Plastic Packages for Integrated Circuits Package Outline Drawing L72.10x10C 72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN) Rev 0, 7/07 10.00 A 9.75 X B EXPOSED PAD AREA Z 72 72 1 6 PIN 1 INDEX AREA 1 9.75 8.50 REF. (4X) 6 PIN #1 INDEX AREA 10.00 68X 0.50 4 0.23 (4X) 0.15 72X 0.50 ±0.1 mm 6.00 REF. (4X) TOP VIEW 0.100 M C A B BOTTOM VIEW PACKAGE OUTLINE R0.200 10.00 0.450 6.00 (0 .1 AR 2 5 O ) U N D ) (68X 0.50) C0.400 X 45° (4X) (72X 0.23) (A L (72X 0.20) (72X 0.70) LL R0.200 TYP. 1 TYPICAL RECOMMENDED LAND PATTERN DETAIL “X” 72 R0.115 TYP. DETAIL “Z” 11° ±1° ALL AROUND Y 9.75 10.00 R0.200 MAX ALL AROUND SIDE VIEW 0.100 C NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 0.65 0.85 2. Dimensioning and tolerancing conform to JESD-MO220. 3. Unless otherwise specified, tolerance : Decimal ± 0.05; body tolerance: ±0.1mm 0.19~ 0.245 SEATING PLANE 0.08 C 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1 e 0.25 ±0.02 b 0.100 M C A B 0.050 M C DETAIL “Y” C