Plastic Packages for Integrated Circuits Small Outline Transistor Plastic Packages (SC70-5) P5.049 D VIEW C e1 5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE INCHES 5 SYMBOL 4 E CL 1 2 CL 3 e E1 b CL 0.20 (0.008) M C C CL A A2 SEATING PLANE A1 -C- PLATING b1 0.043 0.80 1.10 - 0.004 0.00 0.10 - A2 0.031 0.039 0.80 1.00 - b 0.006 0.012 0.15 0.30 - b1 0.006 0.010 0.15 0.25 c 0.003 0.009 0.08 0.22 6 c1 0.003 0.009 0.08 0.20 6 D 0.073 0.085 1.85 2.15 3 E 0.071 0.094 1.80 2.40 - E1 0.045 0.053 1.15 1.35 3 e 0.0256 Ref 0.65 Ref - e1 0.0512 Ref 1.30 Ref - L2 c1 NOTES 0.031 0.010 0.018 0.017 Ref. 0.26 0.46 4 0.420 Ref. 0.006 BSC 0o N c MAX 0.000 α WITH MIN A L b MILLIMETERS MAX A1 L1 0.10 (0.004) C MIN - 0.15 BSC 8o 0o 5 8o - 5 5 R 0.004 - 0.10 - R1 0.004 0.010 0.15 0.25 Rev. 3 7/07 NOTES: BASE METAL 1. Dimensioning and tolerances per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC70 and JEDEC MO-203AA. 4X θ1 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. R1 4. Footlength L measured at reference to gauge plane. 5. “N” is the number of terminal positions. R GAUGE PLANE SEATING PLANE L C L1 α 4X θ1 VIEW C 0.4mm 0.75mm 2.1mm 0.65mm TYPICAL RECOMMENDED LAND PATTERN 1 L2 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.