Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L20.4x4F
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN WITH WETABLE FLANK)
Rev 0, 2/11
0.10 C A
2X
A
4.00
PIN 1
4X 0.42 ±0.18
0.10 M C A B
3.75
2.60
INDEX AREA
PIN1 ID
0.30 x 45
2X
20
5
20
0.10 C B
1
2
3
1
2
3
4X 0.42 ±0.18
4.00
2.60
3.75
B
TOP VIEW
0.25 MIN
SEE DETAIL "X"
SEE DETAIL "A"
BOTTOM VIEW
0.85 +/-.05
0.15 ±0.10
0.50
SIDE VIEW
0.15 ±0.05
0 - 12°
0.40 ±0.10
0.25 ±0.05
C
0.10 ±0.05
0.10 M C A B
SEATING PLANE
DETAIL "A"
0.08 C
DETAIL "X"
4
0.00 MIN
0.05 MIN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
16X (0.50)
(3.90) SQ
20X (0.25)
(2.60) SQ
between 0.20mm and 0.25mm from the terminal tip.
5.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
6.
Reference document: JEDEC MO220.
either a mold or mark feature.
20X (0.70)
TYPICAL RECOMMENDED LAND PATTERN
1