Plastic Packages for Integrated Circuits Package Outline Drawing L24.4X4F 24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 1/11 2.50 4.00 20X 0.50 A B 19 6 PIN 1 INDEX AREA 18 4.00 (4X) 24 1 EXP. DAP 2.50 ±0.05 SQ. 2.50 6 13 0.15 0.10 M C A B TOP VIEW 12 4 24X 0.250 ±0.050 6 PIN #1 INDEX AREA 7 0.25 MIN (4 SIDES) 24X 0.400 ±0.10 BOTTOM VIEW SEE DETAIL "X" ( 3.80 ) ( 2.50) 0.10 C 0.75 ±0.05 SEATING PLANE 0.08 C SIDE VIEW ( 20X 0.50) ( 3.80 ) ( 2.50 ) (24X 0.25) C 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. ( 24 X 0.60) TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 7. Compliant to JEDEC MO-220 VGGD-8. either a mold or mark feature. 1 C