Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x2B 8 LEAD MICRO THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (µTDFN) WITH E-PAD Rev 1, 5/15 2.00 A 6 PIN #1 INDEX AREA B 6 PIN 1 INDEX AREA 8 1 0.50 2.00 1.60±0.050 EXP. DAP (4X) 0.15 0.10 M C A B 0.25±0.050 ( 8x0.30 ) 0.90±0.050 EXP. DAP TOP VIEW BOTTOM VIEW SEE DETAIL "X" ( 8x0.20 ) PACKAGE OUTLINE 0.10 C 0 . 55 MAX ( 8x0.30 ) C BASE PLANE SEATING PLANE SIDE VIEW ( 6x0.50 ) 1.60 2.00 C ( 8x0.25 ) 0.08 0 . 2 REF 0.90 0 . 00 MIN. 2.00 0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. C