LTC6803-2/LTC6803-4 - Multicell Battery Stack Monitor

LTC6803-2/LTC6803-4
Multicell Battery Stack
Monitor
DESCRIPTION
FEATURES
Measures Up to 12 Battery Cells in Series
Stackable Architecture
n Supports Multiple Battery Chemistries
and Supercapacitors
n Individually Addressable Serial Interface
n 0.25% Maximum Total Measurement Error
n Engineered for ISO26262 Compliant Systems
n 13ms to Measure All Cells in a System
n Passive Cell Balancing:
– Integrated Cell Balancing MOSFETs
– Ability to Drive External Balancing MOSFETs
n Onboard Temperature Sensor and Thermistor Inputs
n 1MHz Serial Interface with Packet Error Checking
n Safe with Random Connection of Cells
n Built-In Self Tests
n Delta-Sigma Converter With Built-In Noise Filter
n Open-Wire Connection Fault Detection
n 12µA Standby Mode Supply Current
n High EMI Immunity
n 44-Lead SSOP Package
The LTC®6803 is a 2nd generation, complete battery monitoring IC that includes a 12-bit ADC, a precision voltage
reference, a high voltage input multiplexer and a serial
interface. Each LTC6803 can measure up to 12 series
connected battery cells or supercapacitors. Many LTC6803
devices can be stacked to measure the voltage of each cell
in a long battery string. Each LTC6803-2/LTC6803-4 has
an individually addressable serial interface, allowing up
to 16 LTC6803-2/LTC6803-4 devices to interface to one
control processor and operate simultaneously. Each cell
input has an associated MOSFET switch for discharging
overcharged cells. The LTC6803-2 connects the bottom
of the stack to V– internally. It is pin compatible with the
LTC6802-2, providing a drop-in upgrade. The LTC6803-4
separates the bottom of the stack from V–, improving
cell 1 measurement accuracy.
APPLICATIONS
The related LTC6803-1 and LTC6803-3 offer a serial interface that allows the serial ports of multiple LTC6803-1
or LTC6803-3 devices to be daisy chained without optocouplers or isolators.
n
n
n
n
n
n
The LTC6803 provides a standby mode to reduce supply
current to 12µA. Furthermore, the LTC6803 can be powered
from an isolated supply, providing a technique to reduce
battery stack current draw to zero.
Electric and Hybrid Electric Vehicles
High Power Portable Equipment
Backup Battery Systems
Electric Bicycles, Motorcycles, Scooters
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
V+
+
12-CELL
BATTERY OR
CAPACITOR
STRING
Supply Current vs Modes of Operation
LTC6803-4
DIE TEMP
MUX
REGISTERS
AND
CONTROL
+
12-BIT
∆Σ ADC
1mA
SERIAL
DATA
4-BIT
ADDRESS
100µA
50V
ISOLATED
DC/DC
CONVERTER
+
VOLTAGE
REFERENCE
NEXT 12-CELL
PACK BELOW
V–
100k NTC
12V
SUPPLY CURRENT
NEXT 12-CELL
PACK ABOVE
10µA
1µA
100nA
10nA
EXTERNAL
TEMP
1nA
100k
HW
SHUTDOWN
STANDBY
MEASURE
680324 TA01b
680324 TA01a
680324fa
1
LTC6803-2/LTC6803-4
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Total Supply Voltage (V+ to V–)..................................75V
Input Voltage (Relative to V–)
C0............................................................. –0.3V to 8V
C12......................................................... –0.3V to 75V
Cn (Note 5).......................... –0.3V to Min (8 • n, 75V)
Sn (Note 5).......................... –0.3V to Min (8 • n, 75V)
All Other Pins............................................ –0.3V to 7V
Voltage Between Inputs
Cn to Cn – 1.............................................. –0.3V to 8V
Sn to Cn – 1.............................................. –0.3V to 8V
C12 to C8................................................ –0.3V to 25V
C8 to C4.................................................. –0.3V to 25V
C4 to C0.................................................. –0.3V to 25V
Operating Temperature Range
LTC6803I..............................................–40°C to 85°C
LTC6803H........................................... –40°C to 125°C
Specified Temperature Range
LTC6803I..............................................–40°C to 85°C
LTC6803H........................................... –40°C to 125°C
Junction Temperature............................................ 150°C
Storage Temperature Range................... –65°C to 150°C
Note: n = 1 to 12
PIN CONFIGURATION
LTC6803-2
LTC6803-4
TOP VIEW
V+
1
C12
2
S12
TOP VIEW
44 CSBI
V+
1
44 CSBI
43 SDO
C12
2
43 SDO
3
42 SDI
S12
3
42 SDI
C11
4
41 SCKI
C11
4
41 SCKI
S11
5
40 A3
S11
5
40 A3
C10
6
39 A2
C10
6
39 A2
S10
7
38 A1
S10
7
38 A1
C9
8
37 A0
C9
8
37 A0
S9
9
36 GPIO2
S9
9
36 GPIO2
C8 10
35 GPIO1
C8 10
35 GPIO1
S8 11
34 WDTB
S8 11
34 WDTB
C7 12
33 NC
C7 12
33 TOS
S7 13
32 TOS
S7 13
32 VREG
C6 14
31 VREG
C6 14
31 VREF
S6 15
30 VREF
S6 15
30 VTEMP2
C5 16
29 VTEMP2
C5 16
29 VTEMP1
S5 17
28 VTEMP1
S5 17
28 NC
C4 18
27 NC
C4 18
27 V –
S4 19
26 V –
S4 19
26 C0
C3 20
25 S1
C3 20
25 S1
S3 21
24 C1
S3 21
24 C1
C2 22
23 S2
C2 22
23 S2
G PACKAGE
44-LEAD PLASTIC SSOP
G PACKAGE
44-LEAD PLASTIC SSOP
TJMAX = 150°C, θJA = 70°C/W
TJMAX = 150°C, θJA = 70°C/W
680324fa
2
LTC6803-2/LTC6803-4
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
SPECIFIED TEMPERATURE RANGE
LTC6803IG-2#PBF
LTC6803IG-2#TRPBF
LTC6803G-2
44-Lead Plastic SSOP
–40°C to 85°C
LTC6803IG-4#PBF
LTC6803IG-4#TRPBF
LTC6803G-4
44-Lead Plastic SSOP
–40°C to 85°C
LTC6803HG-2#PBF
LTC6803HG-2#TRPBF
LTC6803G-2
44-Lead Plastic SSOP
–40°C to 125°C
LTC6803HG-4#PBF
LTC6803HG-4#TRPBF
LTC6803G-4
44-Lead Plastic SSOP
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
ELECTRICAL
CHARACTERISTICS
The
l denotes the specifications which apply over the full operating
+
–
temperature range, otherwise specifications are at TA = 25°C. V = 43.2V, V = 0V, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DC Specifications
VS
VLSB
VERR
Supply Voltage, V+ Relative to V–
VERR Specification Met
Timing Specification Met
l
l
10
4
55
55
Measurement Resolution
Quantization of the ADC
l
ADC Offset
(Note 2)
l
–0.5
0.5
mV
ADC Gain Error
(Note 2)
l
–0.12
–0.22
0.12
0.22
%
%
Total Measurement Error
(Note4)
VCELL = –0.3V
VCELL = 2.3V
VCELL = 2.3V
VCELL = 3.6V
VCELL = 3.6V, LTC6803IG
VCELL = 3.6V, LTC6803HG
VCELL = 4.2V
VCELL = 4.2V, LTC6803IG
VCELL = 4.2V, LTC6803HG
VCELL = 5V
2.3V < VTEMP < 4.2V, LTC6803IG
2.3V < VTEMP < 4.2V, LTC6803HG
VCELL
Cell Voltage Range
Full-Scale Voltage Range
VCM
Common Mode Voltage Range
Measured Relative to V–
Range of Inputs Cn < 0.25% Gain Error,
n = 2 to 11, LTC6803IG
Die Temperature Measurement Error
1.5
V
V
l
l
–2.8
–5.1
–4.3
–7.9
–9
–5
–9.2
–10
l
l
–9.2
–10
l
l
l
±2.5
±3
mV/Bit
2.8
5.1
4.3
7.9
9
5
9.2
10
9.2
10
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
–0.3
5
V
l
1.8
5•n
V
Range of Inputs C0, C1 < 0.25% Gain Error,
LTC6803IG
l
0
5
V
Range of Inputs Cn < 0.5% Gain Error,
n = 2 to 11, LTC6803HG
l
1.8
5•n
V
Range of Inputs C0, C1 < 0.5% Gain Error,
LTC6803HG
l
0
5
V
Error in Measurement of 125°C
5
°C
680324fa
3
LTC6803-2/LTC6803-4
ELECTRICAL
CHARACTERISTICS
The
l denotes the specifications which apply over the full operating
+
–
temperature range, otherwise specifications are at TA = 25°C. V = 43.2V, V = 0V, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VREF
Reference Pin Voltage
RLOAD = 100k to V–
3.020
3.015
3.065
3.065
3.110
3.115
V
V
l
Reference Voltage Temperature
Coefficient
8
Reference Voltage Thermal Hysteresis 25°C to 85°C and 25°C to –40°C
100
Reference Voltage Long-Term Drift
VREF2
VREG
10V < V+ < 50V, No Load
ILOAD = 4mA
Regulator Pin Short-Circuit Limit
IB
IS
IQS
ISD
IOW
Input Bias Current
Supply Current, Measure Mode
(Note 7)
Supply Current, Standby
ppm
60
2nd Reference Voltage
Regulator Pin Voltage
ppm/°C
l
2.5
2.5
2.75
2.9
V
V
l
l
4.5
4.5
5.0
5.0
5.5
V
V
l
8
In/Out of Pins C1 Through C12
When Measuring Cell
When Not Measuring Cell
Current Into the V+ Pin When Measuring
Continuous Measuring (CDC = 2)
Continuous Measuring (CDC = 2)
Measure Every 130ms (CDC = 5)
Measure Every 500ms (CDC = 6)
Measure Every 2 Seconds (CDC = 7)
Current Into V+ Pin When In Standby, All Serial
Port Pin at Logic “1”
LTC6803IG
LTC6803HG
Supply Current, Hardware Shutdown
Current Out of V–, VC12 = 43.2V, V+ Floating
(Note 8)
Discharge Switch-On Resistance
VCELL > 3V (Note 3)
Current Used for Open-Wire Detection
ppm/√kHr
2.25
2.1
–10
l
l
l
l
l
l
mA
1
10
µA
nA
620
600
190
140
55
780
780
250
175
70
1000
1150
360
250
105
µA
µA
µA
µA
µA
8
12
16.5
µA
6
6
12
12
18
19
µA
µA
0.001
1
µA
20
Ω
140
µA
l
l
10
l
70
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
110
145
°C
5
°C
Voltage Mode Timing Specifications
tCYCLE
Measurement Cycling
t1
SDI Valid to SCKI Rising Setup
l
10
ns
t2
SDI Valid to SCKI Rising Hold
l
250
ns
t3
SCKI Low
l
400
ns
t4
SCKI High
l
400
ns
t5
CSBI Pulse Width
l
400
ns
t6
CSBI Falling to SCKI Rising
l
100
ns
t7
CSBI Falling to SDO Valid
l
100
ns
t8
SCKI Falling to SDO Valid
l
250
Clock Frequency
l
1
Watchdog Timer Timeout Period
l
Time Required to Measure 12 Cells
Time Required to Measure 10 Cells
Time Required to Measure 3 Temperatures
Time Required to Measure 1 Cell or Temperature
l
l
l
l
11
9
2.8
1.0
1
13
11
3.4
1.2
15
13
4.1
1.4
2.5
ms
ms
ms
ms
ns
MHz
Seconds
680324fa
4
LTC6803-2/LTC6803-4
ELECTRICAL
CHARACTERISTICS
The
l denotes the specifications which apply over the full operating
+
–
temperature range, otherwise specifications are at TA = 25°C. V = 43.2V, V = 0V, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Voltage Mode Digital I/O
VIH
Digital Input Voltage High
Pins SCKI, SDI and CSBI
l
VIL
Digital Input Voltage Low
Pins SCKI, SDI and CSBI
l
0.8
VOL
Digital Output Voltage Low
Pin SDO, Sinking 500µA
l
0.3
V
IIN
Digital Input Current
VMODE, TOS, SCKI, SDI, CSBI
l
10
µA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The ADC specifications are guaranteed by the Total Measurement
Error (VERR) specification.
Note 3: Due to the contact resistance of the production tester, this
specification is tested to relaxed limits. The 20Ω limit is guaranteed by
design.
Note 4: VCELL refers to the voltage applied across Cn to Cn – 1 for
n = 1 to 12. VTEMP refers to the voltage applied from VTEMP1 or VTEMP2
to V–.
2
V
V
Note 5: These absolute maximum ratings apply provided that the voltage
between inputs do not exceed the absolute maximum ratings.
