Plastic Packages for Integrated Circuits Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) L12.2.2x1.4A D 6 INDEX AREA 2X A B 12 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS N E 0.10 C 1 2X 2 0.10 C MIN NOMINAL A 0.45 A1 - A3 TOP VIEW 0.10 C C A1 A SYMBOL 0.05 C LEADS COPLANARITY SIDE VIEW MAX NOTES 0.50 0.55 - - 0.05 - 0.127 REF - b 0.15 0.20 0.25 5 D 2.15 2.20 2.25 - E 1.35 1.40 1.45 - e 0.40 BSC - k 0.20 - - - L 0.35 0.40 0.45 - N 12 2 Nd 3 3 Ne 3 3 θ 0 - 12 4 Rev. 0 12/06 NOTES: (DATUM A) 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. PIN #1 ID 1 2. N is the number of terminals. NX L 2 3. Nd and Ne refer to the number of terminals on D and E side, respectively. e Ne 4. All dimensions are in millimeters. Angles are in degrees. (DATUM B) NX b 5 0.10 M C A B 0.05 M C Nd 3 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. 8. Maximum allowable burrs is 0.076mm in all directions. BOTTOM VIEW 9. Same as JEDEC MO-255UABD except: No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm "L" MAX dimension = 0.45 not 0.42mm. CL NX (b) 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. (A1) L 5 1.50 e SECTION "C-C" C C TERMINAL TIP 2.30 1 2 0.40 3 0.45 (12x) 0.25 (12x) 0.40 TYPICAL RECOMMENDED LAND PATTERN 1 10