SCES480B − AUGUST 2003 − REVISED MAY 2004 D Qualification in Accordance With D D D D D D D Typical VOLP (Output Ground Bounce) AEC-Q100† Qualified for Automotive Applications Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Operates From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 4.1 ns at 3.3 V <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C D D OR PW PACKAGE (TOP VIEW) 1A 1B 1Y 2A 2B 2Y GND † Contact factory for details. Q100 qualification data available on request. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y description/ordering information The SN74LVC08A-Q1 quadruple 2-input positive-AND gate is designed for 2.7-V to 3.6-V VCC operation. The device performs the Boolean function Y + A • B or Y + A ) B in positive logic. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. ORDERING INFORMATION −40°C to 125°C ORDERABLE PART NUMBER PACKAGE‡ TA TOP-SIDE MARKING SOIC − D Reel of 2500 SN74LVC08AQDRQ1 LVC08AQ TSSOP − PW Reel of 2000 SN74LVC08AQPWRQ1 LVC08AQ ‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each gate) INPUTS A B OUTPUT Y H H H L X L X L L logic diagram, each gate (positive logic) A Y B Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCES480B − AUGUST 2003 − REVISED MAY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. 2. The value of VCC is provided in the recommended operating conditions table. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4) Operating VCC Supply voltage VIH VIL High-level input voltage VI VO Input voltage Output voltage Data retention only VCC = 2.7 V to 3.6 V VCC = 2.7 V to 3.6 V Low-level input voltage IOH High-level output current VCC = 2.7 V VCC = 3 V IOL Low-level output current VCC = 2.7 V VCC = 3 V ∆t/∆v Input transition rise or fall rate MIN MAX 2 3.6 UNIT V 1.5 2 V 0.8 V 0 5.5 V 0 VCC −12 V −24 mA 12 24 0 8 mA ns/V TA Operating free-air temperature Q suffix −40 125 °C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCES480B − AUGUST 2003 − REVISED MAY 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = −100 µA VCC MIN 2.7 V to 3.6 V VCC−0.2 2.2 2.7 V VOH IOH = −12 mA IOH = −24 mA IOL = 100 µA VOL II ICC 2.4 3V 2.2 MAX UNIT V 2.7 V to 3.6 V 0.2 IOL = 12 mA IOL = 24 mA 2.7 V 0.4 3V 0.55 VI = 5.5 V or GND VI = VCC or GND, 3.6 V ±5 µA 3.6 V 10 µA 2.7 V to 3.6 V 500 µA IO = 0 One input at VCC − 0.6 V, Other inputs at VCC or GND ∆ICC 3V TYP† Ci VI = VCC or GND † All typical values are at VCC = 3.3 V, TA = 25°C. 3.3 V 5 V pF switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A or B Y VCC = 2.7 V MIN VCC = 3.3 V ± 0.3 V MAX MIN MAX 4.8 1 4.1 UNIT ns operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per gate POST OFFICE BOX 655303 f = 10 MHz • DALLAS, TEXAS 75265 VCC = 2.5 V TYP 9.8 VCC = 3.3 V TYP 10 UNIT pF 3 SCES480B − AUGUST 2003 − REVISED MAY 2004 PARAMETER MEASUREMENT INFORMATION RL From Output Under Test CL (see Note A) VLOAD Open S1 GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 2.7 V 3.3 V ± 0.3 V VI tr/tf 2.7 V 2.7 V ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ 1.5 V 1.5 V 6V 6V 50 pF 50 pF 500 Ω 500 Ω 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH tPHL VOH VM Output VM VOL tPHL Output Waveform 1 S1 at VLOAD (see Note B) tPLH VM VM VM 0V tPZL tPLZ VLOAD/2 VM tPZH VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 27-Jan-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC08AQDRQ1 ACTIVE SOIC D 14 2500 SN74LVC08AQPWRQ1 ACTIVE TSSOP PW 14 2000 Lead/Ball Finish MSL Peak Temp (3) Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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