P6SMB6.8A~440A, P6SMB6.8CA~120CA

MATERIAL DECLARATION SHEET
Material Number
P6SMB6.8A ~ 440A, 6.8CA ~ 120CA
Product Line
Semiconductors
Compliance Date
2015/04/08
RoHS Compliant
No.
Yes
Construction
Element(subpart)
MSL
1
Homogeneous Material
Material
weight [mg]
1
Dice
Silicon
2.350
2
High-melting point
Solder paste
solder paste
2.150
3
Lead frame / Leads /
Disc
Copper alloy
33.50
4
Molding Compound
Epoxy material
53.50
5
Plating
Matte-Tin
Total Weight
1.011
92.511
This Document was updated on:
Homogeneous
Material\
Substances
Silicon
Phosphorous
Boron
Nickel
Lead glass
Silicon dioxide
Aluminum oxide
Tin
Lead
Silver
Copper
Iron
Phosphorus
Silica Silicon
Epoxy resin
Phenolic resin-A,B
Aluminum hydroxide
Carbon black
Tin
applicable
Materials
Mass %
7440-21-3
7723-14-0
7440-42-8
7440-02-0
7439-92-1
7631-86-9
1344-28-1
7440-31-5
7439-92-1
7440-22-4
7440-50-8
7439-89-6
7723-14-0
14808-60-7
25928-94-3
9003-35-4
21645-51-2
1333-86-4
7440-31-5
60.1800%
0.0100%
0.0100%
14.8000%
12.5000%
10.0000%
2.5000%
5.000%
92.500%
2.500%
99.800%
0.150%
0.050%
76.000%
9.000%
8.000%
6.000%
1.000%
100.000%
CASRN if
Material Mass
% of total unit
wt.
1.529%
0.0003%
0.0003%
0.376%
0.318%
0.254%
0.0635%
0.116%
2.150%
0.058%
36.139%
0.054%
0.018%
43.952%
5.205%
4.626%
3.470%
0.578%
1.093%
Subpart mass
of total wt. (%)
2.540%
2.324%
36.212%
57.831%
1.093%
2015/04/08
(EU) RoHS Directive 2011/65/EU ANNEX - Application of lead which are exempted from the requirements:
7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead), and;
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound.
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