ISL54227 Features The Intersil ISL54227 is a single supply, dual SPST (Single Pole/Single Throw) switch that is configured as a DPST. It can operate from a single 2.7V to 5.25V supply. The part was designed for switching or isolating a USB high-speed source or a USB high-speed and full-speed source in portable battery powered products. • High-Speed (480Mbps) and Full-Speed (12Mbps) Signaling Capability per USB 2.0 The 3.5Ω SPST switches were specifically designed to pass USB full speed and USB high speed data signals. They have high bandwidth and low capacitance to pass USB high speed data signals with minimal distortion.The device has two logic control input pins (OE and LP) to control the SPST switches. The ISL54227 has OVP detection circuitry on the COM pins to open the SPST switches when the voltage at these pins exceeds 3.8V or goes negative by -0.45V. It isolates fault voltages up to +5.25V or down to -5V from getting passed to the other side of the switch, thereby protecting the USB down-stream transceiver. It has an alarm indicator output pin (ALM) to indicate when the part is in the overvoltage condition. The part has an interrupt (INT) output pin to indicate a 1 to 1 (high/high) state on the COM lines to inform the µprocessor when entering a dedicated charging port mode of operation. • 1.8V Logic Compatible (2.7V to +3.6V supply) • Alarm Overvoltage Indicator Output • Charger Interrupt Indicator Output • Low Power State • Power OFF Protection • COM Pins Overvoltage Detection and Protection for +5.25V and -5V Fault Voltages • -3dB Frequency . . . . . . . . . . . . . . . . . . . . 790MHz • Low ON Capacitance @ 240MHz . . . . . . . . . . . . 2pF • Low ON-Resistance . . . . . . . . . . . . . . . . . . . . 3.5Ω • Single Supply Operation (VDD) . . . . . 2.7V to 5.25V • Available in µTQFN and TDFN Packages • Pb-Free (RoHS Compliant) • Compliant with USB 2.0 Short Circuit and Overvoltage Requirements without Additional External Components Applications*(see page 16) • MP3 and other Personal Media Players • Cellular/Mobile Phones, PDA’s The ISL54227 is available in 10 Ld 1.8mmx1.4mm µTQFN and 10 Ld 3mmx3mm TDFN packages. It operates over a temperature range of -40 to +85°C. • Digital Cameras and Camcorders Typical Application USB 2.0 HS Eye Pattern with Switches in the Signal Path 3.3V • USB Switching VDD INT USB CONNECTOR ALM LOGIC CONTROL VBUS D- LP OE D- COM- USB OVP D+ GND D+ COM+ ISL54227 µP HIGH-SPEED TRANSCEIVER VOLTAGE SCALE (0.1V/DIV) 500Ω GND TIME SCALE (0.2ns/DIV) July 2, 2010 FN7593.0 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2010. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL54227 High-Speed USB 2.0 (480Mbps) DPST Switch with Overvoltage Protection (OVP) and Dedicated Charger Port Detection ISL54227 Pin Configurations ISL54227 (10 LD 3X3 TDFN) TOP VIEW ISL54227 (10 LD 1.8X1.4 µTQFN) TOP VIEW D6 ALM 7 PD INT 1 OE 8 VDD 9 LP 2 5 COM- LOGIC OVP INT 10 4MΩ 4MΩ 4 GND 3 COM+ 10 VDD 4MΩ D+ 3 2 LP D+ 4MΩ 8 ALM COM+ 4 7 DOVP GND 5 1 9 OE LOGIC 6 COM- NOTE: 1. Switches Shown for OE = “0”. Pin Descriptions Truth Table INPUT PIN µTQFN TDFN NAME DESCRIPTION OUTPUT SIGNAL AT COM PINS LP USB Data Port 0V to 3.6V 0 COM+ USB Data Port 0V to 3.6V D-, OE D+ INT ALM STATE 0 OFF High High Normal 0 1 ON High High Normal 0V to 3.6V 1 0 OFF High High Low Power Overvoltage Range 3.65V to 5.25V -0.29V to -5V 0 1 OFF High Low OVP COM Pins Tied Together 0 0 OFF Low High Charger Port (CP) Charger Mode Interrupt Output COM Pins Tied Together 1 0 OFF Low High Charger Port (Low Power) Thermal Pad. Tie to Ground or Float Logic “0” when ≤ 0.5V, Logic “1” when ≥ 1.4V with a 2.7V to 3.6V Supply. 