MATERIAL DECLARATION SHEET Material Number P6SMB6.8A ~ 440A, 6.8CA ~ 120CA Product Line Semiconductors Compliance Date 2015/04/08 RoHS Compliant No. Yes Construction Element(subpart) MSL 1 Homogeneous Material Material weight [mg] 1 Dice Silicon 2.350 2 High-melting point Solder paste solder paste 2.150 3 Lead frame / Leads / Disc Copper alloy 33.50 4 Molding Compound Epoxy material 53.50 5 Plating Matte-Tin Total Weight 1.011 92.511 This Document was updated on: Homogeneous Material\ Substances Silicon Phosphorous Boron Nickel Lead glass Silicon dioxide Aluminum oxide Tin Lead Silver Copper Iron Phosphorus Silica Silicon Epoxy resin Phenolic resin-A,B Aluminum hydroxide Carbon black Tin applicable Materials Mass % 7440-21-3 7723-14-0 7440-42-8 7440-02-0 7439-92-1 7631-86-9 1344-28-1 7440-31-5 7439-92-1 7440-22-4 7440-50-8 7439-89-6 7723-14-0 14808-60-7 25928-94-3 9003-35-4 21645-51-2 1333-86-4 7440-31-5 60.1800% 0.0100% 0.0100% 14.8000% 12.5000% 10.0000% 2.5000% 5.000% 92.500% 2.500% 99.800% 0.150% 0.050% 76.000% 9.000% 8.000% 6.000% 1.000% 100.000% CASRN if Material Mass % of total unit wt. 1.529% 0.0003% 0.0003% 0.376% 0.318% 0.254% 0.0635% 0.116% 2.150% 0.058% 36.139% 0.054% 0.018% 43.952% 5.205% 4.626% 3.470% 0.578% 1.093% Subpart mass of total wt. (%) 2.540% 2.324% 36.212% 57.831% 1.093% 2015/04/08 (EU) RoHS Directive 2011/65/EU ANNEX - Application of lead which are exempted from the requirements: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead), and; 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1