Plastic Packages for Integrated Circuits Package Outline Drawing L20.4x4F 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETABLE FLANK) Rev 0, 2/11 0.10 C A 2X A 4.00 PIN 1 4X 0.42 ±0.18 0.10 M C A B 3.75 2.60 INDEX AREA PIN1 ID 0.30 x 45 2X 20 5 20 0.10 C B 1 2 3 1 2 3 4X 0.42 ±0.18 4.00 2.60 3.75 B TOP VIEW 0.25 MIN SEE DETAIL "X" SEE DETAIL "A" BOTTOM VIEW 0.85 +/-.05 0.15 ±0.10 0.50 SIDE VIEW 0.15 ±0.05 0 - 12° 0.40 ±0.10 0.25 ±0.05 C 0.10 ±0.05 0.10 M C A B SEATING PLANE DETAIL "A" 0.08 C DETAIL "X" 4 0.00 MIN 0.05 MIN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured 16X (0.50) (3.90) SQ 20X (0.25) (2.60) SQ between 0.20mm and 0.25mm from the terminal tip. 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 6. Reference document: JEDEC MO220. either a mold or mark feature. 20X (0.70) TYPICAL RECOMMENDED LAND PATTERN 1