TQFP A JCET Company Thin Profile Quad Flat Pack: TQFP, TQFP-ep HIGHLIGHTS • 10 x 10mm to 16 x 16mm • 44 to 144 lead count • Lead pitch range from 0.50mm to 0.40mm FEATURES • Body Sizes: 10 x 10mm to 16 x 16mm • Package Height: 1.0mm • Lead Counts: 44L to 144L • Lead Pitch: 0.50mm to 0.40mm • Available in gold or copper wirebond versions • Limited number of open tool leadframe and die pad sizes available • JEDEC standard compliant • Lead-free, Green and Low Alpha materials sets available APPLICATIONS • ASIC • DSP • Gate Array • Logic/Microprocessors/Controllers • Multimedia, PC Chipsets www.cj-elec.com www.statschippac.com DESCRIPTION The Thin Profile Quad Flat Pack (TQFP) belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP is the thinnest package in the QFP family. This thin package is made possible by a well controlled low loop wire bonding process and package warpage control during the molding process. TQFP is suitable for mainstream cost sensitive applications where thickness and weight are premium. STATS ChipPAC also offers the TQFP in an Exposed Pad configuration (TQFP-ep). This is a thermally enhanced version of the TQFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding, if needed. This enhanced thermal package is made possible by a deep downset die pad leadframe design. TQFP A JCET Company Thin Profile Quad Flat Pack: TQFP, TQFP-ep SPECIFICATIONS RELIABILITY Die Thickness Wire Lead Finish Marking Packing Options Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test Liquid Thermal Shock (opt) 230-280µm (9-11mils) range preferred Gold: 18 -30µm (0.7-1.2mils) diameter Copper: 18 -30µm (0.7-1.2mils) diameter Contact STATS ChipPAC for availability Matte Tin Laser JEDEC tray/tape and reel JEDEC Level 3 -65°C/150°C, 1000 cycles 150°C, 500 hrs 121°C 100% RH, 2 atm, 168 hrs -55°C/125°C, 1000 cycles TQFP THERMAL PERFORMANCE, θja (°C/W) Package 100L Body Size (mm) 14 x 14 x 1.0 Pad Size (mm) 9.0 x 9.0 Die Size (mm) 7.8 x 7.8 Thermal Performance, θja (°C/W) 38.6 Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2. TQFP-ep THERMAL PERFORMANCE, θja (°C/W) Package 80L Body Size (mm) 12 x 12 x 1.0 Pad Size (mm)Die Size (mm) 7.2 x 7.2 6.0 x 6.0 PCB Vias 36 Thermal Performance, θja (°C/W) 23.0 Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2. ELECTRICAL PERFORMANCE Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Length Resistance Inductance Inductance Capacitance Capacitance Component (mm) (mOhms) (nH) Mutual (nH) (pF) Mutual (pF) Wire 2 120 1.65 0.45 - 0.85 0.10 0.01 - 0.02 Lead (14 x 14mm, 128L) 3.0 - 4.5 24.0 - 36.0 1.96 - 2.92 1.08 - 1.61 0.45 - 0.67 0.20 - 0.30 Total (14 x 14mm, 128L) 144.0 - 156.0 3.61 - 4.57 1.53 - 2.46 0.55 - 0.77 0.21 - 0.32 CROSS-SECTION PACKAGE CONFIGURATIONS Package TQFP TQFP TQFP-ep TQFP-ep Corporate Office Global Offices Size (mm) 10 x 10 12 x 12 14 x 14 16 x 16 10 x 10 12 x 12 14 x 14 16 x 16 Lead Count 44 80 128 144 44 80 128 144 10 Ang Mo Kio St. 65, #04-08/09 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 CHINA 86-21-5976-5858 KOREA 82-32-340-3114 SWITZERLAND 41-21-8047-200 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Pte. Ltd. Trademark registered in United States. Singapore company registration number 199407932D. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. ©Copyright 2016. STATS ChipPAC Pte. Ltd. All rights reserved. Apr 2016