TI TSL1301

TSL1301
102 × 1 LINEAR SENSOR ARRAY
WITH HOLD
SOES031A – NOVEMBER 1996 – REVISED MAY 1997
D
D
D
D
D
102 × 1 Sensor-Element Organization
300 Dots-Per-Inch (DPI) Sensor Pitch
High Sensitivity
Output Referenced to Ground
Excellent High-Temperature Dark Signal
Characteristics
Operation to 2 MHz
Single 5-V Supply
D
D
(TOP VIEW)
SI
CLK
AO
VDD
1
8
2
7
3
6
4
5
NC
GND
GND
NC
NC – No internal connection
description
The TSL1301 linear sensor array consists of a 102 × 1 array of photodiodes, associated charge amplifier
circuitry, and a pixel data-hold function that provides simultaneous-integration start and stop times for all pixels.
The pixels measure 85 µm by 77 µm with 85-µm center-to-center spacing and 8-µm spacing between pixels.
Operation is simplified by internal control logic that requires only a serial-input pulse (SI) and a clock.
The TSL1301 is intended for use in a wide variety of applications including mark and code reading, OCR and
contact imaging, edge detection and positioning, and optical encoding.
functional block diagram
Pixel 1
Integrator
Reset
Pixel
2
Pixel
3
Pixel
102
VDD
Analog
Bus
4
Output
Amplifier
+
_
3
Sample/Hold/
Output
6,7
Switch Control Logic
Hold
CLK
SI
2
Q1
Q2
AO
RL
(External
Load)
Gain
Trim
Q3
Q102
102-Bit Shift Register
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TSL1301
102 × 1 LINEAR SENSOR ARRAY
WITH HOLD
SOES031A – NOVEMBER 1996 – REVISED MAY 1997
Terminal Functions
TERMINAL
DESCRIPTION
NAME
NO.
AO
3
Analog output
CLK
2
Clock. The clock controls charge transfer, pixel output, and reset.
GND
6, 7
Ground (substrate). All voltages are referenced to the substrate.
NC
5, 8
No internal connection
SI
1
Serial input. SI defines the start of the data-out sequence.
VDD
4
Supply voltage. Supply voltage for both analog and digital circuits.
detailed description
The sensor consists of 102 photodiodes, also called pixels, arranged in a linear array. Light energy impinging
on a pixel generates photocurrent, which is then integrated by the active integration circuitry associated with
that pixel.
During the integration period, a sampling capacitor connects to the output of the integrator through an analog
switch. The amount of charge accumulated at each pixel is directly proportional to the light intensity and the
integration time.
The output and reset of the integrators is controlled by a 102-bit shift register and reset logic. An output cycle
is initiated by clocking in a logic 1 on SI. This causes all 102 sampling capacitors to be disconnected from their
respective integrators and starts an integrator reset period. As the SI pulse is clocked through the shift register,
the charge stored on the sampling capacitors is sequentially connected to a charge-coupled output amplifier
that generates a voltage on analog output AO. The integrator reset period ends 18 clock cycles after the SI pulse
is clocked in. Then the next integration period begins. Note that a total 103 clock cycles are required, the 103rd
cycle being necessary to terminate the output of pixel 102 and return the output to a high-impedance state, and
to clear the internal shift register.
AO is driven by a source follower that requires an external pulldown resistor. When the output is not in the output
phase, it is in a high-impedance state. The output is nominally 0 V for no light input and 2 V for a nominal full-scale
output.
2
POST OFFICE BOX 655303
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TSL1301
102 × 1 LINEAR SENSOR ARRAY
WITH HOLD
SOES031A – NOVEMBER 1996 – REVISED MAY 1997
absolute maximum ratings†
Supply voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Digital input current range, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 20 mA to 20 mA
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 25°C to 85°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions (see Figure 1 and Figure 2)
Supply voltage, VDD
Input voltage, VI
MIN
NOM
4.5
5
0
VDD × 0.7
0
High-level input voltage, VIH
Low-level input voltage, VIL
Wavelength of light source, λ
5
Sensor integration time, tint
0.0515
Setup time, serial input, tsu(SI)
5
5.5
V
V
0
Operating free-air temperature, TA
0
V
V
nm
2000
kHz
100
ms
20
Hold time, serial input, th(SI) (see Note 1)
UNIT
VDD
VDD
VDD × 0.3
700
400
Clock frequency, fclock
MAX
ns
ns
70
°C
NOTE 1: SI must go low before the rising edge of the next clock pulse.
