Plastic Packages for Integrated Circuits Package Outline Drawing M28.173 28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 1, 5/10 A 9.70± 0.10 1 3 SEE DETAIL "X" 15 28 6.40 PIN #1 I.D. MARK 4.40 ± 0.10 2 3 0.20 C B A 1 14 0.15 +0.05 -0.06 B 0.65 TOP VIEW END VIEW 1.00 REF H - 0.05 0.90 +0.15 -0.10 C GAUGE PLANE 1.20 MAX SEATING PLANE +0.05 0.25 5 -0.06 0.10 M C B A 0.10 C 0.25 0°-8° 0.05 MIN 0.15 MAX 0.60 ±0.15 SIDE VIEW DETAIL "X" (1.45) NOTES: 1. Dimension does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. (5.65) 2. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. 3. Dimensions are measured at datum plane H. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. 5. Dimension does not include dambar protrusion. Allowable protrusion shall be 0.08mm total in excess of dimension at maximum material condition. Minimum space between protrusion and adjacent lead (0.35 TYP) (0.65 TYP) TYPICAL RECOMMENDED LAND PATTERN is 0.07mm. 6. Dimension in ( ) are for reference only. 7. Conforms to JEDEC MO-153. 1