Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L48.7x7L
48 LEAD QUAD FLATPACK NO LEAD PLASTIC PACKAGE (QFN)
Rev 0, 2/11
0.10 C A
7.00
4X 5.50
A
PIN 1
INDEX AREA
PIN 1 ID
B
37
6
6
48
1
36
44X 0.50
EXP. DAP
7.00
5.30 ±0.10 SQ.
12
25
24
0.10 C B
13
48X 0.25 -0.07/+0.05 4
48X 0.40
TOP VIEW
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
C
0.85 ±0.05
0 . 2 REF
5
C
0.10 C
0 . 00 MIN.
0 . 05 MAX.
0.08 C
SIDE VIEW
SEATING PLANE
DETAIL "X"
44X (0.50)
NOTES:
(6.80 SQ)
48X (0.25)
(5.30 SQ)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
48X (0.60)
TYPICAL RECOMMENDED LAND PATTERN
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7.
1
Reference document: JEDEC MO220.