Note 6: Supply current is tested during continuous measuring. The supply
current during periodic measuring (130ms, 500ms, 2s) is guaranteed by
design.
Note 7: The CDC = 5, 6 and 7 supply currents are not measured. They are
guaranteed by the CDC = 2 supply current measurement.
Note 8: Limit is determined by high speed automated test capability.
TYPICAL PERFORMANCE CHARACTERISTICS
Cell Measurement Error
vs Cell Input Voltage
0
1.5
0
–1.5
–3.0
–4.5
0
–5
–10
C = 0µF
C = 0.1µF
C = 1µF
C = 3.3µF
CELL 1, 13ms CELL MEASUREMENT
REPETITION
VCELL = 3.3V
–15
–20
–25
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
CELL INPUT VOLTAGE (V)
680324 G01
CELL VOLTAGE ERROR (mV)
3.0
Cell Measurement Error
vs Input RC Values
5
TA = 125°C
TA = 85°C
TA = 25°C
TA = –40°C
CELL VOLTAGE ERROR (mV)
TOTAL UNADJUSTED ERROR (mV)
4.5
Cell Measurement Error
vs Input RC Values
–30
0
1
2
3
7 8
4 5 6
INPUT RESISTANCE (kΩ)
9
10
680324 G02
CELLS 2 TO 12, 13ms CELL
MEASUREMENT REPETITION
VCELL = 3.3V
–5
–10
–15
–20
C = 0µF
C = 0.1µF
C = 1µF
C = 3.3µF
–25
–30
0
1
2
3
7 8
4 5 6
INPUT RESISTANCE (kΩ)
9
10
680324 G03
680324fa
5
LTC6803-2/LTC6803-4
TYPICAL PERFORMANCE CHARACTERISTICS
Cell Voltage Measurement Error
vs Common Mode Voltage
10
1
0.1
–0.8 –0.6 –0.4 –0.2 0 0.2 0.4 0.6 0.8 1.0
V+ – VC12 (V)
0
–2
–4
–6
–8
VCELL = 3.6V
TA = 25°C
CELL2 ERROR vs VC1
CELL3 ERROR vs VC2
CELLn ERROR VS VCn–1,
n = 4 TO 12
–10
–12
–14
0
1
2
4
3
COMMON MODE VOLTAGE (V)
680324 G05
Cell 1 Voltage Measurement Error
vs Temperature
Cell 2 Voltage Measurement Error
vs Temperature
0.25
–0.50
–1.25
–2.00
–50 –30 –10 10 30 50 70 90 110 130
TEMPERATURE (°C)
2.50
CELL MEASUREMENT ERROR (mV)
VCELL = 0.8V
V+ = 9.6V
4 SAMPLES
VCELL = 0.8V
V+ = 9.6V
4 SAMPLES
1.75
1.00
0.25
–0.50
–1.25
–2.00
–50 –30 –10 10 30 50 70 90 110 130
TEMPERATURE (°C)
Measurement Gain Error
Hysteresis
20
TA = 85°C TO 25°C
18
1
0.1
–1.0 –0.8 –0.6 –0.4 –0.2 0 0.2 0.4 0.6 0.8 1.0
VIN CELL6 (V)
Cell 3 to Cell 12 Voltage
Measurement Error vs Temperature
1.75
1.00
0.25
–0.50
–1.25
680324 G09
Cell Measurement Common Mode
Rejection
0
TA = –45°C TO 25°C
VCM(IN) = 5VP-P
72dB REJECTION
–10 CORRESPONDS TO
LESS THAN 1 BIT
–20 AT ADC OUTPUT
NUMBER OF UNITS
14
12
10
8
6
680324 G10
–40
–60
2
0
–250 –200 –150 –100 –50 0 50 100 150 200
CHANGE IN GAIN ERROR (ppm)
–30
–50
4
5
VCELL = 0.8V
V+ = 9.6V
4 SAMPLES
–2.00
–50 –30 –10 10 30 50 70 90 110 130
TEMPERATURE (°C)
16
10
CELL6
10
Measurement Gain Error
Hysteresis
20
NUMBER OF UNITS
100
680324 G08
680324 G07
15
ALL OTHER CELLS = 3V
680324 G06
REJECTION (dB)
1.00
25
5
680324 G04
1.75
CELL MEASUREMENT ERROR (mV)
1000
2
CELL VOLTAGE MEASUREMENT ERROR (mV)
TA = 25°C
VCELL = 3.3V
CELL MEASUREMENT ERROR (mV)
CELL 12 MEASUREMENT ERROR (mV)
100
Cell Measurement Error
vs Cell Voltage
CELL MEASUREMENT ERROR (mV)
Cell 12 Measurement Error vs V+
0
–250 –200 –150 –100 –50 0 50 100 150 200
CHANGE IN GAIN ERROR (ppm)
680324 G11
–70
10
100
1k
10k 100k
FREQUENCY (Hz)
1M
10M
680324 G12
680324fa
6
LTC6803-2/LTC6803-4
TYPICAL PERFORMANCE CHARACTERISTICS
ADC Normal Mode Rejection
vs Frequency
ADC INL
2.0
1.0
–10
1.5
0.8
0.6
1.0
–30
–40
–50
0.4
0.5
DNL (BITS)
INL (BITS)
–20
0
–0.5
–60
–1.5
–70
–2.0
10
100
1k
10k
FREQUENCY (Hz)
100k
–0.8
1
0
2
3
INPUT (V)
4
850
16
40
30
25
20
15
C12
10
10
8
6
4
C6
5
0
20 40 60 80 100 120
TEMPERATURE (°C)
10
0
20
40
30
SUPPLY VOLTAGE (V)
CDC = 2
CONTINUOUS CONVERSION
4.5
10 SAMPLES
10
5
0
–5
–10
0
25
60
7000
125°C
85°C
25°C
–40°C
650
600
0
10
20
40
30
SUPPLY VOLTAGE (V)
50
75
100
TEMPERATURE (°C)
50
60
680324 G18
External Temperature
Measurement Total Unadjusted
Error vs Input
Internal Die Temperature
Measurement Error Using an
8mV/°K Scale Factor
15
50
750
680324 G17
680324 G16
TOTAL UNADJUSTED ERROR (mV)
0
125°C
85°C
25°C
–40°C
2
C1
5
4
800
12
SUPPLY CURRENT (µA)
35
3
2
INPUT (V)
1
Supply Current vs Supply Voltage
During Continuous Conversions
14
E = (AMBIENT TEMP-INTERNAL
DIE TEMP READING) (°C)
CELL INPUT BIAS CURRENT (nA)
0
680324 G15
Standby Supply Current
vs Supply Voltage
CELL INPUT = 3.6V
0
–40 –20
–1.0
5
680324 G14
Cell Input Bias Current During
Standby and Hardware Shutdown
50
0
–0.2
–0.6
680324 G13
45
0.2
–0.4
–1.0
SUPPLY CURRENT (µA)
REJECTION (dB)
ADC DNL
0
125
150
680324 G19
3.0
TA = 125°C
TA = 85°C
TA = 25°C
TA = –40°C
1.5
0
–1.5
–3.0
–4.5
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
TEMPERATURE INPUT VOLTAGE (V)
680324 G20
680324fa
7
LTC6803-2/LTC6803-4
TYPICAL PERFORMANCE CHARACTERISTICS
VREF Output Voltage
vs Temperature
VREF Line Regulation
VREF Load Regulation
3.070
3.09
3.068
3.074
3.072
3.08
3.070
3.062
3.07
TA = 85°C
TA = 25°C
3.06
3.060
3.05
5 REPRESENTATIVE UNITS
–25
25
75
0
50
TEMPERATURE (°C)
100
125
3.04
0
3.060
1000
10
100
SOURCING CURRENT (µA)
5.5
V+ = 43.2V
4.8
50
VREG (V)
4.5
0
2
4
6
8
SUPPLY CURRENT (mA)
10
12
4.0
TA = 125°C
TA = 85°C
TA = 25°C
TA = –40°C
0
10
60
TA = 105°C
TA = 85°C
TA = 25°C
TA = –45°C
45
5.0
4.2
50
Internal Discharge Resistance
vs Cell Voltage
CDC = 2
CONTINUOUS CONVERSIONS
5.0
TA = 125°C
TA = 85°C
TA = 25°C
TA = –40°C
20
30
40
SUPPLY VOLTAGE (V)
680324 G23
VREG Line Regulation
4.4
10
0
680324 G22
VREG Load Regulation
4.6
TA = –40°C
3.062
680324 G21
5.2
TA = 85°C
3.066
DISCHARGE RESISTANCE (Ω)
3.056
–50
TA = 25°C
3.068
3.064
TA = –40°C
3.058
VREG (V)
VREF (V)
3.064
VREF (V)
VREF (V)
3.066
4.0
NO EXTERNAL LOAD ON VREF, CDC = 2
(CONTINUOUS CELL CONVERSIONS)
20
30
40
SUPPLY VOLTAGE (V)
50
40
35
30
25
20
15
10
5
0
60
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
CELL VOLTAGE (V)
680324 G26
680324 G24
680324 G25
Die Temperature Increase vs
Discharge Current in Internal FET
Cell Conversion Time
13.20
ALL 12 CELLS AT 3.6V
45 VS = 43.2V
TA = 25°C
40
13.15
35
30
12 CELLS
DISCHARGING
25
20
15
6 CELLS
DISCHARGING
1 CELL
DISCHARGING
10
13.10
13.05
13.00
12.95
12.90
12.85
5
0
CONVERSION TIME (ms)
INCREASE IN DIE TEMPERATURE (°C)
50
0
10 20 30 40 50 60 70 80
DISCHARGE CURRENT PER CELL (mA)
680324 G27
12.80
–40 –20
0
20 40 60 80
TEMPERATURE (°C)
100 120
680324 G28
680324fa
8
LTC6803-2/LTC6803-4
PIN FUNCTIONS
To ensure pin compatibility with LTC6802-2, the LTC6803‑2
is configured such that the bottom cell input (C0) is connected internally to the negative supply voltage (V–). The
LTC6803-4 offers a unique pinout with an input for the
bottom cell (C0). This simple functional difference offers
the possibility for enhanced cell 1 measurement accuracy,
enhanced SPI noise tolerance and simplified wiring. More
information is provided in the Applications Information
section entitled Advantages of Kelvin Connection for C0.
V+ (Pin 1): Positive Power Supply. Pin 1 can be tied to the
most positive potential in the battery stack or an isolated
power supply. V+ must be greater than the most positive
potential in the battery stack under normal operation. With
an isolated power supply, LTC6803 can be turned off by
simply shutting down V+.
C12, C11, C10, C9, C8, C7, C6, C5, C4, C3, C2, C1
(Pins 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24): C1
through C12 are the inputs for monitoring battery cell
voltages. The negative terminal of the bottom cell should
be tied to the V– pin for the LTC6803-2, and the C0 pin for
the LTC6803-4. The next lowest potential is tied to C1 and
so forth. See the figures in the Applications Information
section for more details on connecting batteries to the
LTC6803-2 and LTC6803-4. The LTC6803 can monitor a
series connection of up to 12 cells. Each cell in a series
connection must have a common mode voltage that is
greater than or equal to the cells below it. 100mV negative
voltages are permitted.
C0 (Pin 26 on LTC6803-4): Negative Terminal of the Bottom Battery Cell. C0 and V– form a Kelvin connection to
eliminate effect of voltage drop at the V– trace.
S12, S11, S10, S9, S8, S7, S6, S5, S4, S3, S2, S1 (Pins
3, 5, 7, 9, 11, 13, 15, 17, 19, 21, 23, 25): S1 though
S12 pins are used to balance battery cells. If one cell in a
series becomes overcharged, an S output can be used to
discharge the cell. Each S output has an internal N-channel
MOSFET for discharging. See the Block Diagram. The NMOS
has a maximum on-resistance of 20Ω. An external resistor
should be connected in series with the NMOS to dissipate
heat outside of the LTC6803 package. When using the
internal MOSFETs to discharge cells, the die temperature
should be monitored. See Power Dissipation and Thermal
Shutdown in the Applications Information section. The S
pins also feature an internal pull-up PMOS. This allows the
S pins to be used to drive the gates of external MOSFETs
for higher discharge capability.
V– (Pin 26 on LTC6803-2/Pin 27 on LTC6803-4): Connect
V– to the most negative potential in the series of cells.
NC (Pin 27 on LTC6803-2/Pin 28 on LTC6803-4): This pin
is not used and is internally connected to V– through 10Ω.
It can be left unconnected or connected to V– on the PCB.
VTEMP1, VTEMP2 (Pins 28, 29 on LTC6803-2/Pins 29, 30,
on LTC6803-4): Temperature Sensor Inputs. The ADC will
measure the voltage on VTEMPn with respect to V– and store
the result in the TMP register. The ADC measurements
are relative to the VREF pin voltage. Therefore a simple
thermistor and resistor combination connected to the
VREF pin can be used to monitor temperature. The VTEMP
inputs can also be general purpose ADC inputs.
