Plastic Packages for Integrated Circuits Package Outline Drawing L8.3x3D 8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE (DFN) Rev 1, 3/15 PIN 1 INDEX AREA 3.00 B 1.45 A PIN 1 INDEX AREA 0.075 C 4X 6X 0.50 BSC 3.00 1.50 REF 1.75 8X 0.25 0.10 M C A B 8X 0.40 2.20 TOP VIEW BOTTOM VIEW SEE DETAIL X'' (8X 0.60) (8X 0.25) 0.10 C 0.85 C (1.75) SEATING PLANE 0.08 C (6X 0.50 BSC) SIDE VIEW (1.45) (2.20) TYPICAL RECOMMENDED LAND PATTERN c 0.20 REF 5 0~0.05 DETAIL “X” NOTES: 1. Controlling dimensions are in mm. Dimensions in ( ) for reference only. 2. Unless otherwise specified, tolerance: Decimal ±0.05 Angular ±2° 3. Dimensioning and tolerancing conform to JEDEC STD MO220-D. 4. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 1