Plastic Packages for Integrated Circuits Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) D L16.2.6x1.8A B 16 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS 6 INDEX AREA 2X A N SYMBOL E 0.10 C 1 2 2X MIN NOMINAL MAX NOTES A 0.45 0.50 0.55 - A1 - - 0.05 - 0.10 C A3 TOP VIEW 0.10 C C A 0.05 C 0.127 REF - b 0.15 0.20 0.25 5 D 2.55 2.60 2.65 - E 1.75 1.80 1.85 - e 0.40 BSC - SEATING PLANE A1 SIDE VIEW K 0.15 - - - L 0.35 0.40 0.45 - L1 0.45 0.50 0.55 - N 16 2 Nd 4 3 Ne 4 3 e PIN #1 ID K 1 2 NX L L1 θ NX b 5 16X 0.10 M C A B 0.05 M C (DATUM B) (DATUM A) BOTTOM VIEW 0 - 12 4 Rev. 6 1/14 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on D and E side, respectively. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.25mm from the terminal tip. CL (A1) NX (b) L 5 e SECTION "C-C" 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. TERMINAL TIP C C 8. Maximum allowable burrs is 0.076mm in all directions. 9. JEDEC Reference MO-255. 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. 3.00 1.80 1.40 1.40 2.20 0.90 0.40 0.20 0.50 0.20 0.40 10 LAND PATTERN 1