1 2 LP Low Power Input 2 3 D+ 3 4 4 5 GND 5 6 COM- USB Data Port 6 7 D- 7 8 ALM 8 9 OE Switch Enable 9 10 VDD Power Supply 10 1 INT - PD PD Ground Connection USB Data Port OTV ALARM Interrupt Output TABLE 1. OVP TRIP POINT VOLTAGE SYSTEM VOLTAGE CONDITIONS TRIP POINT CODEC SUPPLY SWITCH SUPPLY (VDD) COMs SHORTED TO PROTECTED MIN MAX 2.7V to 3.3V 2.7V to 5.25V VBUS Yes 3.62V 3.95V 2.7V to 3.3V 2.7V to 5.25V -5V Yes -0.6V -0.29V 2 FN7593.0 July 2, 2010 ISL54227 Ordering Information PART NUMBER (Note 5) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # U1 -40 to +85 10 Ld 1.8 x 1.4mm µTQFN (Tape and Reel) L10.1.8x1.4A ISL54227IRUZ-T7A (Notes 2, 4) U1 -40 to +85 10 Ld 1.8 x 1.4mm µTQFN (Tape and Reel) L10.1.8x1.4A ISL54227IRTZ (Note 3) 4227 -40 to +85 10 Ld 3x3 TDFN L10.3x3A ISL54227IRTZ-T (Notes 2, 3) 4227 -40 to +85 10 Ld 3x3 TDFN (Tape and Reel) L10.3x3A ISL54227IRTZEVAL1Z Evaluation Board ISL54227IRUZ-T (Notes 2, 4) NOTES: 2. Please refer to TB347 for details on reel specifications. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 5. For Moisture Sensitivity Level (MSL), please see device information page for ISL54227. For more information on MSL please see techbrief TB363. 3 FN7593.0 July 2, 2010 ISL54227 Absolute Maximum Ratings Thermal Information VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 6.5V VDD to COMx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5V COMx to Dx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8.6V Input Voltages D+, D- . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V COM+, COM- . . . . . . . . . . . . . . . . . . . . . . . -5V to 6.5V OE, LP . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 6.5V Continuous Current (COM-/D-, COM+/D+) . . . . . . . ±40mA Peak Current (COM-/D-, COM+/D+) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA ESD Rating: Human Body Model (Tested per JESD22-A114-F). . . . >2kV Machine Model (Tested per JESD22-A115-A) . . . . . . >150V Charged Device Model (Tested per JESD22-C101-D) . >2kV Latch-up (Tested per JEDEC; Class II Level A) . . . . at +85°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 10 Ld µTQFN Package (Note 6, 9) . 210 165 10 Ld TDFN Package (Notes 7, 8). . 58 22 Maximum Junction Temperature (Plastic Package). . +150°C Maximum Storage Temperature Range. . . . . -65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Normal Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . VDD Supply Voltage Range . . . . . . . . . . . . Logic Control Input Voltage . . . . . . . . . . . Analog Signal Range, VDD = 2.7V to 5.25V . . . . -40°C to +85°C . 2.7V to 5.25V . . . 0V to 5.25V . . . . 0V to 3.6V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 8. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 9. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications - 2.7V to 5.25V Supply Test Conditions: VDD = +3.3V, GND = 0V, VLP = GND, VOEH = 1.4V, VOEL = 0.5V, (Note 10), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER TEST CONDITIONS TEMP MIN MAX (°C) (Notes 11, 12) TYP (Notes 11, 12) UNITS ANALOG SWITCH CHARACTERISTICS ON-Resistance, rON (High-Speed) VDD = 2.7V, OE = 1.4V, IDx = 17mA, VCOM+ or VCOM- = 0V to 400mV (see Figure 2, Note 15) rON Matching Between VDD = 2.7V, OE = 1.4V, IDx = 17mA, Channels, ΔrON (High-Speed) VCOM+ or VCOM- = Voltage at max rON, (Notes 14, 15) 25 - 3.5 5 Ω Full - - 7 Ω 25 - 0.2 0.45 Ω Full - - 0.55 Ω 25 - 0.26 1 Ω Full - - 1.2 Ω rON Flatness, RFLAT(ON) (High-Speed) VDD = 2.7V, OE = 1.4V, IDx = 17mA, VCOM+ or VCOM- = 0V to 400mV, (Notes 13, 15) ON-Resistance, rON VDD = 3.3V, OE = 1.4V, ICOMx = 17mA, VCOM+ or VCOM- = 3.3V (see Figure 