T PL IA N M CO *R oH S Features Applications ■ RoHS compliant* ■ AC operated products ■ Low power loss and high efficiency ■ Computer monitors ■ High current capability ■ Set top boxes ■ Low profile package ■ Cable modems CD2320-B1200~B11000 Surface Mount Bridge Rectifier Diode General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Bridge Rectifier Diodes for rectification applications in compact chip package 2320 size format, which offers PCB real estate savings and are considerably smaller than most competitive parts. The Bridge Rectifier Diodes offer a forward current of 1 A with a choice of repetitive peak reverse voltages between 200 V and 1000 V. Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current (TA = 55 °C) DC Reverse Current @ Rated DC Blocking Voltage (TJ = 25 °C) DC Reverse Current @ Rated DC Blocking Voltage (TJ = 150 °C) Typical Junction Capacitance 1 Maximum Instantaneous Forward Voltage @1A Typical Thermal Resistance 1 Peak Forward Surge Current 8.3 ms Single Half Sine-Wave Superimposed on Rated Load (JEDEC Method) B1200 B1400 CD2320B1600 B1800 B11000 VRRM 200 400 600 800 1000 V VRMS VDC 140 200 280 400 420 600 560 800 700 1000 V V Symbol Unit I(AV) 1.0 A IR 5 μA IR 200 μA CJ 25 pF VF 1 V RƟJL 110 °C/W IFSM 30 A Notes: 1 Measured @ 1.0 MHz and applied reverse voltage of 4.0 VDC. 2 Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 ˝ x 0.2 ˝ (5.0 mm x 5.0 mm) copper pad areas. Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Operating Temperature Range Storage Temperature Range Symbol TJ TSTG CD2320-B1200-B11000 -55 to +175 -55 to +175 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Unit °C °C CD2320-B1200~B11000 Surface Mount Bridge Rectifier Diode Product Dimensions This is a lead free product, packaged with FRP substrate and is epoxy underfilled. The terminals are pure tin plated (lead free) and are solderable per MIL-STD-750, Method 2026. The package weighs approximately 0.07 g. The package and dimensions are shown below. A Dimensions B F TOP VIEW C MM DIMENSIONS: (INCHES) D A 5.20 - 5.40 (0.205 - 0.213) B 4.10 - 4.30 (0.161 - 0.169) C 5.70 - 5.90 (0.224 - 0.232) D 1.00 - 1.20 (0.039 - 0.047) E 0.85 - 0.95 (0.033 - 0.037) F 0.86 - 1.16 (0.0338 - 0.0457) E Recommended Footprint How to Order CD 2320 - B 1 800 4.10 ± 0.1 (0.161 ± 0.004) Common Code Chip Diode Package 2320 = 23 ˝ x 20 ˝ Model B = Schottky Rectifier Series Current 1=1A 5.72 ± 0.1 (0.225 ± 0.004) Working Peak Reverse Voltage 800 = 800 VRWM (Volts) Typical Part Marking MANUFACTURER'S TRADEMARK 1.10 ± 0.1 (0.043 ± 0.004) 1.5 ± 0.1 (0.059 ± 0.004) FORWARD CURRENT x 100 mA VRMS = 800 V MM DIMENSIONS: (INCHES) DATE CODE Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CD2320-B1200~B11000 Surface Mount Bridge Rectifier Diode Rating and Characteristic Curves Maximum Non-Repetitive Peak Forward Surge Current 1.2 Peak Forward Surge Current (Amps) Average Forward Rectified Current (Amps) Forward Current Derating Curve 1.0 0.8 0.6 0.4 0.2 60 Hz Resistive or Inductive Load 0 0 25 50 75 100 125 40 35 30 25 20 15 10 Pulse Width 8.3 ms Single Half Sine-Wave (JEDEC Method) 5 0 150 175 10 1 Ambient Temperature (°C) Forward Characteristics Reverse Characteristics 100 Instantaneous Reverse Current (mA) 10.00 Instantaneous Forward Current (Amps) 100 Number of Cycles at 60 Hz 1.00 0.10 TJ = 100 °C 10.0 1.0 TJ = 25 °C 0.10 TJ = 25 °C Pulse Width = 300 µS 0.01 0.2 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 20 40 60 80 Typical Junction Capacitance Junction Capacitance (pF) 100 TJ = 25 °C 10 1 0.1 0.2 0.4 1.0 2 4 10 Reverse Voltage (Volts) 20 100 120 Percent of Rated Peak Reverse Voltage (%) Instantaneous Forward Voltage (Volts) 40 100 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 140 CD2320-B1200~B11000 Surface Mount Bridge Rectifier Diode Packaging Information The surface mount product is packaged in a 12 mm x 8 mm tape and reel format per EIA-481 standard. P 0 P 1 d T E Index Hole 120 ° F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... ....... ....... Leader ....... ....... W1 Start DIMENSIONS: MM (INCHES) 10 pitches (min.) 10 pitches (min.) Direction of Feed Item Symbol 2320 Carrier Width A 5.90 ± 0.10 (0.232 ± 0.004) Carrier Length B 6.50 ± 0.10 (0.256 ± 0.004) Carrier Depth C 1.50 ± 0.10 (0.059 ± 0.004) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 330 (12.992) Reel Inner Diameter D1 Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 5.50 ± 0.05 (0.217 ± 0.002) Punch Hole Pitch P 8.00 ± 0.10 (0.315 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.10 (0.008 ± 0.004) Tape Width W 12.00 ± 0.20 (0.472 ± 0.008) Reel Width W1 Quantity per Reel -- 50.0 MIN. (1.969) 18.7 MAX. (0.736) 5,000 REV. 08/13 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.