Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.3x3
8 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 3/07
3.00
4X 0.65
A
B
6
PIN #1 INDEX AREA
8
7
6
PIN 1
INDEX AREA
1
5
2
3.00
6
(4X)
1 .10 ± 0 . 15
0.15
4
3
0.10 M C A B
4 8X 0.28 ± 0.05
TOP VIEW
8X 0.60 ± 0.15
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0 . 90 ± 0.1
( 4X 0 . 65 )
( 2. 60 TYP )
C
BASE PLANE
SEATING PLANE
0.08 C
(
1. 10 )
SIDE VIEW
( 8X 0 . 28 )
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
( 8X 0 . 80)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1