Plastic Packages for Integrated Circuits Package Outline Drawing L48.7x7C 48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN) Rev 0, 1/08 7.00 EXPOSED PAD AREA A Z B X 6.75 48 48 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA 1 6.75 7.00 REF (4X) 1 7.00 (44X 0.50) 4 0.23 0.15 (4X) (48X 0.40 ± 0.1mm) TOP VIEW 0.100 4.10 REF (4X) C A B BOTTOM VIEW 11°±1° ALL AROUND Y PACKAGE OUTLINE 6.75 7.00 4.10 SIDE VIEW (44x 0.50) 7.00 R0.200 0.450 (48x 0.23) (48x 0.20) C0.400X45°X (4X) AR 25 ) O U ND ) (48x 0.60) (0 .1 TYPICAL RECOMMENDED LAND PATTERN L (A LL R0.200 TYP. 1 R0.200 MAX ALL AROUND 0.100 C 48 DETAIL "Z" DETAIL "X" R0.115 TYP. 0.65 0.85 NOTES: 1. 0.19~ 0.245 SEATING PLANE 0.080 C 0.025 ± 0.02 e b 0.100 C A B 0.050 C DETAIL "Y" C Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to JESD-MO220. 3. Unless otherwise specified, tolerance : Decimal ± 0.05, body tolerance ± 0.1 4. Dimension b applies to the metallized terminal and is measured between 0.18mm and 0.28mm from the terminal tip. Frame base metal thickness 0.203mm. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1