2, Note 15) +25 - 6.8 17 Ω Full - - 22 Ω VDD = 5.25V, OE = 0V, VDx = 0.3V, 3.3V, VCOMX = 3.3V, 0.3V 25 -20 1 20 nA Full - 30 - nA 25 -9 - 9 µA Full -12 - 12 µA 25 - - 11 µA Power OFF Logic Current, IOE VDD = 0V, OE = 5.25V 25 - - 22 µA Power OFF D+/D- Current, ID+, ID- 25 - - 1 µA OFF Leakage Current, IDx(OFF) ON Leakage Current, IDx(ON) VDD = 5.25V, OE = 5.25V, VDx = 0.3V, 3.3V, VCOMX = 0.3V, 3.3V Power OFF Leakage Current, ICOM+, ICOM- VDD = 0V, VCOM+ = 5.25V, VCOM- = 5.25V, OE = 0V VDD = 0V, OE = VDD, VD+ = VD- = 5.25V 4 FN7593.0 July 2, 2010 ISL54227 Electrical Specifications - 2.7V to 5.25V Supply Test Conditions: VDD = +3.3V, GND = 0V, VLP = GND, VOEH = 1.4V, VOEL = 0.5V, (Note 10), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) PARAMETER TEST CONDITIONS TEMP MIN MAX (°C) (Notes 11, 12) TYP (Notes 11, 12) UNITS Overvoltage Protection Detection Positive Fault-Protection Trip Threshold, VPFP VDD = 2.7V to 5.25V, OE = VDD (See Table 1 on page 2) 25 3.62 3.8 3.95 V Negative Fault-Protection Trip VDD = 2.7V to 5.25V, OE = VDD Threshold, VNFP (See Table 1 on page 2) 25 -0.6 -0.45 -0.29 V Negative OVP Response: VDD = 2.7V, SEL = 0V or VDD, OE/ALM = VDD, VDx = 0V to -5V, RL = 1.5kΩ 25 - 102 ns Positive OVP Response: VDD = 2.7V, SEL = 0V or VDD, OE/ALM = VDD, VDx = 0V to 5.25V, RL = 1.5kΩ 25 - 2 µs VDD = 2.7V, OE = VDD, VDx = 0V to 5.25V or 0V to -5V, RL = 1.5kΩ 25 - 45 µs OFF Persistance Time Fault Protection Response Time ON Persistance Time Fault Protection Recovery Time DYNAMIC CHARACTERISTICS Turn-ON Time, tON VDD = 3.3V, VINPUT = 3V, RL = 50Ω, CL = 50pF (see Figure 1) 25 - 160 - ns Turn-OFF Time, tOFF VDD = 3.3V, VINPUT = 3V, RL = 50Ω, CL = 50pF (see Figure 1) 25 - 60 - ns Skew, (tSKEWOUT - tSKEWIN) VDD = 3.3V, OE = 3.3V, RL = 45Ω, CL = 10pF, tR = tF = 500ps at 480Mbps, (Duty Cycle = 50%) (see Figure 5) 25 - 50 - ps Rise/Fall Degradation (Propagation Delay), tPD VDD = 3.3V, OE = 3.3V, RL = 45Ω, CL = 10pF, (see Figure 5) 25 - 250 - ps Crosstalk VDD = 3.3V, RL = 50Ω, f = 240MHz (see Figure 4) 25 - -39 - dB OFF-Isolation VDD = 3.3V, OE = 0V, RL = 50Ω, f = 240MHz 25 - -23 - dB -3dB Bandwidth Signal = 0dBm, 0.86VDC offset, RL = 50Ω 25 - 790 - MHz OFF Capacitance, COFF f = 1MHz, VDD = 3.3V, LP = 0V, OE = 0V (see Figure 3) 25 - 2.5 - pF COM ON Capacitance, C(ON) f = 1MHz, VDD = 3.3V, LP = 0V, OE = 3.3V, (see Figure 3) 25 - 4 - pF COM ON Capacitance, C(ON) f = 240MHz, VDD = 3.3V, LP = 0V, OE = 3.3V 25 - 2 - pF Full 2.7 5.25 V 25 - 45 56 µA Full - - 59 µA 25 - 23 30 µA Full - - 34 µA 25 - 5 6 µA Full - - 10 µA POWER SUPPLY CHARACTERISTICS Power Supply Range, VDD Positive Supply Current, IDD VDD = 5.25V, OE = 5.25V, LP = GND Positive Supply Current, IDD VDD = 3.6V, OE = 3.6V, LP = GND Positive Supply Current, IDD (Low Power State) VDD = 3.6V, OE = 0V, LP = VDD 5 FN7593.0 July 2, 2010 ISL54227 Electrical Specifications - 2.7V to 5.25V Supply Test Conditions: VDD = +3.3V, GND = 0V, VLP = GND, VOEH = 1.4V, VOEL = 0.5V, (Note 10), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) PARAMETER TEST CONDITIONS Positive Supply Current, IDD VDD = 4.3V, OE = 2.6V, LP = GND TEMP MIN MAX (°C) (Notes 11, 12) TYP (Notes 11, 12) UNITS 25 - 35 45 µA Full - - 50 µA 25 - 25 32 µA Full - - 38 µA Input Voltage Low, VOEL, VLPL VDD = 2.7V to 3.6V Full - - 0.5 V Input Voltage High, VOEH, VLPH VDD = 2.7V to 3.6V Full 1.4 - - V Input Voltage Low, VOEL, VLPL VDD = 3.7V to 4.2V Full - - 0.7 V Input Voltage High, VOEH, VLPH Full 1.7 - - V Input Voltage Low, VOEL, VLPL VDD = 4.3V to 5.25V Full - - 0.8 V Input Voltage High, VOEH, VLPH VDD = 4.3V to 5.25V Full 2.0 - - V Input Current, IOEL, ILPL VDD = 5.25V, OE = 0V, LP = 0V Full - -8.2 - nA Input Current, IOEH, ILPH VDD = 5.25V, OE = 5.25V, LP = 5.25V, 4MΩ Pull-down Full - 1.4 - µA Positive Supply Current, IDD VDD = 3.6V, OE = 1.4V, LP = GND DIGITAL INPUT CHARACTERISTICS VDD = 3.7V to 4.2 NOTES: 10. VLOGIC = Input voltage to perform proper function. 11. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 12. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 13. Flatness is defined as the difference between maximum and minimum value of ON-resistance over the specified analog signal range. 14. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON value. 15. Limits established by characterization and are not production tested. 6 FN7593.0 July 2, 2010 ISL54227 Test Circuits and Waveforms LOGIC INPUT VDD tr < 20ns tf < 20ns VDD 50% 0V VINPUT tOFF SWITCH INPUT VINPUT SWITCH INPUT VOUT Dx COMx OE VOUT 90% SWITCH OUTPUT C 90% VIN CL 50pF RL 50Ω GND 0V tON Logic input waveform is inverted for switches that have the opposite logic sense. Repeat test for all switches. CL includes fixture and stray capacitance. RL ----------------------V OUT = V (INPUT) R + r L ON FIGURE 1A. MEASUREMENT POINTS FIGURE 1B. TEST CIRCUIT FIGURE 1. SWITCHING TIMES VDD C rON = V1/17mA COMx VHSDX OE V1 17mA VDD Dx GND Repeat test for all switches. FIGURE 2. rON TEST CIRCUIT VDD VDD C C COMx SIGNAL GENERATOR COM+ 50Ω D+ OE IMPEDANCE ANALYZER OE 0V OR VDD Dx VIN GND COM- D- ANALYZER NC GND RL Repeat test for all switches. Signal direction through switch is reversed, worst case values are recorded. Repeat test for all switches. FIGURE 3. CAPACITANCE TEST CIRCUIT 7 FIGURE 4. CROSSTALK TEST CIRCUIT FN7593.0 July 2, 2010 ISL54227 Test Circuits and Waveforms (Continued) VDD C tri 90% 10% DIN+ 50% VDD tskew_i DIN- 90% OE 15.8Ω COM- DIN+ 50% 143Ω 10% DIN- tfi tro 15.8Ω OUT+ D- 45Ω CL COM+ OUT- D+ 45Ω CL 143Ω 90% 10% OUT+ 50% GND tskew_o OUT- |tro - tri| Delay Due to Switch for Rising Input and Rising Output Signals. 50% 90% |tfo - tfi| Delay Due to Switch for Falling Input and Falling Output Signals. 10% tf0 |tskew_0| Change in Skew through the Switch for Output Signals. |tskew_i| Change in Skew through the Switch for Input Signals. FIGURE 5A. MEASUREMENT POINTS FIGURE 5B. TEST CIRCUIT FIGURE 5. SKEW TEST Application Block Diagram 3.3V 500Ω VDD ALM INT 3.6V USB CONNECTOR VBUS >1MΩ LOGIC CONTROL 4MΩ D- COM- D+ OVP DET COM+ µCONTROLLER LP OE 4MΩ D- D+ USB HIGH-SPEED OR FULL-SPEED TRANSCEIVER GND ISL54227 8 GND PORTABLE MEDIA DEVICE FN7593.0 July 2, 2010 ISL54227 Detailed Description The ISL54227 device is a dual single pole/single throw (SPST) analog switch configured as a DPST that operates from a single DC power supply in the range of 2.7V to 5.25V. It was designed for switching a USB high-speed or full-speed source in portable battery powered products. It is offered in small µTQFN and TDFN packages for use in MP3 players, cameras, PDAs, cellphones, and other personal media players. The part consists of two 3.5Ω high-speed SPST switches. These switches have high bandwidth and low capacitance to pass USB high-speed (480Mbps) differential data signals with minimal edge and phase distortion. They can also swing from 0V to 3.6V to pass USB full speed (12Mbps) differential data signals with minimal distortion. The device has a single logic control pin (OE) to open and close the two SPST switches. The part has an LP control pin to put the part in a low power state. The part contains special over voltage protection (OVP) circuitry on the COM+ and COM- pins. This circuitry acts to open the SPST switches when the part senses a voltage on the COM pins that is >3.8V (typ) or < -0.45V (typ). It