VREF (Pin 30 on LTC6803-2/Pin 31 on LTC6803-4): 3.065V
Voltage Reference Output. This pin should be bypassed
with a 1µF capacitor. The VREF pin can drive a 100k resistive load connected to V–. Larger loads should be buffered
with an LT6003 op amp, or a similar device.
VREG (Pin 31 on LTC6803-2/Pin 32 on LTC6803-4): Linear
Voltage Regulator Output. This pin should be bypassed with
a 1µF capacitor. The VREG is capable of sourcing up to 4mA
to an external load. The VREG pin does not sink current.
TOS (Pin 32 on LTC6803-2/Pin 33 on LTC6803-4): Top
of Stack Input. The TOS pin can be tied to VREG or V– for
the LTC6803. The state of the TOS pin alters the operation
of the SDO pin in the toggle polling mode. See the Serial
Port description.
NC (Pin 33 on LTC6803-2): No Connection.
680324fa
9
LTC6803-2/LTC6803-4
PIN FUNCTIONS
WDTB (Pin 34): Watchdog Timer Output (Active Low). If
there is no valid command received in 1 to 2.5 seconds, the
WDTB output is asserted. The WDTB pin is an open-drain
NMOS output. When asserted it pulls the output down to
V– and resets the conﬁguration register to its default state.
A0, A1, A2, A3 (Pins 37, 38, 39, 40): Address Inputs.
These pins are tied to VREG or V–. The state of the address
pins (VREG = 1, V– = 0) determines the LTC6803 address.
See Address Commands in the Serial Port subsection of
the Applications Information section.
GPIO1, GPIO2 (Pins 35, 36): General Purpose Input/
Output. By writing a “0” to a GPIO configuration register
bit, the open-drain output is activated and the pin is pulled
to V–. By writing a logic “1” to the configuration register
bit, the corresponding GPIO pin is high impedance. An
external resistor is required to pull the pin up to VREG.
By reading the configuration register locations GPIO1
and GPIO2, the state of the pins can be determined. For
example, if a “0” is written to register bit GPIO1, a “0” is
always read back because the output N-channel MOSFET
pulls Pin 35 to V–. If a “1” is written to register bit GPIO1,
the pin becomes high impedance. Either a “1” or a “0” is
read back, depending on the voltage present at Pin 35.
The GPIOs makes it possible to turn-on/off circuitry around
the LTC6803-4, or read logic values from a circuit around
the LTC6803-4. The GPIO pins should be connected to
V– if not used.
SCKI (Pin 41): Serial Clock Input. The SCKI pin interfaces to any logic gate (TTL levels). See Serial Port in the
Applications Information section.
SDI (Pin 42): Serial Data Input. The SDI pin interfaces to
any logic gate (TTL levels). See Serial Port in the Applications Information section.
SDO (Pin 43): Serial Data Output. The SDO pin is an NMOS
open-drain output. A pull-up resistor is needed on SDO.
See Serial Port in the Applications Information section.
CSBI (Pin 44): Chip Select (Active Low) Input. The CSBI
pin interfaces to any logic gate (TTL levels). See Serial
Port in the Applications Information section.
680324fa
10
LTC6803-2/LTC6803-4
BLOCK DIAGRAMS
1
LTC6803-2
V+
2nd REFERENCE
2
3
4
REGULATOR
VREF2
C12
S12
WATCHDOG
TIMER
VREG
WDTB
22
23
24
34
C11
A3
A2
21
31
A1
S3
∆Σ A/D
CONVERTER
MUX
C2
12
RESULTS
REGISTER
AND
COMMUNICATIONS
S2
A0
CSBI
SDO
SDI
SCKI
C1
40
39
38
37
44
43
42
41
REFERENCE
25
26
S1
GPIO2
V–
CONTROL
EXTERNAL
TEMP
DIE
TEMP
NC
27
VTEMP1
28
VTEMP2
29
GPIO1
TOS
39
38
32
VREF
30
68032 BD
680324fa
11
LTC6803-2/LTC6803-4
BLOCK DIAGRAMS
1
LTC6803-4
V+
2nd REFERENCE
2
3
4
REGULATOR
VREF2
C12
S12
WATCHDOG
TIMER
VREG
WDTB
22
23
24
A3
A1
S3
MUX
C2
12
∆Σ A/D
CONVERTER
RESULTS
REGISTER
AND
COMMUNICATIONS
S2
26
27
A0
CSBI
SDO
SDI
C1
SCKI
REFERENCE
25
34
C11
A2
21
32
GPIO2
S1
C0
CONTROL
V
–
EXTERNAL
TEMP
DIE
TEMP
VTEMP1
NC
28
29
GPIO1
TOS
VTEMP2
40
39
38
37
44
43
42
41
36
35
33
VREF
30
31
68033 BD
TIMING DIAGRAM
Timing Diagram of the Serial Interface
t1
t4
t2
t6
t3
t7
SCKI
D3
SDI
D2
D1
D0
D7···D4
D3
t5
CSBI
t8
SDO
D4
D3
PREVIOUS
COMMAND
D2
D1
D0
D7···D4
CURRENT
COMMAND
D3
68034 TD
680324fa
12
LTC6803-2/LTC6803-4
OPERATION
THEORY OF OPERATION
The LTC6803 is a data acquisition IC capable of measuring the voltage of 12 series connected battery cells.
An input multiplexer connects the batteries to a 12-bit
delta-sigma analog-to-digital converter (ADC). An internal
8ppm/°C voltage reference combined with the ADC give
the LTC6803 its outstanding measurement accuracy. The
inherent beneﬁts of the delta-sigma ADC versus other types
of ADCs (e.g., successive approximation) are explained
in Advantages of Delta-Sigma ADCs in the Applications
Information section.
Communication between the LTC6803 and a host processor
is handled by a SPI compatible serial interface. Multiple
LTC6803s can be connected to a single serial interface.
As shown in Figure 1, the LTC6803-2s or LTC6803-4s
are isolated from one another using digital isolators. A
unique addressing scheme allows all the LTC6803-2s or
LTC6803‑4s to connect to the same serial port of the host
processor. Further explanation of the LTC6803-2/LTC68034 can be found in the Serial Port section of the data sheet.
The LTC6803 also contains circuitry to balance cell voltages.
Internal MOSFETs can be used to discharge cells. These
internal MOSFETs can also be used to control external
balancing circuits. Figure 1 illustrates cell balancing by
internal discharge. Figure 3 shows the S pin controlling
an external balancing circuit. It is important to note that
the LTC6803 makes no decisions about turning on/off
the internal MOSFETs. This is completely controlled by
the host processor. The host processor writes values to
a conﬁguration register inside the LTC6803 to control the
switches. The watchdog timer on the LTC6803 can be used
to turn off the discharge switches if communication with
the host processor is interrupted.
Since the LTC6803-4 separates C0 and V–, C0 can have
higher potential than V–. This feature is very useful for
super capacitors and fuel cells whose voltages can go to
zero or slightly negative. In such a case, the stacked cells
can’t power the LTC6803-4. In Figure 1, an isolated 36V
and –3.6V provides power to each LTC6803-4. This allows
the C1 to C12 pins to go up to 3.6V below C0.
The LTC6803 has three modes of operation: hardware
shutdown, standby and measure. Hardware shutdown is
a true zero power mode. Standby mode is a power saving
state where all circuits except the serial interface are turned
off. In measure mode, the LTC6803 is used to measure
cell voltages and store the results in memory. Measure
mode will also monitor each cell voltage for overvoltage
(OV) and undervoltage (UV) conditions.
HARDWARE SHUTDOWN MODE
The V+ pin can be disconnected from the C pins and the
battery pack. If the V+ supply pin is 0V, the LTC6803 will
typically draw less than 1nA from the battery cells. All
circuits inside the IC are off. It is not possible to communicate with the IC when V+ = 0V. See the Applications
Information section for hardware shutdown circuits.
STANDBY MODE
The LTC6803 defaults (powers up) to standby mode.
Standby mode is the lowest supply current state with a
supply connected. Standby current is typically 12µA when
V+ = 44V. All circuits are turned off except the serial interface
and the voltage regulator. For the lowest possible standby
current consumption, all SPI logic inputs should be set to
logic 1 level. The LTC6803 can be programmed for standby
mode by setting the comparator duty cycle configuration
bits, CDC[2:0], to 0. If the part is put into standby mode
while ADC measurements are in progress, the measurements will be interrupted and the cell voltage registers will
be in an indeterminate state. To exit standby mode, the CDC
bits must be written to a value other than 0.
MEASURE MODE
The LTC6803 is in measure mode when the CDC bits are
programmed with a value from 1 to 7. When CDC = 1 the
LTC6803 is on and waiting for a start ADC conversion
command. When CDC is 2 through 7 the IC monitors each
cell voltage and produces an interrupt signal on the SDO
pin indicating all cell voltages are within the UV and OV
limits. The value of the CDC bits determines how often
the cells are monitored, and, how much average supply
current is consumed.
680324fa
13
LTC6803-2/LTC6803-4
OPERATION
LTC6803-4
IC #1
CSBI
V
SDO
C12
SDI
S12
SCKI
C11
A3
S11
A2
C10
A1
S10
A0
C9
GPIO2
S9
GPIO1
C8
WDTB
S8
TOS
C7
VREG
S7
C6
VREF
S6
VTEMP2
C5
VTEMP1
V2 –
OE2
+
+
+
+
+
+
+
+
+
+
+
S5
C4
S4
C3
S3
C2
V1–
OE1
LTC6803-4
IC #7
CSBI
V
SDO
C12
SDI
S12
SCKI
C11
A3
S11
A2
C10
A1
S10
A0
C9
GPIO2
S9
GPIO1
C8
WDTB
S8
TOS
C7
VREG
S7
C6
VREF
S6
VTEMP2
C5
VTEMP1
+
ADDRESS1
V2 –
V1–
V2 +
V1+
DIGITAL
ISOLATOR
+
3V
+
+
+
+
+
+
NC
V–
C0
S1
C1
S2
ISOLATED
DC/DC
CONVERTER
V2 –
OE2
+
12V
S5
C4
S4
C3
S3
C2
+
+
+
+
NC
V–
C0
S1
C1
S2
ADDRESS7
V1–
OE1
V2 –
V1–
V2 +
V1+
DIGITAL
ISOLATOR
ISOLATED
DC/DC
CONVERTER
3V
12V
680324 F01
+
3V
+
+
+
+
+
+
+
+
+
+
+
LTC6803-4
IC #0
CSBI
V+
SDO
C12
SDI
S12
SCKI
C11
A3
S11
A2
C10
A1
S10
A0
C9
GPIO2
S9
GPIO1
C8
WDTB
S8
TOS
C7
VREG
S7
C6
VREF
S6
VTEMP2
C5
VTEMP1
S5
C4
S4
C3
S3
C2
NC
V–
C0
S1
C1
S2
V2 –
OE2
V1–
OE1
–
–
MPU
MISO
CS
MODULE
IO
M0SI
ADDRESS0
V2
V1
V2 +
V1+
DIGITAL
ISOLATOR
ISOLATED
DC/DC
CONVERTER
CLK
3V
12V
+
Figure 1. Simplified 96-Cell Battery or Supercapacitor, Isolated Interface. In this Diagram the Battery
Negative is Isolated from the Module Ground. Isolated Power Supplies Each LTC6803-4. Opto-Couplers
or Digital Isolators Allow Each IC to Be Addressed Individually
680324fa
14
LTC6803-2/LTC6803-4
OPERATION
There are two methods for indicating the UV/OV interrupt status: toggle polling (using a 1kHz output signal)
and level polling (using a high or low output signal). The
polling methods are described in the Serial Port section.
The UV/OV limits are set by the VUV and VOV values in the
configuration registers. When a cell voltage exceeds the
UV/OV limits a bit is set in the flag register. The UV and
OV flag status for each cell can be determined using the
Read Flag Register Group.
An ADC measurement can be requested at any time when
the IC is in measure mode. To initiate cell voltage measurements while in measure mode, a Start A/D Conversion
command is sent. After the command has been sent, the
LTC6803 will indicate the A/D converter status via toggle
polling or level polling (as described in the Serial Port
section). During cell voltage measurement commands,
the UV and OV flags (within the flag register group) are
also updated. When the measurements are complete, the
part will continue monitoring UV and OV conditions at
the rate designated by the CDC bits. Note that there is a
5µs window during each UV/OV comparison cycle where
an ADC measurement request may be missed. This is
an unlikely event. For example, the comparison cycle is
2 seconds when CDC = 7. Use the CLEAR command to
detect missing ADC commands.
Operating with Less than 12 Cells
If fewer than 12 cells are connected to the LTC6803, the
unused input channels must be masked. The MCxI bits in
the configuration registers are used to mask channels. In
addition, the LTC6803 can be configured to automatically
bypass the measurements of the top 2 cells, reducing power
consumption and measurement time. If the CELL10 bit is
high, the inputs for cell 11 and cell 12 are masked and only
the bottom 10-cell voltages will be measured. By default,
the CELL10 bit is low, enabling measurement of all 12-cell
voltages. Additional information regarding operation with
less than 12 cells is provided in the applications section.
