Statement of Materials, Construction 40L PDIP TABLE OF MATERIAL DECLARATION No. 1 Name of the Material Component Materials the part Name Weight(mg) Analysis 1.00 (Element) Leadframe Copper Alloy 1995.45 Cu 7440-50-8 Fe 7439-89-6 A194 w/Ag spot plating CAS Number Material Material Material Mass Weight % Weight % (milligram) (of Total Pkg) (of Component) 1935.59 min 30.31 min 97 min 41.90-51.88 0.66-0.81 2.1-2.6 0.05-0.20 Zn 7440-66-6 1.00-3.99 0.02-0.06 Ag 7440-22-4 0.40-0.80 0.01 0.02-0.04 P 7723-14-0 0.30-2.99 0.00-0.05 0.015-0.150 0.20 max Others - 0.20 max 0.00 0.01 max 2 Die Silicon Chip 5.50 Si - 5.47 0.09 99.50 3 Die attach material Conductive 1.18 Silver 7440-22-4 - 0.83-1.06 0.01-0.02 70-90 0.06-0.18 0.00 5-15 - 0.06-0.24 0.00 5-20 Epoxy Resin - 0.01-0.12 0.00 1-10 Epoxy Functionalized Urethane Diester resin Ablestik 2200D 4 Wire Gold 0.83 Au 7440-57-5 0.83 0.01 99.99 5 Lead Finish Pure Tin 15.12 0.24 99.9 Encapsulation Epoxy Resin 4367.36 7440-31-5 60676-86-0 15.10 6 Sn Silica Fused 3272.52-4148.99 51.30-64.98 75-95 Epoxy Resin - 87.35-349.39 1.37-5.47 2-8 Epoxy, Cresol Novalac 29690-82-2 29690 82 2 43 67-131 02 43.67-131.02 0 68-2 05 0.68-2.05 13 1-3 Phenol Resin - 87.35-349.39 1.37-5.47 2-8 1333-86-4 4.37-21.84 0.07-0.34 0.1-0.5 (EME G600V) Carbon Black Total Package weight 6385.44 Note: Composition derived from MSDS and material C of C from Vendors; Component Weight based on assembly of generic parts. Conclusion: The analysis table above shows that this package meets the following RoHS requirements for EACH PACKAGE COMPONENT (mold compound, lead frame, etc.) Lead Mercury Cadmium Hexavalent Chromium Polybrominated Biphenyls (PBB) Polybrominated Biphenylethers (PBDE) Maximum Allowable Limit (ppm) 1000 ppm 1000 ppm 100 ppm 1000 ppm 1000 ppm 1000 ppm Maximum Allowable Limit (wt %) 0.10% 0.10% 0.01% 0.10% 0.10% 0.10%