TQFP datasheet

TQFP
A JCET Company
Thin Profile Quad Flat Pack: TQFP, TQFP-ep
HIGHLIGHTS
• 10 x 10mm to 16 x 16mm
• 44 to 144 lead count
• Lead pitch range from 0.50mm to 0.40mm
FEATURES
• Body Sizes: 10 x 10mm to 16 x 16mm
• Package Height: 1.0mm • Lead Counts: 44L to 144L • Lead Pitch: 0.50mm to 0.40mm
• Available in gold or copper wirebond versions
• Limited number of open tool leadframe and die pad sizes available
• JEDEC standard compliant
• Lead-free, Green and Low Alpha materials sets available
APPLICATIONS
• ASIC
• DSP
• Gate Array
• Logic/Microprocessors/Controllers
• Multimedia, PC Chipsets
www.cj-elec.com www.statschippac.com
DESCRIPTION
The Thin Profile Quad Flat Pack (TQFP) belongs to STATS ChipPAC’s QFP
family. At 1.0mm body thickness, the TQFP is the thinnest package in
the QFP family. This thin package is made possible by a well controlled
low loop wire bonding process and package warpage control during
the molding process. TQFP is suitable for mainstream cost sensitive
applications where thickness and weight are premium. STATS ChipPAC also offers the TQFP in an Exposed Pad configuration
(TQFP-ep). This is a thermally enhanced version of the TQFP package.
Thermal enhancement is achieved by means of an exposed die pad,
which can be soldered to a mother PC board for effective heat removal
and grounding, if needed. This enhanced thermal package is made
possible by a deep downset die pad leadframe design.
TQFP
A JCET Company
Thin Profile Quad Flat Pack: TQFP, TQFP-ep
SPECIFICATIONS
RELIABILITY
Die Thickness
Wire
Lead Finish
Marking
Packing Options
Moisture Sensitivity Level
Temperature Cycling
High Temperature Storage
Pressure Cooker Test
Liquid Thermal Shock (opt)
230-280µm (9-11mils) range preferred
Gold: 18 -30µm (0.7-1.2mils) diameter Copper: 18 -30µm (0.7-1.2mils) diameter
Contact STATS ChipPAC for availability
Matte Tin
Laser
JEDEC tray/tape and reel
JEDEC Level 3
-65°C/150°C, 1000 cycles
150°C, 500 hrs
121°C 100% RH, 2 atm, 168 hrs
-55°C/125°C, 1000 cycles
TQFP THERMAL PERFORMANCE, θja (°C/W) Package
100L
Body Size (mm)
14 x 14 x 1.0
Pad Size (mm)
9.0 x 9.0
Die Size (mm)
7.8 x 7.8
Thermal Performance, θja (°C/W)
38.6
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
TQFP-ep THERMAL PERFORMANCE, θja (°C/W) Package
80L
Body Size (mm)
12 x 12 x 1.0
Pad Size (mm)Die Size (mm)
7.2 x 7.2
6.0 x 6.0
PCB Vias
36
Thermal Performance, θja (°C/W)
23.0
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
ELECTRICAL PERFORMANCE
Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design to provide the best
prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire.
Conductor
Length
Resistance
Inductance
Inductance
Capacitance
Capacitance
Component
(mm)
(mOhms)
(nH)
Mutual (nH)
(pF)
Mutual (pF)
Wire 2
120
1.65
0.45 - 0.85
0.10
0.01 - 0.02
Lead (14 x 14mm, 128L)
3.0 - 4.5
24.0 - 36.0 1.96 - 2.92
1.08 - 1.61
0.45 - 0.67
0.20 - 0.30
Total (14 x 14mm, 128L)
144.0 - 156.0
3.61 - 4.57
1.53 - 2.46
0.55 - 0.77
0.21 - 0.32
CROSS-SECTION
PACKAGE CONFIGURATIONS
Package
TQFP
TQFP
TQFP-ep
TQFP-ep
Corporate Office
Global Offices
Size (mm)
10 x 10
12 x 12
14 x 14
16 x 16
10 x 10
12 x 12
14 x 14
16 x 16
Lead Count
44
80
128
144
44
80
128
144
10 Ang Mo Kio St. 65, #04-08/09 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
USA 510-979-8000
CHINA 86-21-5976-5858
KOREA 82-32-340-3114
SWITZERLAND 41-21-8047-200
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Pte. Ltd. Trademark registered in United States. Singapore company registration number 199407932D. All other product names and other company names herein are for identification purposes
only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such
information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right
to change the information at any time and without notice.
©Copyright 2016. STATS ChipPAC Pte. Ltd. All rights reserved.
Apr 2016