ADC RANGE AND OUTPUT FORMAT
The ADC outputs a 12-bit code with an offset of 0x200
(512 decimal). The input voltage can be calculated as:
VIN = (DOUT – 512) • VLSB; VLSB = 1.5mV
where DOUT is a decimal integer.
For example, a 0V input will have an output reading of 0x200.
An ADC reading of 0x000 means the input was –0.768V. The
absolute ADC measurement range is –0.768V to 5.376V.
The resolution is VLSB = 1.5mV = (5.376 + 0.768)/212. The
useful range is –0.3V to 5V. This range allows monitoring
supercapacitors which could have small negative voltage.
Inputs below –0.3V exceed the absolute maximum rating
of the C pins. If all inputs are negative, the ADC range is
reduced to –0.1V. Inputs above 5V will have noisy ADC
readings (see Typical Performance Characteristics).
ADC MEASUREMENTS DURING CELL BALANCING
The primary cell voltage ADC measurement commands
(STCVAD and STOWAD) automatically turn off a cell’s
discharge switch while its voltage is being measured. The
discharge switches for the cell above and the cell below will
also be turned off during the measurement. For example,
discharge switches S4, S5 and S6 will be off while cell 5
is being measured. The UV/OV comparison conversions in
CDC modes 2 through 7 also cause a momentary turn-off
of the discharge switch. For example, switches S4, S5 and
S6 will be off while cell 5 is checked for a UV/OV condition.
In some systems it may be desirable to allow discharging to
continue during cell voltage measurements. The cell voltage
ADC conversion commands STCVDC and STOWDC allow
the discharge switches to remain on during cell voltage
measurements. This feature allows the system to perform
a self test to verify the discharge functionality.
680324fa
15
LTC6803-2/LTC6803-4
OPERATION
ADC REGISTER CLEAR COMMAND
The clear command can be used to clear the cell voltage
registers and temperature registers. The clear command
will set all registers to 0xFFF. This command is used to
make sure conversions are being made. When cell voltages are stable, ADC results could stay the same. If a start
ADC conversion command is sent to the LTC6803 but the
PEC fails to match then the command is ignored and the
voltage register contents also will not change. Sending a
clear command then reading back register contents is a
way to make sure LTC6803 is accepting commands and
performing new measurements. The clear command takes
1ms to execute.
ADC CONVERTER SELF TEST
Two self-test commands can be used to verify the functionality of the digital portions of the ADC. The self tests
also verify the cell voltage registers and temperature
monitoring registers. During these self tests a test signal
is applied to the ADC. If the circuitry is working properly all
cell voltage and temperature registers will contain 0x555
or 0xAAA. The time required for the self-test function is
the same as required to measure all cell voltages or all
temperature sensors.
MULTIPLEXER AND REFERENCE SELF TEST
The LTC6803 uses a multiplexer to measure the 12 battery cell inputs as well as the temperature signals. A
diagnostic command is used to validate the function of
the multiplexer, the temperature sensor, and the precision
reference circuit. Diagnostic registers will be updated after
each diagnostic test. The muxfail bit of the registers will
be 1 if the multiplexer self test fails.
A constant voltage generated by the 2nd reference circuit
will be measured by the ADC and the results written to the
diagnostic register. The voltage reading should be 2.5V
±16%. Readings outside this range indicate a failure of
the temperature sensor circuit, the precision reference
circuit, or the analog portion of the ADC. The DAGN command executes in 16.4ms, which is the sum of the 12-cell
tCYCLE and the 3 temperature tCYCLE. The diagnostic read
command can be used to read the registers.
USING THE GENERAL PURPOSE INPUTS/OUTPUTS
(GPIO1, GPIO2)
The LTC6803 has two general purpose digital input/output
pins. By writing a GPIO configuration register bit to a logic
low, the open-drain output can be activated. The GPIOs
give the user the ability to turn on/off circuitry around
the LTC6803. One example might be a circuit to verify the
operation of the system.
When a GPIO configuration bit is written to a logic high,
the corresponding GPIO pin may be used as an input.
The read back value of that bit will be the logic level that
appears at the GPIO pins.
WATCHDOG TIMER CIRCUIT
The LTC6803 includes a watchdog timer circuit. The
watchdog timer is on for all modes except CDC = 0. The
watchdog timer times out if no valid command is received
for 1 to 2.5 seconds. When the watchdog timer circuit
times out, the WDTB open-drain output is asserted low
and the configuration register bits are reset to their default
(power-up) state. In the power-up state, CDC is 0, the S
outputs are off and the IC is in the low power standby
mode. The WDTB pin remains low until a valid command
is received. The watchdog timer provides a means to turn
off cell discharging should communications to the MPU
be interrupted. There is no need for the watchdog timer
at CDC = 0 since discharging is off. The open-drain WDTB
output can be wire ORd with other external open-drain
signals. Pulling the WDTB signal low will not initiate a
watchdog event, but the CNFGO bit 7 will reflect the state
of this signal. Therefore, the WDTB pin can be used to
monitor external digital events if desired.
SERIAL PORT
Overview
The LTC6803-2/LTC6803-4 has an SPI bus compatible
serial port. Devices can be connected in parallel, using
digital isolators. Multiple devices are uniquely identiﬁed by
a part address determined by the A0 to A3 pins. Physical
Layer on the LTC6803-2/LTC6803-4, four pins comprise
the serial interface: CSBI, SCKI, SDI and SDO. The SDO
680324fa
16
LTC6803-2/LTC6803-4
OPERATION
and SDI may be tied together, if desired, to form a single,
bi-directional port. Four address pins (A0 to A3) set the
part address for address commands. The TOS pin designates the top device (logic high) for polling commands.
All interface pins are voltage mode, with voltage levels
sensed with respect to the V– supply. See Figure 1.
Network Layer
Data Link Layer
x8 + x2 + x + 1
Clock Phase And Polarity: The LTC6803 SPI compatible interface is conﬁgured to operate in a system using
CPHA = 1 and CPOL = 1. Consequently, data on SDI must
be stable during the rising edge of SCKI.
To calculate the 8-bit PEC value, a simple procedure can
be established:
Data Transfers: Every byte consists of 8 bits. Bytes are
transferred with the most significant bit (MSB) ﬁrst. On a
write, the data value on SDI is latched into the device on
the rising edge of SCKI (Figure 2). Similarly, on a read, the
data value output on SDO is valid during the rising edge of
SCKI and transitions on the falling edge of SCKI (Figure 3).
CSBI must remain low for the entire duration of a command sequence, including between a command byte and
subsequent data. On a write command, data is latched in
on the rising edge of CSBI.
PEC Byte: The packet error code (PEC) byte is a cyclic
redundancy check (CRC) value calculated for all of the
bits in a register group in the order they are passed, using the initial PEC value of 01000001 and the following
characteristic polynomial:
1. Initialize the PEC to 0100 0001.
2. For each bit DIN coming into the register group, set IN0
= DIN XOR PEC[7], then IN1 = PEC[0] XOR IN0, IN2 =
PEC[1] XOR IN0.
3. Update the 8-bit PEC as PEC[7] = PEC[6], PEC[6] =
PEC[5],……PEC[3] = PEC[2], PEC[2] = IN2, PEC[1]
= IN1, PEC[0] = IN0.
4. Go back to step 2 until all data are shifted. The 8-bit
result is the final PEC byte.
CSBI
SCKI
SDI
MSB (CMD) BIT 6 (CMD)
LSB (CMD) MSB (DATA)
LSB (DATA)
68034 F02
Figure 2. Transmission Format (Write)
CSBI
SCKI
SDI
SDO
MSB (CMD) BIT 6 (CMD)
LSB (CMD)
MSB (DATA)
LSB (DATA)
68034 F03
Figure 3. Transmission Format (Read)
680324fa
17
LTC6803-2/LTC6803-4
OPERATION
An example to calculate the PEC is listed in Table 1 and
Figure 4. The PEC of the 1 byte data 0x01 is computed as
0xC7 after the last bit of the byte streamed in. For multiple
byte data, PEC is valid at the end (LSB) of the last byte.
value of 1000 and 4 address bits. Following the address
command is its PEC byte. The third and fourth bytes are
the command byte and its PEC byte respectively. See the
Bus Protocols and Commands section.
LTC6803 calculates PEC byte for any command or data
received and compares it with the PEC byte following the
command or data. The command or data is regarded as
valid only if the PEC bytes match. LTC6803 also attaches
the calculated PEC byte at the end of the data it shifts out.
Polling Methods: For ADC conversions, three methods can
be used to determine ADC completion. First, a controller
can start an ADC conversion and wait for the speciﬁed
conversion time to pass before reading the results. The
second method is to hold CSBI low after an ADC start
command has been sent. The ADC conversion status will
be output on SDO (Figure 5). A problem with the second
method is that the controller is not free to do other serial
communication while waiting for ADC conversions to
complete. The third method overcomes this limitation.
The controller can send an ADC start command, perform
other tasks, and then send a poll ADC converter status
(PLADC) command to determine the status of the ADC
conversions (Figure 6). For OV/UV interrupt status, the poll
interrupt status (PLINT) command can be used to quickly
determine whether any cell in a stack is in an overvoltage
or undervoltage condition (Figure 6).
Broadcast Commands: A broadcast command is one to
which all devices on the bus will respond, regardless of
device address. See the Bus Protocols and Commands
sections. With broadcast commands all devices can be
sent commands simultaneously. This is useful for ADC
conversion and polling commands. It can also be used
with write commands when all parts are being written with
the same data. Broadcast read commands should not be
used in the parallel conﬁguration.
Address Commands: An address command is one in which
only the addressed device on the bus responds. The ﬁrst
byte of an address command consists of 4 bits with a
Table 1. Procedure to Calculate PEC Byte
CLOCK
CYCLE
DIN
IN0
IN1
IN2
PEC[7]
PEC[6]
PEC[5]
PEC[4]
PEC[3]
PEC[2]
PEC[1]
PEC[0]
0
0
0
1
0
0
1
0
0
0
0
0
1
1
0
1
1
0
1
0
0
0
0
0
1
0
2
0
0
1
1
0
0
0
0
0
0
1
1
3
0
0
0
1
0
0
0
0
0
1
1
0
4
0
0
0
0
0
0
0
0
1
1
0
0
5
0
0
0
0
0
0
0
1
1
0
0
0
6
0
0
0
0
0
0
1
1
0
0
0
0
7
1
1
1
1
0
1
1
0
0
0
0
0
1
1
0
0
0
1
1
1
8
680324fa
18
1
IN0
DTFF
END
INO = DATAIN XOR PEC[7];
PEC1 = PEC[0] XOR IN0;
PEC2 = PEC[1] XOR IN0;
PEC[7:0] = {PEC[6:2], PEC2, PEC1, IN0};
2
3
4
2
1
BEGIN PEC[7:0] = 0x41
CLK Q
Q
PEC[0]
D
PEC Hardware and Software Example
CLOCK
BEGIN PEC[7:0] = 0x41
INO = DATAIN XOR PEC[7];
DATAIN
XOR
PEC[0]
INO
XOR
PEC1
Q
DTFF
CLK Q
D
PEC[1]
PEC1 = PEC[0] XOR IN0;
XOR
PEC2
Q
PEC[2]
Figure 4
DTFF
CLK Q
D
PEC[2]
PEC2 = PEC[1] XOR IN0;
PEC[1]
IN0
3
DTFF
CLK Q
Q
PEC[3]
D
PEC[3]
4
DTFF
CLK Q
Q
DTFF
CLK Q
D
PEC[5]
PEC[5]
Q
DTFF
CLK Q
D
PEC[6]
PEC[7:0] = {PEC[6:2], PEC2, PEC1, IN0};
END
PEC[4]
PEC[4]
D
Q
PEC[6]
Q
680324 F04
DTFF
CLK Q
D
PEC[7]
PEC[7]
OPERATION
PEC[7]
LTC6803-2/LTC6803-4
680324fa
19
LTC6803-2/LTC6803-4
OPERATION
tCYCLE
CSBI
SCKI
SDI
MSB (CMD) BIT6 (CMD)
LSB (PEC)
SDO
TOGGLE OR LEVEL POLL
680324 F05
Figure 5. Transmission Format (ADC Conversion and Poll)
CSBI
SCKI
SDI
MSB (CMD) BIT6 (CMD)
SDO
LSB (PEC)
TOGGLE OR LEVEL POLL
680324 F06
Figure 6. Transmission Format (PLADC Conversion or PLINT)
Toggle Polling: Toggle polling allows a robust determination both of device states and of the integrity of the connections between the devices in a stack. Toggle polling is
enabled when the LVLPL bit is low. After entering a polling
command, the data out line will be driven by the slave
devices based on their status. When polling for the ADC
converter status, data out will be low when any device is
busy performing an ADC conversion and will toggle at
1kHz when no device is busy. Similarly, when polling for
interrupt status, the output will be low when any device
has an interrupt condition and will toggle at 1kHz when
none has an interrupt condition.
