Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L72.10x10F
72 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 4/12
10.00
6
PIN 1
INDEX AREA
A
6
PIN 1
INDEX AREA
4X 8.50
B
55
72
1
54
68X 0.50
EXP. DAP
7.70 SQ.
10.00
(4X)
37
0.15
18
36
19
72X 0.25
TOP VIEW
BOTTOM VIEW
SEE DETAIL "Z"
4
0.10 M C A B
SEE DETAIL "X"
0.90 MAX
0.10 C
C
0.08 C
SEATING PLANE
68X 0.50
(0.75)
72X 0.25
9.80 SQ
C
0 . 2 REF
5
37
7.70 SQ
(0.40)
0 . 00 MIN.
0 . 05 MAX.
36
(0.271)
DETAIL “Y”
72X 0.60
DETAIL "Z"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
Package outline compliant to JESD-MO220.
either a mold or mark feature.
1