isolates voltages up to 5.25V and down to -5V from getting through to the other side of the switches (D-, D+) to protect the USB down-stream transceiver connected at the D+ and D- pins. It has an alarm (ALM) interrupt output to indicate when the device has detected and entered the OTV state. This output can be monitored by a µController to indicate a fault condition to the system. The part has charger port interrupt detection circuitry (CP) on the COM pins that outputs a Low on the INT pin to inform the µController or power management circuitry when entering a dedicated charging port mode of operation. The charger mode operation is initiated by driving the OE pin Low and externally connecting the COM pins together which pulls the COM lines High, triggering the INT pin to go Low and the SPST switches to open. The ISL54227 was designed for MP3 players, cameras, cellphones, and other personal media player applications that need to switch a high-speed or full-speed transceiver source. See this functionality in the “Application Block Diagram” on page 8. A detailed description of the SPST switches is provided in the following section. High-Speed (Dx) SPST Switches The Dx switches are bi-directional switches that can pass USB high-speed and USB full-speed signals when VDD is in the range of 2.7V to 5.25V. When powered with a 2.7V supply, these switches have a nominal rON of 3.5Ω over the signal range of 0V to 400mV with a rON flatness of 0.26Ω. The rON matching 9 between the switches over this signal range is only 0.2Ω, ensuring minimal impact by the switches to USB high speed signal transitions. As the signal level increases, the rON switch resistance increases. At signal level of 3.3V, the switch resistance is nominally 6.8Ω. See Figures 9, 10, 11, 12, 13, 14 in the “Typical Performance Curves” beginning on page 11. The Dx switches were specifically designed to pass USB 2.0 high-speed (480Mbps) differential signals in the range of 0V to 400mV. They have low capacitance and high bandwidth to pass the USB high-speed signals with minimum edge and phase distortion to meet USB 2.0 high speed signal quality specifications. See Figure 15 in the “Typical Performance Curves” on page 13 for USB High-speed Eye Pattern taken with switch in the signal path. The Dx switches can also pass USB full-speed signals (12Mbps) in the range of 0V to 3.6V with minimal distortion and meet all the USB requirements for USB 2.0 full-speed signaling. See Figure 16 in the “Typical Performance Curves” on page 14 for USB Full-speed Eye Pattern taken with switch in the signal path. The switches are active (turned ON) whenever the OE voltage is logic “1”(High) and the LP voltage is logic “0” (Low) and OFF when the OE voltage is logic “0” (Low) and the LP voltage is logic “0” (Low) or logic “1” (High). OVERVOLTAGE PROTECTION (OVP) The maximum normal operating signal range for the Dx switches is from 0V to 3.6V. For normal operation the signal voltage should not be allow to exceed these voltage levels or go below ground by more than -0.3V. However, in the event that a positive voltage >3.8V (typ) to 5.25V, such as the USB 5V VBUS voltage, gets shorted to one or both of the COM+ and COM- pins or a negative voltage <-0.45V (typ) to -5V gets shorted to one or both of the COM pins, the ISL54227 has OVP circuitry to detect the over voltage condition and open the SPST switches to prevent damage to the USB down-stream transceiver connected at the signal pins (D-, D+). The OVP and power-off protection circuitry allows the COM pins (COM-, COM+) to be driven up to 5.25V while the VDD supply voltage is in the range of 0V to 5.25V. In