Plastic Packages for Integrated Circuits Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN) A E L6.1.2x1.0A B 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS PIN 1 REFERENCE 2X 0.10 C 2X D 0.10 C SYMBOL MIN NOMINAL MAX NOTES A 0.45 0.50 0.55 - A1 - - 0.05 - 0.127 REF A3 TOP VIEW - b 0.15 0.20 0.25 5 D 0.95 1.00 1.05 - E 1.15 1.20 1.25 - DETAIL A 0.10 C A 7X 0.08 C e A1 A3 SIDE VIEW C SEATING PLANE 4X e DETAIL B 1 5X L 3 0.40 BSC - L 0.30 0.35 0.40 - L1 0.40 0.45 0.50 - N 6 2 Ne 3 3 θ 0 - 12 4 L1 Rev. 2 8/06 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 6 4 BOTTOM VIEW b 6X 0.10 C A B 0.05 C NOTE 3 2. N is the number of terminals. 3. Ne refers to the number of terminals on E side. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 0.1x45° CHAMFER 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. 8. Maximum allowable burrs is 0.076mm in all directions. 9. JEDEC Reference MO-255. A3 A1 DETAIL A DETAIL B PIN 1 LEAD 1.00 1.40 0.20 0.30 0.45 0.35 0.20 0.40 LAND PATTERN 1 10 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389.