MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 18 January 2016, 12:25 GMT
Diotec Semiconductor AG
DUNS-Nummer: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations Autorisiert durch:
Udo Steinebrunner, Product Manager, -
Deklaration gilt ab: 1 May 2004 [Approved on 23 January 2014, 06:50 GMT]
Materialien und Stoffe
Verwendung/Andordnung
Material
group
Chip (die)
Other
inorganic
materials
Encapsulation
Glass
% w/w des
Materials im
Artikel
1.50000%
15.00000%
Leadfinish
Tin plating
23.50000%
Leadframe
Copper
alloys
60.00000%
Substances
in the
material
CAS Number
% w/w des
Stoffs im
Artikel
Platinum
7440-06-4
2.50000%
Silver
7440-22-4
8.00000%
Silicon
7440-21-3
89.50000%
Potassium
oxide (K2O)
12136-45-7
4.20000%
Lead silicate
10099-76-0
95.80000%
Tin
7440-31-5
100.00000%
Iron
7439-89-6
2.00000%
Copper
7440-50-8
98.00000%
Beigefügte Artikelliste
Part number
Artikelbezeichnung
Artikelmasse
Artikelmasse
UoM
SOD-80C/Glass MiniMELF
Diode SMD
0.04
g
Page 1
Report generated: 18 January 2016, 12:25 GMT