Level Polling: Level polling is enabled when the LVLPL
bit is high. After entering a polling command, the data
out line will be driven by the slave devices based on their
status. When polling for the ADC converter status, data
out will be low when any device is busy performing an
ADC conversion and will be high when no device is busy.
Similarly, when polling for interrupt status, the output will
be low when any device has an interrupt condition and will
be high when none has an interrupt condition.
Toggle Polling—Address Polling: The addressed device
drives the SDO line based on its state alone—low for busy/
in interrupt, toggling at 1kHz for not busy/not in interrupt.
Level polling—Parallel Broadcast Polling: No part address
is sent, so all devices respond simultaneously. If a device
is busy/in interrupt, it will pull SDO low. If a device is not
busy/not in interrupt, then it will release the SDO line. If
any device is busy or in interrupt the SDO signal will be
low. If all devices are not busy/not in interrupt, the SDO
signal will be high. The master controller pulls CSBI high
to exit polling.
Toggle Polling—Parallel Broadcast Polling: No part address is sent, so all devices respond simultaneously. If a
device is busy/in interrupt, it will pull SDO low. If a device
is not busy/not in interrupt, then it will release the SDO line
(TOS = 0) or attempt to toggle the SDO line at 1kHz (TOS
= 1).The master controller pulls CSBI high to exit polling.
Level Polling—Address Polling: The addressed device
drives the SDO line based on its state alone—pulled low
for busy/in interrupt, released for not busy/not in interrupt.
680324fa
20
LTC6803-2/LTC6803-4
OPERATION
Revision Code
Bus Protocols
The diagnostic register group contains a 2-bit revision
code. If software detection of device revision is necessary, then contact the factory for details. Otherwise, the
code can be ignored. In all cases, however, the values of
all bits must be used when calculating the packet error
code (PEC) byte on data reads.
There are 6 different protocol formats, depicted in Table 3
through Table 8. Table 2 is the key for reading the protocol
diagrams.
Table 2. Protocol Key
PEC
Packet Error Code
Master-to-Slave
N
Number of Bits
Slave-to-Master
...
Continuation of Protocol
Complete Byte of
Data
Table 3. Broadcast Poll Command
8
8
Command
PEC
Poll Data
Table 4. Broadcast Read
8
8
8
…
8
8
Command
PEC
Data Byte Low
…
Data Byte High
PEC
A bus collision will occur if multiple devices are on the same serial bus.
Table 5. Broadcast Write
8
8
8
…
8
8
Command
PEC
Data Byte Low
…
Data Byte High
PEC
Table 6. Address Poll Command
4
4
8
8
8
1000
Address
PEC
Command
PEC
Poll Data
Table 7. Address Read
4
4
8
8
8
8
…
8
8
1000
Address
PEC
Command
PEC
Data Byte Low
…
Data Byte High
PEC
See Serial Command examples
Table 8. Address Write
4
4
8
8
8
8
…
8
8
1000
Address
PEC
Command
PEC
Data Byte Low
…
Data Byte High
PEC
680324fa
21
LTC6803-2/LTC6803-4
OPERATION
Commands
Table 9. Command Codes and PEC Bytes
COMMAND DESCRIPTION
NAME
CODE
PEC
Write Configuration Register Group
WRCFG
01
C7
Read Configuration Register Group
RDCFG
02
CE
Read All Cell Voltage Group
RDCV
04
DC
Read Cell Voltages 1-4
RDCVA
06
D2
Read Cell Voltages 5-8
RDCVB
08
F8
Read Cell Voltages 9-12
RDCVC
0A
F6
Read Flag Register Group
RDFLG
0C
E4
Read Temperature Register Group
RDTMP
0E
EA
Start Cell Voltage ADC Conversions and Poll Status
STCVAD
All
Cell 1
Cell 2
Cell 3
Cell 4
Cell 5
Cell 6
Cell 7
Cell 8
Cell 9
Cell 10
Cell 11
Cell 12
Clear (FF)
Self Test1
Self Test2
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
B0
B7
BE
B9
AC
AB
A2
A5
88
8F
86
81
94
93
9A
9D
Start Open-Wire ADC Conversions and Poll Status
STOWAD
All
Cell 1
Cell 2
Cell 3
Cell 4
Cell 5
Cell 6
Cell 7
Cell 8
Cell 9
Cell 10
Cell 11
Cell 12
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
20
27
2E
29
3C
3B
32
35
18
1F
16
11
4
Start Temperature ADC Conversions and Poll Status
STTMPAD
All
External1
External2
Internal
Self Test 1
Self Test 2
30
31
32
33
3E
3F
50
57
5E
59
7A
7D
Poll ADC Converter Status
PLADC
40
07
Poll Interrupt Status
PLINT
50
77
Start Diagnose and Poll Status
DAGN
52
79
Read Diagnostic Register
RDDGNR
54
6B
680324fa
22
LTC6803-2/LTC6803-4
OPERATION
Table 9. Command Codes and PEC Bytes (continued)
COMMAND DESCRIPTION
NAME
Start Cell Voltage ADC Conversions and Poll Status,
with Discharge Permitted
STCVDC
Start Open-Wire ADC Conversions and Poll Status,
with Discharge Permitted
STOWDC
CODE
PEC
All
Cell 1
Cell 2
Cell 3
Cell 4
Cell 5
Cell 6
Cell 7
Cell 8
Cell 9
Cell 10
Cell 11
Cell 12
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
E7
E0
E9
EE
FB
FC
F5
F2
DF
D8
D1
D6
C3
All
Cell 1
Cell 2
Cell 3
Cell 4
Cell 5
Cell 6
Cell 7
Cell 8
Cell 9
Cell 10
Cell 11
Cell 12
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
97
90
99
9E
8B
8C
85
82
AF
A8
A1
A6
B3
Table 10. Configuration (CFG) Register Group
REGISTER
RD/WR
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
CFGR0
RD/WR
WDT
GPIO2
GPIO1
LVLPL
CELL10
CDC[2]
CDC[1]
CDC[0]
CFGR1
RD/WR
DCC8
DCC7
DCC6
DCC5
DCC4
DCC3
DCC2
DCC1
CFGR2
RD/WR
MC4I
MC3I
MC2I
MC1I
DCC12
DCC11
DCC10
DCC9
CFGR3
RD/WR
MC12I
MC11I
MC10I
MC9I
MC8I
MC7I
MC6I
MC5I
CFGR4
RD/WR
VUV[7]
VUV[6]
VUV[5]
VUV[4]
VUV[3]
VUV[2]
VUV[1]
VUV[0]
CFGR5
RD/WR
VOV[7]
VOV[6]
VOV[5]
VOV[4]
VOV[3]
VOV[2]
VOV[1]
VOV[0]
680324fa
23
LTC6803-2/LTC6803-4
OPERATION
Table 11. Cell Voltage (CV) Register Group
REGISTER
RD/WR
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
CVR00
RD
C1V[7]
C1V[6]
C1V[5]
C1V[4]
C1V[3]
C1V[2]
C1V[1]
C1V[0]
CVR01
RD
C2V[3]
C2V[2]
C2V[1]
C2V[0]
C1V[11]
C1V[10]
C1V[9]
C1V[8]
CVR02
RD
C2V[11]
C2V[10]
C2V[9]
C2V[8]
C2V[7]
C2V[6]
C2V[5]
C2V[4]
CVR03
RD
C3V[7]
C3V[6]
C3V[5]
C3V[4]
C3V[3]
C3V[2]
C3V[1]
C3V[0]
CVR04
RD
C4V[3]
C4V[2]
C4V[1]
C4V[0]
C3V[11]
C3V[10]
C3V[9]
C3V[8]
CVR05
RD
C4V[11]
C4V[10]
C4V[9]
C4V[8]
C4V[7]
C4V[6]
C4V[5]
C4V[4]
CVR06
RD
C5V[7]
C5V[6]
C5V[5]
C5V[4]
C5V[3]
C5V[2]
C5V[1]
C5V[0]
CVR07
RD
C6V[3]
C6V[2]
C6V[1]
C6V[0]
C5V[11]
C5V[10]
C5V[9]
C5V[8]
CVR08
RD
C6V[11]
C6V[10]
C6V[9]
C6V[8]
C6V[7]
C6V[6]
C6V[5]
C6V[4]
CVR09
RD
C7V[7]
C7V[6]
C7V[5]
C7V[4]
C7V[3]
C7V[2]
C7V[1]
C7V[0]
CVR10
RD
C8V[3]
C8V[2]
C8V[1]
C8V[0]
C7V[11]
C7V[10]
C7V[9]
C7V[8]
CVR11
RD
C8V[11]
C8V[10]
C8V[9]
C8V[8]
C8V[7]
C8V[6]
C8V[5]
C8V[4]
CVR12
RD
C9V[7]
C9V[6]
C9V[5]
C9V[4]
C9V[3]
C9V[2]
C9V[1]
C9V[0]
CVR13
RD
C10V[3]
C10V[2]
C10V[1]
C10V[0]
C9V[11]
C9V[10]
C9V[9]
C9V[8]
CVR14
RD
C10V[11]
C10V[10]
C10V[9]
C10V[8]
C10V[7]
C10V[6]
C10V[5]
C10V[4]
CVR15*
RD
C11V[7]
C11V[6]
C11V[5]
C11V[4]
C11V[3]
C11V[2]
C11V[1]
C11V[0]
CVR16*
RD
C12V[3]
C12V[2]
C12V[1]
C12V[0]
C11V[11]
C11V[10]
C11V[9]
C11V[8]
CVR17*
RD
C12V[11]
C12V[10]
C12V[9]
C12V[8]
C12V[7]
C12V[6]
C12V[5]
C12V[4]
*Registers CVR15, CVR16, and CVR17 can only be read if the CELL10 bit in register CFGR0 is low
Table 12. Flag (FLG) Register Group
REGISTER
RD/WR
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
FLGR0
RD
C4OV
C4UV
C3OV
C3UV
C2OV
C2UV
C1OV
C1UV
FLGR1
RD
C8OV
C8UV
C7OV
C7UV
C6OV
C6UV
C5OV
C5UV
FLGR2
RD
C12OV*
C12UV*
C11OV*
C11UV*
C10OV
C10UV
C9OV
C9UV
BIT 2
BIT 1
BIT 0
* Bits C11UV, C12UV, C11OV and C12OV are always low if the CELL10 bit in register CFGR0 is high
Table 13. Temperature (TMP) Register Group
REGISTER
RD/WR
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
TMPR0
RD
ETMP1[7]
ETMP1[6]
ETMP1[5]
ETMP1[4]
ETMP1[3]
ETMP1[2]
ETMP1[1]
ETMP1[0]
TMPR1
RD
ETMP2[3]
ETMP2[2]
ETMP2[1]
ETMP2[0]
ETMP1[11]
ETMP1[10]
ETMP1[9]
ETMP1[8]
TMPR2
RD
ETMP2[11]
ETMP2[10]
ETMP2[9]
ETMP2[8]
ETMP2[7]
ETMP2[6]
ETMP2[5]
ETMP2[4]
TMPR3
RD
ITMP[7]
ITMP[6]
ITMP[5]
ITMP[4]
ITMP[3]
ITMP[2]
ITMP[1]
ITMP[0]
TMPR4
RD
NA
NA
NA
THSD
ITMP[11]
ITMP[10]
ITMP[9]
ITMP[8]
Table 14. Packet Error Code (PEC)
REGISTER
PEC
RD/WR
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
RD
PEC[7]
PEC[6]
PEC[5]
PEC[4]
PEC[3]
PEC[2]
PEC[1]
PEC[0]
Table 15. Diagnostic Register Group
REGISTER
RD/WR
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
DGNR0
RD
REF[7]
REF[6]
REF[5]
REF[4]
REF[3]
REF[2]
REF[1]
REF[0]
DGNR1
RD
REV[1]
REV[0]
MUXFAIL
NA
REF[11]
REF[10]
REF[9]
REF[8]
680324fa
24
LTC6803-2/LTC6803-4
OPERATION
Table 16. Memory Bit Descriptions
NAME
CDC
DESCRIPTION
Comparator Duty Cycle
VALUES
CDC
UV/OV COMPARATOR
PERIOD
VREF POWERED DOWN
BETWEEN MEASUREMENTS
CELL VOLTAGE
MEASUREMENT TIME
0
(Default)
N/A (Comparator Off)
Standby Mode
Yes
N/A
1
N/A (Comparator Off)
No
13ms
2
13ms
No
13ms
3
130ms
No
13ms
4
500ms
No
13ms
5
130ms
Yes
21ms
6
500ms
Yes
21ms
7
2000ms
Yes
21ms
CELL10
10-Cell Mode
0 = 12-cell mode (default); 1 = 10-cell mode
LVLPL
Level Polling Mode
0 = toggle polling (default); 1 = level polling
GPIO1
GPIO1 Pin Control
GPIO2
GPIO2 Pin Control
Write: 0 = GPIO1 pin pull-down on; 1 = GPIO1 pin pull-down off (default)
Read: 0 = GPIO1 pin at logic ‘0’; 1 = GPIO1 pin at logic ‘1’
Write: 0 = GPIO2 pin pull-down on; 1 = GPIO2 pin pull-down off (default)
Read: 0 = GPIO2 pin at logic ‘0’; 1 = GPIO2 pin at logic ‘1’
WDT
Watchdog Timer
Read: 0 = WDTB pin at logic ‘0’; 1 = WDTB pin at logic ‘1’
DCCx
Discharge Cell x
x = 1..12 0 = turn off shorting switch for cell ‘x’ (default); 1 = turn on shorting switch
VUV
Undervoltage Comparison Voltage*
Comparison voltage = (VUV –31) • 16 • 1.5mV (Default VUV = 0)
VOV
Overvoltage Comparison Voltage*
Comparison voltage = (VOV –32) • 16 • 1.5mV (Default VOV = 0)
MCxI
Mask Cell x Interrupts
x = 1..12 0 = enable interrupts for cell ‘x’ (default)
1 = turn off interrupts and clear flags for cell ‘x’
CxV
Cell x Voltage*
x = 1..12 12-bit ADC measurement value for cell ‘x’
cell voltage for cell ‘x’ = (CxV –512) • 1.5mV
reads as 0xFFF while A/D conversion in progress
CxUV
Cell x Undervoltage Flag
x = 1..12 cell voltage compared to VUV comparison voltage
0 = cell ‘x’ not flagged for undervoltage condition; 1 = cell ‘x’ flagged
CxOV
Cell x Overvoltage Flag
x = 1..12 cell voltage compared to VOV comparison voltage
0 = cell ‘x’ not flagged for overvoltage condition; 1 = cell ‘x’ flagged
ETMPx
External Temperature Measurement*
Temperature measurement voltage = (ETMPx –512) • 1.5mV
THSD
Thermal Shutdown Status
0 = thermal shutdown has not occurred; 1 = thermal shutdown has occurred
Status cleared to ‘0’ on read of Thermal Register Group
REV
Revision Code
Device revision code
ITMP
Internal Temperature Measurement*
Temperature measurement voltage = (ITMP –512) • 1.5mV = 8mV • T(°K)