this condition, the part draws <100µA of ICOMx and IDD current and causes no stress to the IC. In addition the SPST switches are OFF and the fault voltage is isolated from the other side of the switch. The part has an alarm (ALM) interrupt output to indicate when the device has detected and entered the OTV state. This output can be monitored by a µController to indicate a fault condition to the system. External VDD Series Resistor to Limit IDD Current during Negative OVP Condition A 100Ω to 1kΩ resistor in series with the VDD pin (see Figure 6) is required to limit the IDD current draw from the system power supply rail during a negative OVP fault event. FN7593.0 July 2, 2010 ISL54227 The series resistor also provides improved ESD and latch-up immunity. During an overvoltage transient event (such as occurs during system level IEC 61000 ESD testing), substrate currents can be generated in the IC that can trigger parasitic SCR structures to turn ON, creating a low impedance path from the VDD power supply to ground. This will result in a significant amount of current flow in the IC, which can potentially create a latch-up state or permanently damage the IC. The external VDD resistor limits the current during this overstress situation and has been found to prevent latchup or destructive damage for many overvoltage transient events. Under normal operation, the low microamp IDD current of the IC produces an insignificant voltage drop across the series resistor resulting in no impact to switch operation or performance. VSUPPLY C PROTECTION RESISTOR 100Ω TO 1kΩ VDD COM+ -5V FAULT VOLTAGE OVP COMOE IDD D- LOW TO INDICATE OVP ALM LOGIC GND LP D+ INT CHARGER PORT DETECTION POWER MANAGEMENT BATTERY CHARGER CIRCUITRY VSUPPLY BATTERY CHARGER 200Ω “LOW” TO INDICATE CHARGER CONNECTED C VBUS USB CONNECTOR With a negative -5V fault voltage at both com pins, the graph in Figure 7 shows the IDD current draw for different external resistor values for supply voltages of 2.7V, 3.6V, and 5.25V. Note: With a 500Ω resistor the current draw is limited to around 5mA. When the negative fault voltage is removed the IDD current will return to it’s normal operation current of 25µA to 45µA. D+ COM+ VDD CHG DET D- COM- GND D+ D- USB TRANCEIVER ALM LOGIC OE LP GND INT OE = “0” OR TRI-STATE µP FIGURE 8. CHARGER PORT DETECTION The ISL54227 has special charger port detection circuitry that monitors the voltage at the com pins to detect when a battery charger has been connected into the USB port (see Figure 8). When the battery charger is connected into the USB connector, it shorts the COM+ and COM- pins together. The shorting of the pins is sensed by the ISL54227 IC and it pulls the COM+ and COM- lines high and as long as the OE = “0” or is tri-stated by the µP, it will drive its INT logic output “Low” to tell the power management circuitry that a battery charger is connected at the port and not a USB host transceiver. The power management circuitry will then use the USB connector VBUS line to charge the battery. ISL54227 Operation The following will discuss using the ISL54227 shown in the “Application Block Diagram” on page 8. FIGURE 6. VDD SERIES RESISTOR TO LIMIT IDD CURRENT DURING NEGATIVE OVP AND FOR ENHANCED ESD AND LATCH-UP IMMUNITY 25 VCOM+ = VCOM- = -5V IDD (mA) 20 5.25V 5 0 100 3.6V For lowest power consumption you should use the lowest VDD supply. In a typical application, VDD will be in the range of 2.8V to 4.3V and will be connected to the battery or LDO of the portable media device. 