Soldering Process Taiwan Semiconductor TAIWAN SEMICONDUCTOR RECOMMENDED SOLDERING PROCESS FOR SURFACE MOUNTED AND AXIAL-LEADED COMPONENTS REFLOW PROFILE CLASSIFICATION REFLOW PROFILE PROFILE FEATURE Sn - Pb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY 3 °C/s maximum 3 °C/s maximum Preheat - Temperature minimum (T S(min.)) - Temperature maximum (T S(max.)) - Time (T S(min.) to TS(max.)) (tS) 100 °C 150 °C 60 s to 120 s 150 °C 200 °C 60 s to 120 s Time maintained above - Temperature minimum (T L) - Time (T L) 183 °C 60 s to 150 s 217 °C 60 s to 150 s (Table 1) (Table 2) 20* s 30* s Ramp-down rate 6 °C/s maximum 6 °C/s maximum Time 25 °C to peak temperature 6 min maximum 8 min maximum Average ramp-up rate (TL to TP) Peak temperature Time within 5 °C of actual peak temperature (t P)* *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Note: All temperatures refer to topside of the package, measured on package body surface Document Number：DS_D1309063 Version:A13 Soldering Process Taiwan Semiconductor TABLE 1 - Sn-Pb EUTECTIC PROCESS TABLE 2 - LEAD (Pb)-FREE PROCESS PACKAGE PEAK REFLOW TRMPERATURES PACKAGE CLASSIFICATION REFLOW TEMPERATURE PACKAGE THINKNESS VOLUME mm3 <350 VOLUME mm3 ≧350 PACKAGE THINKNESS VOLUME mm3 <350 VOLUME mm3 350 - 2000 VOLUME mm3 > 2000 < 2.5mm 235 +0/-5℃ 220 +0/-5℃ < 1.6mm 260 +0 ℃* 260 +0 ℃* 260 +0 ℃* ≧2.5mm 220 +0/-5℃ 220 +0/-5℃ < 1.6mm - 2.5mm 260 +0 ℃* 250 +0 ℃* 245 +0 ℃* ≧2.5mm 250 +0 ℃* 245 +0 ℃* 245 +0 ℃* * Tolerance: The device manufacturer/supplierer shall assure process compatibility up to and including the stated classification temperature at the rated MSL level WAVE SOLDERING Fig. 1 - Lead (Pb)-free Wave Soldering Profile Notes: 1. Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. 2. The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. 3. This document should serve as recommendation only. Other parameters may also affect soldering, so these profiles do not guarantee absolute success. 4. Soldering profile should be determined by the manufacturer of the solder paste, providing there is no contradiction with the recommendations in this document. 5. Reflow profile reference to J-STD-020 Wave soldering reference to CECC00802 Document Number：DS_D1309063 Version:A13