PEC
Packet Error Code
Cyclic redundancy check (CRC) value
REF
Reference Voltage for Diagnostics
This reference voltage = (REF –512) • 1.5mV. Normal range is within 2.1V to 2.9V
*Voltage equations use the decimal value of the registers, 0 to 4095 for 12-bit and 0 to 255 for 8-bit registers
680324fa
25
LTC6803-2/LTC6803-4
OPERATION
SERIAL COMMAND EXAMPLES
LTC6803-2/LTC6803-4 (Addressable Configuration)
Examples below use a configuration of three stacked devices: bottom (B), middle (M), and top (T)
Write Configuration Registers (Figure 7) (Broadcast Write)
1. Pull CSBI low
2. Send WRCFG command and its PEC byte
3. Send CFGR0 byte, then CFGR1, …CFGR5, PEC byte (All devices on the bus receive the same data)
4. Pull CSBI high; data latched into all devices on rising edge of CSBI. S pins respond as data latched
Calculation of serial interface time for sequence above:
Number of devices in stack = N
Number of bytes in sequence = B = 2 command byte and 7 data bytes = 2 + 7
Serial port frequency per bit = F
Time = (1/F) * B * 8 bits/byte = (1/F) * (2 + 7) * 8
Time for 3-cell example above, with 1MHz serial port = (1/1000000) * (2 + 7)*8 = 72µs
Read Cell Voltage Registers (12 battery cells, addressable read)
1. Pull CSBI low
2. Send Address and PEC byte for bottom device
3. Send RDCV command and its PEC byte
4. Read CVR00 byte of bottom device, then CVR01 (B), CVR02 (B), … CVR17 (B), and then PEC (B)
5. Pull CSBI high
6. Repeat steps 1-5 for middle device and top device
Calculation of serial interface time for sequence above:
Number of devices in stack = N
Number of bytes in sequence = B = 2 address bytes, 2 command bytes, and 18 data bytes plus 1 PEC byte = 23 * N
Serial port frequency per bit = F
Time = (1/F) * B * 8 bits/byte = (1/F) * (23 * N) * 8
Time for 3-cell example above, with 1MHz serial port = (1/1000000) * (23 * N) * 8 = 552µs
680324fa
26
LTC6803-2/LTC6803-4
OPERATION
Start Cell Voltage ADC Conversions and Poll Status (Broadcast Command with Toggle Polling)
1. Pull CSBI low
2. Send STCVAD command and its PEC byte (all devices in stack start ADC conversions simultaneously)
3. SDO output of all devices in parallel pulled low for approximately 12ms
4. SDO output toggles at 1kHz rate, indicating conversions complete for all devices
5. Pull CSBI high to exit polling
Poll Interrupt Status (Level Polling)
1. Pull CSBI low
2. Send Address and PEC bytes for bottom device
3. Send PLINT command and PEC bytes
4. SDO output from bottom device pulled low if any device has an interrupt condition; otherwise, SDO high
5. Pull CSBI high to exit polling
6. Repeat steps 1-5 for middle device and top device
CSBI
SCKI
SDI
WRCFG + CFGR + PEC
td
Sn
(n = 1 TO 12)
td < 2µs IF Sn IS UNLOADED
Sn, DISCHARGE PIN STATE
680324 F07
Figure 7. S Pin Action and SPI Transmission
680324fa
27
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
DIFFERENCE BETWEEN THE LTC6803-2 AND LTC6803‑4
The only difference between the LTC6803-2 and the
LTC6803-4 is the bonding of the V– and C0 pins. The
V– and C0 are separate signals on every LTC6803 die.
In the LTC6803-2 package, the V– and C0 signals are
shorted together by bonding these signals to the same
pin. In the LTC6803‑4 package, V– and C0 are separate
pins. Therefore, the LTC6803-2 is pin compatible with the
LTC6802-2. For new designs the LTC6803-4 pinout allows
a Kelvin connection to C0 (Figure 22).
Larger series resistors and shunt capacitors can be used
to lower the filter bandwidth. The measurement error due
to the larger component values is a complex function of
the component values. The error also depends on how
often measurements are made. Table 17 is an example. In
each example a 3.6V cell is being measured and the error
is displayed in millivolts. There is a RC filter in series with
inputs C1 through C12. There is no filter in series with
C0. There is an interaction between cells. This is why the
errors for C1 and C12 differ from C2 through C11.
Table 17. Cell Measurement Errors vs Input RC Values
CELL VOLTAGE FILTERING
The LTC6803 employs a sampling system to perform its
analog-to-digital conversions and provides a conversion
result that is essentially an average over the 0.5ms conversion window, provided there isn’t noise aliasing with
respect to the delta-sigma modulator rate of 512kHz. This
indicates that a lowpass filter with 30dB attenuation at
500kHz may be beneficial. Since the delta-sigma integration bandwidth is about 1kHz, the filter corner need not
be lower than this to assure accurate conversions.
Series resistors of 100Ω may be inserted in the input
paths without introducing meaningful measurement error. Shunt capacitors may be added from the cell inputs
to V–, creating RC filtering as shown in Figure 8. The cell
balancing MOSFET in Figure 11 can cause a small transient
when it switches on and off. Keeping the cutoff frequency
of the RC filter relatively high will allow adequate settling
prior to the actual conversion. A delay of about 500µs is
provided in the ADC timing, so a 16kHz LPF is optimal
(100Ω, 0.1µF) and offers about 30dB of noise rejection.
100Ω
Cn
100nF
+
7.5V
100Ω
100nF
680324 F08
C(n – 1)
Figure 8. Adding RC Filtering to the Cell Inputs
(One Cell Connection Shown)
R = 100Ω, R = 1k,
C = 0.1µF C = 0.1µF
Cell 1 Error
(mV, LTC6803-2)
Cell 2 to Cell 12 (mV)
R = 1k,
C = 1µF
R = 10k,
C = 3.3µF
0.1
4.5
1.5
1.5
1
9
3
0.5
For the LTC6803-2, no resistor should be placed in series
with the V– pin. Because the supply current flows from
the V– pin, any resistance on this pin could generate a
significant conversion error for cell 1, and the error of
cell 1 caused by the RC filter differs from errors of cell 2
to cell 2.
OPEN-CONNECTION DETECTION
When a cell input (C pin) is open, it affects two cell measurements. Figure 9 shows an open connection to C3,
in an application without external filtering between the C
pins and the cells. During normal ADC conversions (that
is, using the STCVAD command), the LTC6803 will give
near zero readings for B3 and B4 when C3 is open. The
zero reading for B3 occurs because during the measurement of B3, the ADC input resistance will pull C3 to the
C2 potential. Similarly, during the measurement of B4, the
ADC input resistance pulls C3 to the C4 potential.
Figure 10 shows an open connection at the same point in
the cell stack as Figure 9, but this time there is an external
filtering network still connected to C3. Depending on the
value of the capacitor remaining on C3, a normal measurement of B3 and B4 may not give near-zero readings, since
the C3 pin is not truly open. In fact, with a large external
capacitance on C3, the C3 voltage will be charged midway
680324fa
28
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
+
B4
B3
+
18
+
20
+
22
24
+
1
increase the B4 measurement result relative to the normal
STCVAD command. The biggest change is observed in the
B4 measurement when C3 is open. So, the best method to
detect an open wire at input C3 is to look for an increase
in the value of battery connected between inputs C3 and
C4 (battery B4).
LTC6803-4
C4
C3
C2
MUX
C1
V–
The following algorithm can be used to detect an open
connection to cell pin Cn:
100µA
1. Issue a STOWAD command (with 100µA sources
connected).
680324 F09
2. Issue a RDCV command and store all cell measurements
into array CELLA(n).
Figure 9. Open Connection
3. Issue the 2nd STOWAD command (with 100µA sources
connected).
+
B4
B3
+
+
18
CF4
20
CF3
+
22
+
24
1
C4
LTC6803-4
C3
C2
MUX
C1
V–
100µA
680324 F10
Figure 10. Open Connection with RC Filtering
between C2 and C4 after several cycles of measuring cells
B3 and B4. Thus the measurements for B3 and B4 may
indicate a valid cell voltage when in fact the exact state of
B3 and B4 is unknown.
To reliably detect an open connection, the command
STOWAD is provided. With this command, two 100µA
current sources are connected to the ADC inputs and
turned on during all cell conversions. Referring again to
Figure 10, with the STOWAD command, the C3 pin will be
pulled down by the 100µA current source during the B3
cell measurement AND during the B4 cell measurement.
This will tend to decrease the B3 measurement result and
4. Issue the 2nd RDCV command and store all cell measurements into array CELLB(n).
5. For battery cells, if CELLA(1) < 0 or CELLB(1) < 0, V–
must be open.
If CELLA(12) < 0 or CELLB(12) < 0, C12 must be open.
For n = 2 to 11, if CELLB(n+1) – CELLA(n+1) > 200mV,
or CELLB(n+1) reaches the full scale of 5.375V, then
Cn is open.
The 200mV threshold is chosen to provide tolerance for
measurement errors. For a system with the capacitor connected to Cn larger than 0.5µF, repeating step 3 several
times will discharge the external capacitor enough to meet
the criteria.
If the top C pin is open yet V+ is still connected, then the
best way to detect an open connection to the top C pin
is by comparing the sum of all cell measurements using
the STCVAD command to an auxiliary measurement of
the sum of all the cells, using a method similar to that
shown in Figure 19. A significantly lower result for the
sum of all 12 cells suggests an open connection to the
top C pin, provided it was already determined that no
other C pin is open.
680324fa
29
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
USING THE S PINS AS DIGITAL OUTPUTS OR GATE
DRIVERS
The S outputs include an internal pull-up PMOS. Therefore
the S pins will behave as a digital output when loaded with
a high impedance, e.g. the gate of an external MOSFET.
For applications requiring high battery discharge currents,
connect a discrete PMOS switch device and suitable discharge resistor to the cell, and the gate terminal to the S
output pin, as illustrated in Figure 11.
Si2351DS
+
3.3k
Cn
Since thermal shutdown interrupts normal operation, the
internal temperature monitor should be used to determine
when the device temperature is approaching unacceptable
levels.
Sn
USING THE LTC6803 WITH LESS THAN 12 CELLS
33Ω
1W
680324 F11
detected on the device goes above approximately 145°C,
the configuration registers will be reset to default states,
turning off all discharge switches and disabling ADC
conversions. When a thermal shutdown has occurred, the
THSD bit in the temperature register group will go high.
The bit is cleared by performing a read of the temperature
registers (RDTMP command).