2.7V 200 The power supply connected at the VDD pin provides the DC bias voltage required by the ISL54227 part for proper operation. The ISL54227 can be operated with a VDD voltage in the range of 2.7V to 5.25V. A 0.01µF or 0.1µF decoupling capacitor should be connected from the VDD pin to ground to filter out any power supply noise from entering the part. The capacitor should be located as close to the VDD pin as possible. 15 10 POWER 300 400 500 600 700 RESISTOR (Ω) 800 FIGURE 7. NEGATIVE OVP IDD CURRRENT vs RESISTOR VALUE vs VSUPPLY 10 900 1k LOGIC CONTROL The state of the ISL54227 device is determined by the voltage at the OE pin, LP pin, and the signal voltage at the COM pins. Refer to “Truth Table” on page 2. FN7593.0 July 2, 2010 ISL54227 The OE and LP pins are internally pulled low through a 4MΩ resistor to ground and can be tri-stated or left floating. draws only 10µA (max) of current across the operating temperature range. The ISL54227 is designed to minimize IDD current consumption when the logic control voltage is lower than the VDD supply voltage. With VDD = 3.6V and the OE logic pin is at 1.4V the part typically draws only 25µA. With VDD = 4.3V and the OE logic pin is at 2.6V the part typically draws only 35µA. Driving the logic pin to the VDD supply rail minimizes power consumption. With a signal level in the range of 0V to 3.6V and with the LP pin = Logic “0” the switches will be ON when the OE pin = Logic “1” and will be OFF (high impedance) when the OE pin = Logic “0”. The OE and LP pin can be driven with a voltage higher than the VDD supply voltage. It can be driven up to 5.25V with a VDD supply in the range of 2.7V to 5.25V. TABLE 2. LOGIC CONTROL VOLTAGE LEVELS VDD SUPPLY RANGE LOGIC = “0” (LOW) LOGIC = “1” (HIGH) OE LP OE LP 2.7V to 3.6V ≤ 0.5V or floating ≤ 0.5V or floating ≥1.4V ≥1.4V 3.7V to 4.2V ≤ 0.7V or floating ≤ 0.7V or floating ≥1.7V ≥1.7V 4.3V to 5.25V ≤ 0.8V or floating ≤ 0.8V or floating ≥2.0V ≥2.0V Low Power Mode If the OE pin = Logic “0”, and the LP pin = Logic “1” the switches will turn OFF (high impedance) and the part will be put in a low power mode. In this mode the part Typical Performance Curves Normal Operation Mode USB 2.0 VBUS Short Requirments The USB specification in section 7.1.1 states a USB device must be able to withstand a VBUS short (4.4V to 5.25V) or a -1V short to the D+ or D- signal lines when the device is either powered off or powered on for at least 24 hours. The ISL54227 part has special power-off protection and OVP detection circuitry to meet these short circuit requirements. This circuitry allows the ISL54227 to provide protection to the USB down-stream transceiver connected at its signal pins (D-, D+) to meet the USB specification short circuit requirements. The power-off protection and OVP circuitry allows the COM pins (COM-, COM+) to be driven up to 5.25V or down to -5V while the VDD supply voltage is in the range of 0V to 5.25V. In these overvoltage conditions with a 500Ω external VDD resistor the part draws <55µA of current into the COM pins and causes no stress/damage to the IC. In addition all switches are OFF and the shorted VBUS voltage will be isolated from getting through to the other side of the switch channels, thereby protecting the USB transceiver. TA = +25°C, Unless Otherwise Specified 16 3.4 ICOM = 17mA 12 3.2 10 3.0V rON (Ω) rON (Ω) 3.3 3.3V 3.1 0.1 0.2 2 0.3 0.4 VCOM (V) FIGURE 9. ON-RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE 11 3.0V 4 5.25V 0 2.7V 8 6 3.6V 4.3V 3.0 2.9 ICOM = 17mA 14 2.7V 0 5.25V 0 0.6 1.2 1.8 2.4 3.3V 3.0 3.6 VCOM (V) FIGURE 10. ON-RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE FN7593.0 July 2, 2010 ISL54227 Typical Performance Curves 4.5 TA = +25°C, Unless Otherwise Specified (Continued) 