0.1 mm
6.00 REF.
(4X)
TOP VIEW
0.100 M C A B
BOTTOM VIEW
PACKAGE OUTLINE
R0.200
10.00
0.450
6.00
(0
.1
AR 2 5
O )
U
N
D
)
(68X 0.50)
C0.400 X 45°
(4X)
(72X 0.23)
(A
L
(72X 0.20)
(72X 0.70)
LL
R0.200
TYP.
1
TYPICAL RECOMMENDED LAND PATTERN
DETAIL “X”
72
R0.115
TYP.
DETAIL “Z”
11° ±1° ALL AROUND
Y
9.75
10.00
R0.200 MAX
ALL AROUND
SIDE VIEW
0.100 C
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
0.65
0.85
2. Dimensioning and tolerancing conform to JESD-MO220.
3. Unless otherwise specified, tolerance : Decimal ± 0.05;
body tolerance: ±0.1mm
0.19~ 0.245
SEATING
PLANE
0.08 C
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1
e
0.25 ±0.02
b
0.100 M C A B
0.050 M C
DETAIL “Y”
C