Cn – 1
Figure 11. External Discharge FET Connection (One Cell Shown)
POWER DISSIPATION AND THERMAL SHUTDOWN
The MOSFETs connected to the Pins S1 through S12 can be
used to discharge battery cells. An external resistor should
be used to limit the power dissipated by the MOSFETs. The
maximum power dissipation in the MOSFETs is limited by
the amount of heat that can be tolerated by the LTC6803.
Excessive heat results in elevated die temperatures. The
electrical characteristics for the LTC6803 I-grade are
guaranteed for die temperatures up to 85°C. Little or no
degradation will be observed in the measurement accuracy
for die temperatures up to 105°C. Damage may occur
above 150°C, therefore the recommended maximum die
temperature is 125°C.
To protect the LTC6803 from damage due to overheating,
a thermal shutdown circuit is included. Overheating of the
device can occur when dissipating significant power in
the cell discharge switches. The problem is exacerbated
when operating with a large voltage between V+ and V–.
The thermal shutdown circuit is enabled whenever the
device is not in standby mode (see Modes of Operation).
It will also be enabled when any current mode input or
output is sinking or sourcing current. If the temperature
If the LTC6803 is powered by the stacked cells, the minimum
number of cells is governed by the supply voltage requirements of the LTC6803. The sum of the cell voltages must be
10V to guarantee that all electrical specifications are met.
Figure 12 shows an example of the LTC6803-4 when used
to monitor seven cells. The lowest C inputs connect to the
seven cells and the upper C inputs connect to C12. Other
configurations, e.g., 9 cells, would be configured in the
same way: the lowest C inputs connected to the battery
cells and the unused C inputs connected to C12. The unused
inputs will result in a reading of 0V for those channels.
The ADC can also be commanded to measure a stack of
10 or 12 cells, depending on the state of the CELL10 bit
in the control register. The ADC can also be commanded
to measure any individual cell voltage.
FAULT PROTECTION
Care should always be taken when using high energy
sources such as batteries. There are numerous ways
that systems can be (mis)conﬁgured when considering
the assembly and service procedures that might affect a
battery system during its useful lifespan. Table 18 shows
the various situations that should be considered when planning protection circuitry. The ﬁrst ﬁve scenarios are to be
anticipated during production and appropriate protection
is included within the LTC6803 device itself.
680324fa
30
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
Internal Protection Diodes
NEXT HIGHER GROUP
OF 7 CELLS
100
+
+
+
+
+
+
+
V+
C12
S12
C11
S11
C10
S10
C9
S9
C8
S8
C7
S7 LTC6803-4
C6
S6
C5
S5
C4
S4
C3
S3
C2
S2
C1
S1
C0
V–
680324 F12
NEXT LOWER GROUP
OF 7 CELLS
Figure 12. Monitoring 7 Cells with the LTC6803-4
Each pin of the LTC6803 has protection diodes to help
prevent damage to the internal device structures caused
by external application of voltages beyond the supply rails
as shown in Figure 13. The diodes shown are conventional
silicon diodes with a forward breakdown voltage of 0.5V.
The unlabeled Zener diode structures have a reverse
breakdown characteristic which initially breaks down at
12V then snaps back to a 7V clamping potential. The Zener
diodes labeled ZCLAMP are higher voltage devices with an
initial reverse breakdown of 30V snapping back to 25V.
The forward voltage drop of all Zeners is 0.5V. Refer to
this diagram in the event of unpredictable voltage clamping or current ﬂow. Limiting the current ﬂow at any pin to
±10mA will prevent damage to the IC.
READING EXTERNAL TEMPERATURE PROBES
The LTC6803 includes two channels of ADC input, VTEMP1
and VTEMP2, that are intended to monitor thermistors
(tempco about –4%/°C generally) or diodes (–2.2mV/°C
typical) located within the cell array. Sensors can be
powered directly from VREF as shown in Figure 14 (up to
60µA total).
Table 18. LTC6803 Failure Mechanism Effect Analysis
SCENARIO
EFFECT
DESIGN MITIGATION
Cell input open-circuit (random)
Power-up sequence at IC inputs
Clamp diodes at each pin to V+ and V– (within IC) provide
alternate power path
Cell input open-circuit (random)
Differential input voltage overstress
Zener diodes across each cell voltage input pair (within IC) limits
stress
Disconnection of a harness between Loss of supply connection to the IC
a group of battery cells and the IC
(in a system of stacked groups)
Separate power may be provided by a local supply
Data link disconnection between
LTC6803 and the master
Loss of serial communication (no stress to ICs)
The device will enter standby mode within 2 seconds of
disconnect. Discharge switches are disabled in standby mode
Cell-pack integrity, break between
stacked units
No effect during charge or discharge
Use digital isolators to isolate the LTC6803-2/LTC6803-4 serial
port from other LTC6803-2/LTC6803-4 serial ports
Cell-pack integrity, break within
stacked unit
Cell input reverse overstress during discharge
Add parallel Schottky diodes across each cell for load-path
redundancy. Diode and connections must handle full operating
current of stack, will limit stress on IC
Cell-pack integrity, break within
stacked unit
Cell input positive overstress during charge
Add SCR across each cell for charge-path redundancy. SCR and
connections must handle full charging current of stack, will limit
stress on IC by selection of trigger Zener
680324fa
31
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
V+
LTC6803-4
VREG
VREF
VTEMP2
VTEMP1
NC
V–
LTC6803-4
C12
S12
C11
ZCLAMP
S11
100k
1µF
1µF
100k
100k
NTC
100k
NTC
680324 F14
C10
ZCLAMP
S10
ZCLAMP
Figure 14. Driving Thermistors Directly from VREF
ZCLAMP
C9
S9
A3
C8
A2
S8
A1
C7
A0
S7
C6
ZCLAMP
S6
VREG
VREF
VTEMP2
C5
VTEMP1
S5
C4
S4
CSBI
C3
SDO
S3
SDI
C2
SCKI
S2
GPIO2
ZCLAMP
C1
GPIO1
S1
WDTB
C0
TOS
V–
27
NOTE: NOT SHOWN ARE PN DIODES TO ALL OTHER PINS FROM PIN 27
40
+
39
LT6000
38
37
32
31
30
–
LTC6803-4
VREG
VREF
VTEMP2
VTEMP1
NC
V–
29
44
43
42
41
36
35
34
33
10k
10k
10k
NTC
10k
NTC
680324 F15
Figure 15. Buffering VREF for Higher Current Sensors
Expanding Probe Count
As shown Figure 16, a dual 4:1 multiplexer is used to expand the general purpose VTEMP1 and VTEMP2 ADC inputs
to accept 8 different probe signals. The channel is selected
by setting the general purpose digital outputs GPIO1 and
GPIO2 and the resultant signals are buffered by sections
of the LT6004 micropower dual operational amplifier. The
probe excitation circuitry will vary with probe type and is
not shown here.
680324 F13
Figure 13. Internal Protection Diodes
For sensors that require higher drive currents, a buffer
op amp may be used as shown in Figure 15. Power for
the sensor is actually sourced indirectly from the VREG
pin in this case. Probe loads up to about 1mA maximum
are supported in this conﬁguration. Since VREF is shut
down during the LTC6803 idle and shutdown modes, the
thermistor drive is also shut off and thus power dissipation minimized. Since VREG remains always on, the buffer
op amp (LT6000 shown) is selected for its ultralow power
consumption (12µA).
Another method of multiple sensor support is possible
without the use of any GPIO pins. If the sensors are PN
diodes and several used in parallel, then the hottest diode
will produce the lowest forward voltage and effectively
establish the input signal to the VTEMP input(s). The hottest
diode will therefore dominate the readout from the VTEMP
inputs that the diodes are connected to. In this scenario,
the specific location or distribution of heat is not known,
but such information may not be important in practice.
Figure 17 shows the basic concept. In any of the sensor
configurations shown, a full-scale cold readout would be
an indication of a failed-open sensor connection to the
LTC6803.
680324fa
32
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
ADDING CALIBRATION AND FULL-STACK
MEASUREMENTS
PROBE8
PROBE7
PROBE6
PROBE5
6
5
+ –
4
7
8
1/2 LT6004
1
2
3
4
5
6
7
8
Y0
VCC
X2
Y2
X1
Y
X
Y3
74HC4052
X0
Y1
X3
INH
A
VEE
GND
B
16
15
14
13
12
11
10
9
The general purpose VTEMP ADC inputs may be used to digitize any signals from 0V to 4V with accuracy corresponding
closely with that of the cell 1 ADC input. One useful signal
to provide is a high accuracy voltage reference, such as
3.300V from an LTC6655-3.3. From periodic readings of
this signal, the host software can provide correction of
the LTC6803 readings to improve the accuracy over that
of the internal LTC6803 reference and/or validate ADC
operation. Figure 18 shows a means of selectively powering an LTC6655-3.3 from the battery stack, under the
control of the GPIO1 output of the LTC6803-2. Since the
operational power of the reference IC would add significant
thermal loading to the LTC6803 if powered from VREG, an
external high voltage NPN pass transistor is used to form
a local 4.4V (Vbe below VREG) from the battery stack. The
GPIO1 signal controls a PMOS FET switch to activate the
reference when calibration is to be performed. Since GPIO
signals default to logic high in shutdown, the reference
will automatically turn off during idle periods.
PROBE4
PROBE3
PROBE2
PROBE1
CPO2
GPO1
VREG
VTEMP2
VTEMP1
1/2 LT6004 8
+ 3
1
2
4
–
680324 F16
1µF
V–
Figure 16. Expanding Sensor Count with Multiplexing
LTC6803-4
VREG
VREF
VTEMP2
VTEMP1
NC
V–
200k
Another useful signal is a measure of the total stack potential. This provides a redundant operational measurement
of the cells in the event of a malfunction in the normal
acquisition process, or as a faster means of monitoring
the entire stack potential. Figure 19 shows how a resistive divider is used to derive a scaled representation of a
full cell group potential. A MOSFET is used to disconnect
200k
680324 F17
Figure 17. Using Diode Sensors as Hot Spot Detectors
TOP CELL POTENTIAL
CZT5551
LTC6803-2
35
GPIO1
VREG
VTEMP1
V–
1M
Si2351DS
31
LTC6655-3.3
8
GND
SHDN
7
2
VOUT_F
VIN
6
3
GND VOUT_S
5
4
GND
GND
1
28
26
100nF
1µF
10µF
680324 F18
Figure 18. Providing Measurement of Calibration Reference
680324fa
33
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
PROVIDING HIGH SPEED ISOLATION OF THE SPI DATA
PORT
499k
CELLGROUP+
1M
1
2N7002K
WDTB
2
VREG
8
1
VTEMP1
3
+
1/2 LT6004
1µF
2
–
3
10nF
4
V–
31.6k
CELLGROUP–
680324 F19
Figure 19. Using a VTEMP Input for Full-Stack Readings
the resistive loading on the cell group when the IC enters
standby mode (i.e., when WDTB goes low). An LT6004
micropower operational amplifier section is shown for
buffering the divider signal to preserve accuracy. This
circuit has the virtue that it can be converted about four
times more frequently than the entire battery array, thus
offering a higher sample rate option at the expense of
some precision/accuracy, reserving the high resolution
cell readings for calibration and balancing data.
1
5V_HOST
2
SPI_CLOCK
SPI_CHIPSELECT
SPI_MASTEROUT
SPI_MASTERIN
100Ω
3
100Ω
4
100Ω
5
100Ω
6
1µF
7
8
GND_HOST
1µF
Si8441AB-C-IS
QUAD ISOLATOR
VDD1
VDD2
GND1
GND2
A1
B1
A2
B2
A3
B3
A4
B4
EN1
EN2
GND1
GND2
Isolation techniques that are capable of supporting the
1Mbps data rate of the LTC6803-2/LTC6803-4 require more
power on the isolated (battery) side than can be furnished
by the VREG output of the LTC6803-2/LTC6803-4. To keep
battery drain minimal, this means that a DC/DC function
must be implemented along with a suitable data isolation
circuit, such as shown in Figure 20. A quad (3 + 1) data
isolator Si8441AB-C-IS is used to provide non-galvanic
SPI signal connections between a host microprocessor
and an LTC6803-2/LTC6803-4. An inexpensive isolated DC/
DC converter provides powering of the isolator function
completely from the host 5V power supply. A quad threestate buffer is used to allow SPI inputs at the LTC6803-2/
LTC6803-4 to rise to a logic high level when the isolator
circuitry powers down, assuring the lowest power consumption in the standby condition. The pull-ups to VREG
are selected to match the internal loading on VREG by ICs
operating with a current mode SPI interface, thus balancing the current in all cells during operation. The additional
pull-up on the SDO line (1k resistor and Schottky diode)
is to improve rise time, in lower data rate applications this
may not be needed.