18 V+ = 2.7V ICOM = 17mA V+ = 2.7V 16 ICOM = 17mA 4.0 14 +85°C 12 rON (Ω) rON (Ω) 3.5 +25°C 3.0 2.5 10 +85°C 8 +25°C 6 -40°C 4 2.0 -40°C 2 1.5 0 0.1 0.2 VCOM (V) 0.3 0 0.4 FIGURE 11. ON-RESISTANCE vs SWITCH VOLTAGE 0.5 1.0 1.5 2.0 VCOM (V) 2.5 3.0 3.5 FIGURE 12. ON-RESISTANCE vs SWITCH VOLTAGE 4.0 9 V+ = 3.3V ICOM = 17mA 8 +85°C 3.5 7 6 3.0 rON (Ω) rON (Ω) 0 +25°C +85°C 4 +25°C 2.5 3 -40°C V+ = 3.3V ICOM = 17mA 2.0 5 0 0.1 -40°C 2 0.2 VCOM (V) 0.3 0.4 FIGURE 13. ON-RESISTANCE vs SWITCH VOLTAGE 12 1 0 0.5 1.0 1.5 2.0 2.5 3.0 3.6 VCOM (V) FIGURE 14. ON-RESISTANCE vs SWITCH VOLTAGE FN7593.0 July 2, 2010 ISL54227 Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued) VOLTAGE SCALE (0.1V/DIV) VDD = 3.3V TIME SCALE (0.2ns/DIV) FIGURE 15. EYE PATTERN: 480Mbps WITH USB SWITCHES IN THE SIGNAL PATH 13 FN7593.0 July 2, 2010 ISL54227 Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued) VOLTAGE SCALE (0.5V/DIV) VDD = 3.3V TIME SCALE (10ns/DIV) FIGURE 16. EYE PATTERN: 12Mbps WITH USB SWITCHES IN THE SIGNAL PATH 0.0 5.0 4.5 4.0 VDD = 3.3V IOL CURRENT (mA) IOH CURRENT (mA) -0.5 -1.0 -1.5 VDD = 5.25V -2.0 VDD = 5.25V 3.5 3.0 2.5 2.0 1.5 VDD = 3.3V 1.0 0.5 -2.5 0 1 2 3 4 5 VOH VOLTAGE (V) FIGURE 17. IOH vs VOH vs VDD for INT and ALM 14 0.0 0 1 2 3 4 5 VOL VOLTAGE (V) FIGURE 18. IOL vs VOL vs VDD for INT and ALM FN7593.0 July 2, 2010 ISL54227 TA = +25°C, Unless Otherwise Specified (Continued) 1 -10 0 -20 -1 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) Typical Performance Curves -2 -3 -4 RL = 50Ω VIN = 0dBm, 0.86VDC BIAS RL = 50Ω VIN = 0dBm, 0.2VDC BIAS -30 -40 -50 -60 -70 -80 -90 -100 1M 10M 100M 1G -110 0.001 0.01 FREQUENCY (Hz) FIGURE 19. FREQUENCY RESPONSE 10M 100M 500M Die Characteristics RL = 50Ω VIN = 0dBm, 0.2VDC BIAS SUBSTRATE AND TDFN THERMAL PAD POTENTIAL (POWERED UP): -30 NORMALIZED GAIN (dB) 1M FIGURE 20. OFF-ISOLATION -10 -20 0.1 FREQUENCY (Hz) GND -40 TRANSISTOR COUNT: -50 1297 -60 PROCESS: -70 Submicron CMOS -80 -90 -100 -110 0.001 0.01 0.1 1M 10M 100M 500M FREQUENCY (Hz) FIGURE 21. CROSSTALK 15 FN7593.0 July 2, 2010 ISL54227 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION 7/2/10 FN7593.0 CHANGE Initial Release. Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL54227 To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff FITs are available from our website at http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 16 FN7593.0 July 2, 2010 ISL54227 Package Outline Drawing L10.1.8x1.4A 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 5, 3/10 1.80 B 6 PIN #1 ID A 1 1 1.40 3 10 0.50 6 PIN 1 INDEX AREA 9 X 0.40 2 10X 0.20 4 0.10 M C A B 0.05 M C 0.70 8 5 0.10 7 2X 4X 0.30 6 6X 0.40 TOP VIEW BOTTOM VIEW SEE DETAIL "X" 0.10 C MAX. 0.55 C SEATING PLANE 0.08 C (9 X 0.60) 1 (10X 0.20) (4X 0.30) 3 10 8 (0.70) SIDE VIEW (0.70) C 5 6 0 .1 27 REF 7 (6X 0.40) PACKAGE OUTLINE 0-0.05 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. JEDEC reference MO-255. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 17 FN7593.0 July 2, 2010 ISL54227 Package Outline Drawing L10.3x3A 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 5, 3/10 3.00 A 2.0 REF 6 PIN 1 INDEX AREA B 8X 0.50 BSC 5 1 6 PIN 1 INDEX AREA 10X 0 . 30 3.00 1.50 0.15 (4X) 10 0.10 M C A B 0.05 M C 5 4 10 X 0.25 TOP VIEW 2.30 ( 2.30 ) BOTTOM VIEW 0 .80 MAX SEE DETAIL "X" 0.10 C C (2.90) SEATING PLANE 0.08 C (1.50) SIDE VIEW (10 X 0.50) 0 . 2 REF 5 C ( 8X 0 .50 ) ( 10X 0.25 ) 0 . 00 MIN. 0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 Angular ±2.50° 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. 18 Compliant to JEDEC MO-229-WEED-3 except exposed pad length (2.30mm). FN7593.0 July 2, 2010