Plastic Packages for Integrated Circuits Small Outline Transistor Plastic Packages (SC70-3) 0.20 (0.008) M P3.049 VIEW C C 3 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE CL b INCHES SYMBOL 6 5 4 CL CL E1 E 1 2 3 e e1 D C CL A A2 SEATING PLANE A1 -C- PLATING b1 0.043 0.80 1.10 - 0.004 0.00 0.10 - A2 0.031 0.039 0.80 1.00 - b 0.009 0.016 0.25 0.40 - b1 0.009 0.014 0.25 0.35 c 0.004 0.007 0.10 0.18 6 c1 0.004 0.007 0.10 0.16 6 D 0.071 0.087 1.80 2.20 3 E 0.071 0.094 1.80 2.40 - E1 0.045 0.053 1.15 1.35 3 e 0.0256 Ref 0.65 Ref - e1 0.0512 Ref 1.30 Ref - 0.010 0.018 0.017 Ref. 0.26 0.46 4 0.420 Ref. 0.006 BSC 0° N c1 NOTES 0.031 α c MAX 0.000 L2 b MIN A L WITH MILLIMETERS MAX A1 L1 0.10 (0.004) C MIN - 0.15 BSC 8° 0° 3 8° - 3 5 R 0.004 - 0.10 - R1 0.004 0.010 0.15 0.25 Rev. 0 11/06 NOTES: BASE METAL 1. Dimensioning and tolerances per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC70 and JEDEC MO-203AA. 4X θ1 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. R1 4. Footlength L measured at reference to gauge plane. 5. “N” is the number of terminal positions. R GAUGE PLANE SEATING PLANE L C L1 4X θ1 VIEW C 1 α L2 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.