VISHAY SEMICONDUCTORS www.vishay.com Rectifiers Application Note Soldering Process Notes WAVE SOLDERING (THROUGH HOLE ONLY) Sn-Pb Wave Soldering Profile Lead (Pb)-free Wave Soldering Profile 235 °C to 260 °C wave temperature 250 300 Maximum temperature can not exceed 265 °C for PC board mounting Second wave Temperature (°C) - 5 °C/s + 200 °C/s 150 100 + 2 °C/s 200 235 °C ~ 260 °C ca. 5 K/s < 105 °C to 165 °C ca. 2 K/s ca. 2 K/s 150 100 °C ~ 130 °C 100 forced cooling 2 K/s 50 27 °C 0 Second wave First wave - 2 °C/s Preheat zone 50 250 Temperature (°C) First Wave 200 Full line: Typical Dotted line: Process limits 10 s Activation of Flux 0 0 60 120 Time (s) 180 240 0 50 100 150 200 250 Time (s) REFLOW PROFILE (SURFACE MOUNT ONLY) TABLE 1 - Sn-Pb EUTECTIC PROCESS PACKAGE REFLOW TEMPERATURES See Table 1 and Table 2 tp TP Critical zone TL to TP Temperature Ramp-up TL PACKAGE THICKNESS VOLUME mm3 < 350 VOLUME mm3 350 < 2.5 mm 240 + 0/- 5 °C 225 + 0/- 5 °C 2.5 mm 225 + 0/- 5 °C 225 + 0/- 5 °C tL Ts max. TABLE 2 - LEAD (Pb)-FREE PROCESS PACKAGE CLASSIFICATION REFLOW TEMPERATURE Ts min. ts Preheat PACKAGE THICKNESS 25 t 25 °C to peak Time < 1.6 mm VOLUME mm3 < 350 VOLUME mm3 350 TO 2000 VOLUME mm3 > 2000 260 + 0 °C (1) 260 + 0 °C (1) 260 + 0 °C (1) < 1.6 mm to 2.5 mm 260 + 0 °C (1) 250 + 0 °C (1) 245 + 0 °C (1) 2.5 mm 250 + 0 °C (1) 245 + 0 °C (1) 245 + 0 °C (1) Note (1) Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature at the rated MSL level. Revision: 19-Oct-11 Document Number: 95418 1 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 APPLICATION NOTE Ramp-down Application Note www.vishay.com Vishay Semiconductors Soldering Process Notes TABLE 3 - CLASSIFICATION REFLOW PROFILE PROFILE FEATURE Sn-Pb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY 3 °C/s maximum 3 °C/s maximum Preheat - Temperature minimum (Ts min.) - Temperature maximum (Ts max.) - Time (min. to max.) (ts) 100 °C 150 °C 60 s to 120 s 150 °C 200 °C 60 s to 180 s Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60 s to 150 s 217 °C 60 s to 150 s Average ramp-up rate (Ts max. to TP) Peak temperature See table 1 See table 2 Time within 5 °C to actual peak temperature (tp) 10 s to 30 s 20 s to 40 s Ramp-down rate 6 °C/s maximum 6 °C/s maximum Time 25 °C to peak temperature 6 min maximum 8 min maximum Note • All temperatures refer to top side of the package, measured on the package body surface. HAND SOLDERING (THROUGH HOLE ONLY) Protection against overheating is essential when a device is being soldered. It is recommended, therefore, that connection terminals are left as long as possible, are soldered at the tip only, and that any heat generated is quickly conducted away. The time during which the specified maximum permissible device junction temperature is exceeded during the soldering operation should be as short as possible, (i.e., for silicon, 260 °C + 5 °C - 0 °C for 10 s maximum). Excessive force on the body or leads should be avoided during or just after soldering. Do not correct the position of an already soldered device by pushing, pulling or twisting the body. Prevent fast cooling after soldering. The maximum Iron soldering temperatures are shown in table 4. TABLE 4 - IRON SOLDERING IRON TEMPERATURE SOLDERING DISTANCE FORM THE CASE MAXIMUM ALLOWABLE SOLDERING TIME 265 °C 1.5 mm to 5 mm 5s 265 °C > 5 mm 10s HAND SOLDERING (SURFACE MOUNT ONLY) The maximum temperature of 260 °C over a period 10 s must not be exceeded during soldering. No aggressive fluxes may be used. A soldering iron should be used only in exceptional cases (repairs, etc.). A temperature regulated miniature soldering iron must be used, and care should be taken to avoid touching the component with the tip of the soldering iron. By preheating your PCB assembly with an air bath you can achieve far lower reflow temperatures than you can without it. APPLICATION NOTE Example: The same solder joint that requires a 370 °C (700 °F) soldering iron can be made at only 226 °C (420 °F) if the assembly is first briefly preheated for just seconds with an air bath. That is a temperature difference of 144 °C (280 °F) Revision: 19-Oct-11 Document Number: 95418 2 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000