Plastic Packages for Integrated Circuits Package Outline Drawing L16.3x3D 16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 3/10 4X 1.50 3.00 A 12X 0.50 B 13 6 PIN 1 INDEX AREA 16 6 PIN #1 INDEX AREA 12 3.00 1 1.60 SQ 4 9 (4X) 0.15 0.10 M C A B 5 8 16X 0.40±0.10 TOP VIEW 4 16X 0.23 ±0.05 BOTTOM VIEW SEE DETAIL “X” 0.10 C 0.75 ±0.05 C 0.08 C SIDE VIEW (12X 0.50) (2.80 TYP) ( 1.60) (16X 0.23) C 0 . 2 REF 5 0 . 02 NOM. 0 . 05 MAX. (16X 0.60) TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.25mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 7. JEDEC reference drawing: MO-220 WEED. either a mold or mark feature. 1