Plastic Packages for Integrated Circuits Package Outline Drawing L10.3x3D 10 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 3/15 3.00 A 2.0 REF 6 PIN 1 INDEX AREA 8X 0.50 BSC 6 PIN 1 B 5 1 10X 0 . 40 INDEX AREA 3.00 1.60 0.15 (4X) 10 0.10 M C A B 0.05 M C 5 4 10 X 0.25 TOP VIEW 2.30 ( 2.30 ) BOTTOM VIEW 1.00 MAX SEE DETAIL "X" 0.10 C C (2.80) SEATING PLANE 0.08 C (1.60) SIDE VIEW (10 X 0.60) 5 0 . 2 REF C ( 8X 0 .50 ) 0 . 00 MIN. 0 . 05 MAX. ( 10X 0.25 ) TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 Angular: ±2.50° 4. Dimension applies to the metallized terminal and is measured between 0.015mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Compliant to JEDEC MO-229-WEED-3 except exposed pad length (2.30mm).