;6 21 BGU8103 SiGe:C low-noise amplifier MMIC for GPS, GLONASS, Galileo and COMPASS Rev. 2 — 25 March 2016 Product data sheet 1. General description The BGU8103 is an ultra low current and Low-Noise Amplifier (LNA) for GNSS receiver applications, available in a small plastic 6-pin extremely thin leadless package. The BGU8103 requires only one external matching inductor. The BGU8103 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for ultra low power consumption and optimal performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels, it delivers 17.5 dB gain at a noise figure of 0.80 dB and a supply current of 1.2 mA. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity. 2. Features and benefits Optimized performance at a low supply current of 1.2 mA Covers full GNSS L1 band, from 1559 MHz to 1610 MHz Noise figure = 0.80 dB Gain 17.5 dB Input 1 dB compression point of 16 dBm Out of band IP3i of 8 dBm Supply voltage 1.5 V to 3.1 V Self-shielding package concept Integrated supply decoupling capacitor Power-down mode current consumption < 1 A Integrated temperature stabilized bias for easy design Requires only one input matching inductor Integrated DC blocking at both RF input and output ESD protection on all pins (HBM > 2 kV) Integrated matching for the output Available in a 6-pin leadless package 1.1 mm 0.7 mm 0.37 mm; 0.4 mm pitch: SOT1232 180 GHz transit frequency - SiGe:C technology Moisture sensitivity level 1 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS 3. Applications Smart phones Feature phones Tablets Digital still cameras Digital video cameras RF front-end modules Complete GNSS modules Personal health applications 4. Quick reference data Table 1. Quick reference data f = 1575 MHz; VCC = 1.8 V; VI(ENABLE) 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 12 nH inductor; see Figure 3; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage RF input AC coupled 1.5 - 3.1 V ICC supply current Pi < 40 dBm 0.8 1.2 1.6 mA Gp power gain no jammer NF noise figure Pi = 40 dBm; no jammer Pi(1dB) input power at 1 dB gain compression IP3i input third-order intercept point [1] PCB losses are subtracted. [2] Guaranteed by device design; not tested in production. [3] f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm at f1; Pi = 65 dBm at f2. 14.5 17.5 20.0 dB - 0.8 1.4 dB [2] 19 16 - dBm [2][3] 11 8 - dBm [1][2] 5. Ordering information Table 2. Ordering information Type number Package Name Description Version BGU8103 XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1.1 0.7 0.37 mm SOT1232 6. Marking Table 3. Marking codes Type number Marking code BGU8103 G BGU8103 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS 7. Block diagram 9&& (1$%/( %,$6&21752/ 5)B,1 5)B287 DDD Fig 1. Block diagram 8. Pinning information 8.1 Pinning %*8 *1'B5) 5)B287 5)B,1 9&& (1$%/( *1' 7UDQVSDUHQWWRSYLHZ DDD Fig 2. BGU8103 Product data sheet Pin configuration All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS 8.2 Pin description Table 4. Pin description Symbol Pin Description GND 1 ground VCC 2 supply voltage RF_OUT 3 RF output GND_RF 4 ground RF RF_IN 5 RF input ENABLE 6 enable 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). See Section 18.3 “Disclaimers”, paragraph “Limiting values”. Symbol Parameter Conditions supply voltage VCC VI(ENABLE) RF input AC coupled input voltage on pin ENABLE VI(ENABLE) < VCC + 0.6 V Min Max Unit [1] 0.5 +5.0 V [1][2] 0.5 +5.0 V 0.5 +5.0 V 0.5 +5.0 V - 10 dBm - 55 mW VI(RF_IN) input voltage on pin RF_IN DC; VI(RF_IN) < VCC + 0.6 V [1][2][3] VI(RF_OUT) input voltage on pin RF_OUT DC; VI(RF_OUT) < VCC + 0.6 V [1][2][3] Pi input power Ptot total power dissipation [1] Tsp 130 C Tstg storage temperature 65 +150 C Tj junction temperature - 150 C VESD electrostatic discharge voltage Human Body Model (HBM) according to JEDEC standard JS-001-2010 - 2 kV Charged Device Model (CDM) according to JEDEC standard JESD22-C101C - 2 kV [1] Stressed with pulses of 200 ms in duration, with application circuit as in Figure 3. [2] Warning: Due to internal ESD diode protection, to avoid excess current, the applied DC voltage must not exceed VCC + 0.6 V or 5.0 V. [3] The RF input and RF output are AC coupled through internal DC blocking capacitors. 10. Recommended operating conditions Table 6. Operating conditions Symbol Parameter VCC supply voltage 1.5 - Tamb ambient temperature 40 +25 +85 VI(ENABLE) input voltage on pin ENABLE BGU8103 Product data sheet Conditions Min Typ Max Unit 3.1 V C OFF state - - 0.3 V ON state 0.8 - - V All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS 11. