Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L16.3x3D
16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 3/10
4X 1.50
3.00
A
12X 0.50
B
13
6
PIN 1
INDEX AREA
16
6
PIN #1
INDEX AREA
12
3.00
1
1.60 SQ
4
9
(4X)
0.15
0.10 M C A B
5
8
16X 0.40±0.10
TOP VIEW
4 16X 0.23 ±0.05
BOTTOM VIEW
SEE DETAIL “X”
0.10 C
0.75 ±0.05
C
0.08 C
SIDE VIEW
(12X 0.50)
(2.80 TYP) (
1.60)
(16X 0.23)
C
0 . 2 REF
5
0 . 02 NOM.
0 . 05 MAX.
(16X 0.60)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.25mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
JEDEC reference drawing: MO-220 WEED.
either a mold or mark feature.
1