CLK
SI
Internal
Reset
18 Clock Cycles
Integration
Not Integrating
Integrating
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
102 Clock Cycles
AO
Hi-Z
Hi-Z
Figure 1. Timing Waveforms
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3
TSL1301
102 × 1 LINEAR SENSOR ARRAY
WITH HOLD
SOES031A – NOVEMBER 1996 – REVISED MAY 1997
electrical characteristics at fclock = 200 kHz, VDD = 5 V, TA = 25°C, λp = 565 nm, tint = 5 ms,
RL = 330 Ω, Ee = 800 nW/cm2 (unless otherwise noted) (see Note 2)
PARAMETER
TEST CONDITIONS
Analog output voltage (white, average over 102 pixels)
Analog output voltage (dark, average over 102 pixels)
PRNU
Pixel response nonuniformity
Ee = 0
Pixels 2–101,
Nonlinearity of analog output voltage
See Note 4
Output noise voltage
Ee = 0,
VDD = 4.5 V
See Note 5
VDD = 4.5 V,
All pixels,
See Note 6
RL = 330 Ω
Saturation exposure
Analog output saturation voltage
MIN
TYP
MAX
1.8
2
2.2
V
0
0.3
0.4
V
± 10%
See Note 3
± 0.5%
Ee = 0
3
5.45
7
3
3.5
DSNU
Dark signal nonuniformity
IL
Image lag
See Note 7
1%
IDD
IIH
Supply current
RL = 330 Ω
2.5
High-level input current
IIL
Ci
Low-level input current
VI = VDD
VI = 0
Input capacitance
UNIT
0.04
5
mVrms
nJ/cm2
V
0.12
V
4
mA
10
µA
10
µA
pF
NOTES: 2. Clock duty cycle is assumed to be 50%.
3. PRNU is the maximum difference between the voltage from any single pixel and the average output voltage from all pixels of the
device under test when the array is uniformly illuminated.
4. Nonlinearity is defined as the maximum deviation from a best-fit straight line over the dark-to-white irradiance levels, as a percent
of analog output voltage (white).
5. RMS noise is the standard deviation of a single-pixel output under constant illumination as observed over a 5-second period.
6. DNSU is the difference between the maximum and minimum of dark-current voltage.
7. Image lag is a residual signal left in a pixel from a previous exposure. It is defined as a percent of white-level signal remaining after
a pixel is exposed to a white condition followed by a dark condition:
IL
4
+V
V
AO
–V
AO(dark)
* VAO(dark)
AO(white
100
)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TSL1301
102 × 1 LINEAR SENSOR ARRAY
WITH HOLD
SOES031A – NOVEMBER 1996 – REVISED MAY 1997
operating characteristics over recommended ranges of supply voltage and operating free-air
temperature (see Figure 2)
PARAMETER
tw(H)
tw(L)
Clock pulse duration (high)
ts
Analog output settling time to ± 1%
TEST CONDITIONS
1
TYP
50
Clock pulse duration (low)
tw
MIN
2
CL = 50 pF
102
UNIT
ns
50
RL = 330 Ω,
MAX
ns
350
103
ns
5V
2.5 V
CLK
0V
tsu(SI)
SI
5V
50%
0V
th(SI)
ts
AO
ts
Pixel 1
Pixel 102
Figure 2. Operational Waveforms
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5
TSL1301
102 × 1 LINEAR SENSOR ARRAY
WITH HOLD
SOES031A – NOVEMBER 1996 – REVISED MAY 1997
APPLICATIONS INFORMATION
This clear-plastic dual-in-line package consists of a circuit mounted on a lead frame and encapsulated with an
electrically nonconductive clear plastic compound.
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
0.430 (10,92)
0.410 (10,41)
SI
CLK
AO
VDD
NC
GND
GND
NC
0.390 (9,91)‡
Centerline of Pin 1 Nominally
Lies Between Pixels 7 and 8
8
5
0.310 (7,87)
0.290 (7,37)
C
L (pixel)
C
L
0.021 (0,53)
0.310 (7,87)
0.290 (7,37)
0.260 (6,60)
0.240 (6,10)
0.075 (1,91)
0.060 (1,52)
1
0.030 (0,76) D NOM
0.175 (4,45)
0.155 (3,94)
10° TYP
0.060 (1,52)
0.040 (1,02)
8 Places
4
0.020 (0,51) R NOM
4 Places
8° MAX TYP
0.053 (1,35)
0.043 (1,09)
Seating Plane
0.020 (0,51)
R MAX
4 Places
105°
90°
8 Places
0.012 (0,30)
0.008 (0,20)
0.016 (0,41)
0.014 (0,36)
0.067 (1,70)
0.053 (1,35)
0.150 (3,81)
0.125 (3,18)
0.025 (0,64)
0.015 (0,38)
0.100 (2,54) T.P.†
Figure 3. Packaging Configuration
† True position when unit is installed
‡ Minimum flat-optical-surface length
NOTES: A. All linear dimensions are in inches and parenthetically in millimeters.
B. This drawing is subject to change without notice.
6
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Apr-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TSL1301
OBSOLETE
OPTO
NU
Pins Package Eco Plan (2)
Qty
8
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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