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Rth(j-sp) thermal resistance from junction to solder point Typ Unit 225 K/W 12. Characteristics Table 8. Characteristics at VCC = 1.8 V f = 1575 MHz; VCC = 1.8 V; VI(ENABLE) 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 12 nH inductor; see Figure 3; unless otherwise specified. Symbol Parameter Conditions ICC supply current VI(ENABLE) 0.8 V power gain Gp RLin RLout input return loss output return loss ISL isolation NF noise figure Min Typ Max Unit Pi < 40 dBm 0.8 1.2 1.6 mA Pi = 20 dBm - 2.5 - mA VI(ENABLE) 0.3 V - - 1 A no jammer 14.5 17.5 20.0 dB Pjam = 20 dBm; fjam = 850 MHz - 18.5 - dB Pjam = 20 dBm; fjam = 1850 MHz - 18.0 - dB Pi < 40 dBm - 8 - dB Pi = 20 dBm - 9 - dB Pi < 40 dBm - 11 - dB Pi = 20 dBm - 11 - dB - 35 - dB Pi = 40 dBm; no jammer [1][2] - 0.8 1.4 dB Pi = 40 dBm; no jammer [2][3] - 0.9 1.5 dB Pjam = 20 dBm; fjam = 850 MHz [3] - 1.1 - dB Pjam = 20 dBm; fjam = 1850 MHz [3] - 1.4 - dB [2] 19 16 - dBm 11 8 - dBm - 72 - dBm Pi(1dB) input power at 1 dB gain compression IP3i input third-order intercept point IMD3 third-order intermodulation distortion output referred ton turn-on time time from VI(ENABLE) ON to 90 % of the gain - - 2 s toff turn-off time time from VI(ENABLE) OFF to 10 % of the gain - - 1 s [2][4] [1] PCB losses are subtracted. [2] Guaranteed by device design; not tested in production. [3] Including PCB losses. [4] f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm at f1; Pi = 65 dBm at f2. BGU8103 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 [4] © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS Table 9. Characteristics at VCC = 2.85 V f = 1575 MHz; VCC = 2.85 V; VI(ENABLE) 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 12 nH inductor; see Figure 3; unless otherwise specified. Symbol Parameter Conditions ICC supply current VI(ENABLE) 0.8 V power gain Gp RLin RLout input return loss output return loss ISL isolation NF noise figure Min Typ Max Unit Pi < 40 dBm 0.8 1.2 1.6 mA Pi = 20 dBm - 2.5 - mA VI(ENABLE) 0.3 V - - 1 A no jammer 15.0 17.5 20.0 dB Pjam = 20 dBm; fjam = 850 MHz - 18.5 - dB Pjam = 20 dBm; fjam = 1850 MHz - 18.5 - dB Pi < 40 dBm - 8 - dB Pi = 20 dBm - 9 - dB Pi < 40 dBm - 11 - dB Pi = 20 dBm - 11 - dB - 35 - dB Pi = 40 dBm; no jammer [1][2] - 1.0 1.4 dB Pi = 40 dBm; no jammer [2][3] - 1.1 1.5 dB Pjam = 20 dBm; fjam = 850 MHz [3] - 1.1 - dB Pjam = 20 dBm; fjam = 1850 MHz [3] - 1.4 - dB [2] 16 13 - dBm 10 7 - dBm Pi(1dB) input power at 1 dB gain compression IP3i input third-order intercept point IMD3 third-order intermodulation distortion output referred ton turn-on time toff turn-off time [2][4] - 72 - dBm time from VI(ENABLE) ON to 90 % of the gain - - 2 s time from VI(ENABLE) OFF to 10 % of the gain - - 1 s [1] PCB losses are subtracted. [2] Guaranteed by device design; not tested in production. [3] Including PCB losses. [4] f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm at f1; Pi = 65 dBm at f2. BGU8103 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 [4] © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS 13. Application information 13.1 GNSS LNA 9HQ 9FF 5)LQ & / ,& 5)RXW DDD For a list of components, see Table 10. Fig 3. Schematics GNSS LNA evaluation board Table 10. List of components For schematics, see Figure 3. BGU8103 Product data sheet Component Description Value Remarks C1 decoupling capacitor 1 nF to suppress power supply noise IC1 BGU8103 - NXP Semiconductors L1 high-quality matching inductor 12 nH Murata LQW15A All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS 14. Package outline ;621SODVWLFH[WUHPHO\WKLQVPDOORXWOLQHSDFNDJHQROHDGVWHUPLQDOVERG\[[PP î $ ' 627 H H ( Y H $ % Eî SLQ LQGH[DUHD SLQ LQGH[DUHD $ % \ Y $ % / î \ & $ & î PP VFDOH 'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP $ $ ' ( PLQ QRP PD[ H H E / 9 < < 1RWH 'LPHQVLRQ$LVLQFOXGLQJSODWLQJWKLFNQHVV 2XWOLQH YHUVLRQ VRWBSR 5HIHUHQFHV ,(& -('(& -(,7$ ,VVXHGDWH 627 Fig 4. (XURSHDQ SURMHFWLRQ Package outline SOT1232 (XSON6) BGU8103 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS 15. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 16. Abbreviations Table 11. Abbreviations Acronym Description ESD ElectroStatic Discharge GLONASS GLObal NAvigation Satellite System GNSS Global Navigation Satellite System GPS Global Positioning System HBM Human Body Model LNA Low-Noise Amplifier MMIC Monolithic Microwave Integrated Circuit PCB Printed-Circuit Board SiGe:C Silicon Germanium Carbon 17. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes BGU8103 v.2 20160325 Product data sheet - BGU8103 v.1 Modifications: BGU8103 v.1 BGU8103 Product data sheet • Data sheet status changed from Preliminary data sheet to Product data sheet 20151221 Preliminary data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 - © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BGU8103 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGU8103 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 12 BGU8103 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS 20. Contents 1 2 3 4 5 6 7 8 8.1 8.2 9 10 11 12 13 13.1 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 7 GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Handling information. . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 25 March 2016 Document identifier: BGU8103