Wurth Electronics Midcom Inc. 121 Airport Drive ·P.O. Box 1330 · Watertown SD 57201-6330, USA T: +1 (605) 886 4385 · Toll Free: +1 (800) 643 2661 www.we-online.com Solder Profiles for Lead Free Processes Surface Mount Devices (SMD) Wurth Electronics Midcom recommends solder profiles based on IPC/JEDEC J-STD-020D.1 Figure 1 shows a typical profile. Tables 1 and 2 list the reflow parameters and temperatures. Exceeding these conditions may cause lowered product reliability. Temperature (°C) Reflow Temperature Profile TIME Figure 1 REFLOW PARAMETER Preheat Temperature (TMIN-TMAX) Preheat Time (TPREHEAT) Ramp-up Rate (Ru TMAX-PTEMP) Time Above 217°C (LTEMP) Peak Temperature (PTEMP) Time Within 5°C of Peak (PTIME) Ramp-down Rate (RD) 25°C to Peak Temperature (T TO PEAK) Table 1 TEMPERATURE 150°C - 200°C 60 - 120 seconds 3°C/second maximum 60 - 150 seconds See Table 2 30 seconds 6°C/second maximum 8 minutes maximum Wurth Electronics Midcom Inc. 121 Airport Drive ·P.O. Box 1330 · Watertown SD 57201-6330, USA T: +1 (605) 886 4385 · Toll Free: +1 (800) 643 2661 www.we-online.com Peak Temperatures – Lead-Free VOLUME mm3 VOLUME mm3 <350 350 - 2000 <1.6mm 260°C 260°C 1.6mm - 2.5mm 260°C 250°C >2.5mm 250°C 245°C Temperature measured on top surface of component body PACKAGE THICKNESS VOLUME mm3 >2000 260°C 245°C 245°C Table 2 Through-Hole Devices (THD) These products are able to withstand a maximum wave solder temperature of 260°C for 10 seconds. Table 3 shows a typical temperature/time profile. PREHEAT TEMP/TIME SOAK TEMP/TIME REFLOW TEMP/TIME COOL TEMP/TIME 25°C - 150°C 60s 150°C - 160°C 120s 160°C - 230°C 30 - 60s 230°C - 150°C 60s Table 3