CMDSH2-3
16
15
14
13
12
4.22k
11
1/4 74ABT126
13
12
1
2
11
10
1k
4.22k
3
1/4 74ABT126
1µF
9
CSB1
4
5
4.22k
6
1/4 74ABT126
4.22k
10
8
LTC1693-2 8
IN1
VCC1
2
7
GND1 OUT1
3
6
IN2
VCC2
4
5
GND2 OUT2
470pF
20.0k
33nF
PE-68386
1•
•6
3
4
BAT54S
74ABT126 SUPPLY SHARED WITH
ISOLATOR VDD2 and GND2
SCI
SDO
9
1/4 74ABT126
1
VREG
SCKI
680324 F20
V–
10.0k
Figure 20. Providing an Isolated High Speed Data Interface
680324fa
34
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
SUPPLY DECOUPLING IF BATTERY-STACK POWERED
ADVANTAGES OF KELVIN CONNECTION ON C0
As shown in Figure 21, the LTC6803-4 can have filtering
on both V+ and V–, so differential bypassing to the cell
group potentials is recommended. The Zener suppresses
overvoltages from reaching the IC supply pins. A small
ferrite-bead inductor provides protection for the Zener, particularly from energetic ESD strikes. Since the LTC6803-2
cannot have a series resistance to V–, additional Schottky
diodes are needed to prevent ESD-induced reverse-supply
(substrate) currents to flow.
The V– trace resistance can cause an observable voltage
drop between the negative end of the bottom battery
cell and V– pin of LTC6803. This voltage drop will add to
the measurement error of the bottom cell voltage. The
LTC6803‑4 separates C0 from V–, allowing Kelvin connection on C0 as shown in Figure 22. Voltage drop on the
V– trace will not affect the bottom cell voltage measurement. The Kelvin connection will also allow RC filtering
on V– as shown in Figure 21.
CELLGROUP+
BLM31PG330SN1L
100Ω
CMHZ5265B
V+
100nF
BAT46W
CELLGROUP–
V–
LTC6803-2 Configuration
CELLGROUP+
BLM31PG330SN1L
CMHZ5265B
100Ω
100Ω
CELLGROUP–
680324 F21
V+
100nF
V–
LTC6803-4 Configuration
Figure 21. Supply Decoupling
+
+
BATTERY
STACK
+
LTC6803-4
C1
+
C0
R
ISUPPLY
V–
68034 F20
Figure 22. Kelvin Connection on C0 Improving
Bottom Cell Voltage Measurement Accuracy
680324fa
35
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
HARDWARE SHUTDOWN
To completely shut down the LTC6803 a PMOS switch can
be connected to V+, or, V+ can be driven from an isolated
power supply. Figure 23 shows an example of a switched
V+. The breakdown voltage of DZ4 is about 1.8V. If SHDN <
1.8V, no current will flow through the stacked MMBTA42s
and the 1M resistors. TP0610Ks will be completely shut
off. If SHDN > 2.5V, M7 will be turned on and then all
TP0610Ks will be turned on.
V+
43.2V
43.2V
43.2V
39.6V
39.6V
36V
36V
32.4V
32.4V
28.8V
28.8V
25.2V
25.2V
21.6
21.6
18V
18V
14.4V
14.4V
10.8
10.8
7.2
TP0610K
1M
+
+
D1
+
C12
DZ1
15V
LTC6803-4
IC #3
C0
V–
V+
TP0610K
C12
DZ2
15V
LTC6803-4
IC #2
+
+
1M
D2
C0
+
V–
V+
C12
LTC6803-4
IC #1
C0
V–
separation of traces at different potentials. The pinout
of the LTC6803 was chosen to facilitate this physical
separation. There is no more than 5.5V between any two
adjacent pins. The package body is used to separate the
highest voltage (e.g., 43.2V) from the lowest voltage (0V).
As an example, Figure 24 shows the DC voltage on each
pin with respect to V– when twelve 3.6V battery cells are
connected to the LTC6803.
CSBI
V+
SDO
C12
SDI
S12
SCKI
C11
A3
S11
A2
C10
A1
S10
LTC6803-4
A0
C9
GPIO2
S9
GPIO1
C8
WDTB
S8
TOS
C7
VREG
S7
VREF
C6
VTEMP2
S6
VTEMP1
C5
NC
S5
V–
C4
C0
S4
S1
C3
C1
S3
S2
C2
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
0V TO 5.5V
5V
3.1V
1.5V
1.5V
0V
0V
0V
3.6V
3.6V
7.2V
680324 F24
TP0610K
DZ3
15V
Figure 24. Typical Pin Voltages for Twelve 3.6V Cells
1M
SHDN
DZ4
1.8V
50k
+
+
+
ADVANTAGES OF DELTA-SIGMA ADCS
DZ1, DZ2, DZ3: MMSZ5245B
DZ4: MMSZ4678T1
ALL NPN: MMBTA42
ALL PN: RS07J
680324 F23
Figure 23. Hardware Shutdown Circuit Reduces Total Supply
Current of LTC6803-4 to About 0µA
PCB LAYOUT CONSIDERATIONS
The VREG and VREF pins should be bypassed with a 1µF
capacitor for best performance. The LTC6803 is capable of
operation with as much as 55V between V+ and V–. Care
should be taken on the PCB layout to maintain physical
The LTC6803 employs a delta-sigma analog-to-digital
converter for voltage measurement. The architecture of
delta-sigma converters can vary considerably, but the
common characteristic is that the input is sampled many
times over the course of a conversion and then filtered or
averaged to produce the digital output code. In contrast,
a SAR converter takes a single snapshot of the input
voltage and then performs the conversion on this single
sample. For measurements in a noisy environment, a
delta-sigma converter provides distinct advantages over
a SAR converter.
While SAR converters can have high sample rates, the fullpower bandwidth of a SAR converter is often greater than
680324fa
36
LTC6803-2/LTC6803-4
APPLICATIONS INFORMATION
For a given sample rate, a delta-sigma converter can
achieve excellent noise rejection while settling completely
in a single conversion—something that a filtered SAR converter cannot do. Noise rejection is particularly important
in high voltage switching controllers, where switching
noise will invariably be present in the measured voltage.
Other advantages of delta-sigma converters are that they
are inherently monotonic, meaning they have no missing
codes, and they have excellent DC specifications.
Converter Details
The LTC6803 ADC has a 2nd order delta-sigma modulator
followed by a SINC2, finite impulse response (FIR) digital
filter. The front-end sample rate is 512ksps, which greatly
reduces input filtering requirements. A simple 16kHz,
1-pole filter composed of a 100Ω resistor and a 0.1≤F
capacitor at each input will provide adequate filtering
for most applications. These component values will not
degrade the DC accuracy of the ADC.
Each conversion consists of two phases—an autozero
phase and a measurement phase. The ADC is autozeroed
at each conversion, greatly improving CMRR. The second
half of the conversion is the actual measurement.
Noise Rejection
Figure 25 shows the frequency response of the ADC. The
roll-off follows a SINC2 response, with the first notch at
4kHz. Also shown is the response of a 1 pole, 850Hz filter
(187µs time constant) which has the same integrated
response to wideband noise as the LTC6803 ADC, which
is about 1350Hz. This means that if wideband noise is
applied to the LTC6803 input, the increase in noise seen
at the digital output will be the same as an ADC with a
wide bandwidth (such as a SAR) preceded by a perfect
1350Hz brick wall lowpass filter.
Thus if an analog filter is placed in front of a SAR converter
to achieve the same noise rejection as the LTC6803 ADC,
the SAR will have a slower response to input signals. For
example, a step input applied to the input of the 850Hz
filter will take 1.55ms to settle to 12 bits of precision, while
the LTC6803 ADC settles in a single 1ms conversion cycle.
This also means that very high sample rates do not provide
any additional information because the analog filter limits
the frequency response.
While higher order active filters may provide some improvement, their complexity makes them impractical for
high channel count measurements as a single filter would
be required for each input.
Also note that the SINC2 response has a 2nd order rolloff envelope, providing an additional benefit over a single
pole analog filter.
10
0
FILTER GAIN (dB)
1MHz, which means the converter is sensitive to noise out
to this frequency. And many SAR converters have much
higher bandwidths—up to 50MHz and beyond. It is possible to filter the input, but if the converter is multiplexed
to measure several input channels a separate filter will be
required for each channel. A low frequency filter cannot
reside between a multiplexer and an ADC and achieve a
high scan rate across multiple channels. Another consequence of filtering a SAR ADC is that any noise reduction
gained by filtering the input cancels the benefit of having
a high sample rate in the first place, since the filter will
take many conversion cycles to settle.
–10
–20
–30
–40
–50
–60
10
100
1k
10k
FREQUENCY (Hz)
100k
680324 F25
Figure 25. Noise Filtering of the LTC6803-4 ADC
680324fa
37
LTC6803-2/LTC6803-4
PACKAGE DESCRIPTION
G Package
44-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1754 Rev Ø)
12.50 – 13.10*
(.492 – .516)
1.25 ±0.12
7.8 – 8.2
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
5.3 – 5.7
0.25 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 – 5.60*
(.197 – .221)
PARTING
LINE
0.10 – 0.25
(.004 – .010)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
2.0
(.079)
MAX
1.65 – 1.85
(.065 – .073)
0° – 8°
0.55 – 0.95**
(.022 – .037)
1.25
(.0492)
REF
NOTE:
1.DRAWING IS NOT A JEDEC OUTLINE
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSIONS ARE IN
0.50
BSC
7.40 – 8.20
(.291 – .323)
MILLIMETERS
(INCHES)
4. DRAWING NOT TO SCALE
5. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN 0.08mm AT SEATING PLANE
0.50
(.01968)
BSC
SEATING
PLANE
0.20 – 0.30†
(.008 – .012)
TYP
0.05
(.002)
MIN
G44 SSOP 0607 REV Ø
*DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS,
BUT DO INCLUDE MOLD MISMATCH AND ARE MEASURED AT
THE PARTING LINE. MOLD FLASH SHALL NOT EXCEED .15mm PER SIDE
**LENGTH OF LEAD FOR SOLDERRING TO A SUBSTRATE
†THE MAXIMUM DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSIONS.
DAMBAR PROTRUSIONS DO NOT EXCEED 0.13mm PER SIDE
680324fa
38
LTC6803-2/LTC6803-4
REVISION HISTORY
REV
DATE
DESCRIPTION
PAGE NUMBER
A
08/12
Clarification to UV/OV Operation
15
680324fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
39
LTC6803-2/LTC6803-4
TYPICAL APPLICATION
Typical 12-Cell Measurement Block
CELL 12
MMSZ5267B
IMC1210ER100K
BAT46W
BAT46W
100Ω
100nF
C12FILTER
DC12
C11FILTER
DC11
C10FILTER
DC10
C9FILTER
DC9
C8FILTER
REPEAT INPUT CIRCUITS
FOR CELL3 TO CELL12
DC8
C7FILTER
DC7
C6FILTER
DC6
C5FILTER
DC5
C4FILTER
DC4
C3FILTER
DC3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
LTC6803-2
V+
CSBI
C12
SDO
S12
SDI
C11
SCKI
S11
A3
C10
A2
S10
A1
C9
A0
S9
GPIO2
C8
GPIO1
S8
WDTB
C7
NC
S7
TOS
C6
VREG
VREF
S6
VTEMP2
C5
VTEMP1
S5
NC
C4
V–
S4
S1
C3
C1
S3
S2
C2
1M
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
1M
1M
CSBI
SDO*
SDI
SCKI
*REQUIRES 1K PULL-UP
RESISTOR AT HOST DEVICE
1M
1M
1M
10.0k
1µF
RQJ0303PGDQALT
33Ω
CELL1
100nF
+
PDZ7.5B
5
6
–
+
1
10nF
4
8
1/2 LT6004
–
7
10.0k
100nF
NTC1
1k
4
10nF
C1FILTER
100Ω
NTC2
1k
8
1/2 LT6004
3.3k
475Ω
RQJ0303PGDQALT
33Ω
100Ω
1µF
3
2
C2FILTER
CELL2
SPI PORT
TO HOST µP
OR DATA ISOLATOR
680324 TA02
PDZ7.5B
3.3k
475Ω
RELATED PARTS
PART NUMBER DESCRIPTION
COMMENTS
LTC6801
Independent Multicell Battery Stack Fault Monitor
Monitors Up to 12 Series-Connected Battery Cells for Undervoltage or
Overvoltage. Companion to the LTC6802 and LTC6803 family
LTC6802-1
Multicell Battery Stack Monitor with Parallel Addressed
Serial Interface
Functionally Equivalent to the LTC6803-1 and the LTC6803-3
LTC6802-2
Multicell Battery Stack Monitor with an Individually
Addressable Serial Interface
Functionally Equivalent to LTC6803-2/LTC6803-4. Pin Compatible with the
LTC6803-2
LTC6803-1/
LTC6803-3
Multicell Battery Stack Monitor with Daisy-Chained
Serial Interface
Functionality Equivalent to LTC6803-2/LTC6803-4, Allows for Multiple Devices
to Be Daisy Chained
680324fa
40 Linear Technology Corporation
LT 0812 REV A • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507 ● www.linear.com
 LINEAR TECHNOLOGY CORPORATION 2011

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