User Guide 075
ISL9237EVAL2Z Evaluation Board User Guide
Key Features
The ISL9237 is a buck-boost Narrow Output Voltage DC (NVDC)
charger utilizing Intersil’s advanced R3™ Technology to provide
high light-load efficiency, fast transient response and
seamless DCM/CCM transitions for a variety of mobile and
industrial applications.
• Buck-boost NVDC charger for 1-, 2-, 3-cell Li-ion batteries
• End of Charge (EOC) option
• System power monitor PSYS output, IMVP-8 compliant
In Charge mode, the ISL9237 takes input power from a wide
range (4V to 20V) of DC power sources (conventional AC/DC
charger adapters, USB PD ports, travel adapters, etc.) and
safely charges battery packs with up to 3 cells in a series
configuration.
• PROCHOT# open-drain output, IMVP-8 compliant
• Allows trickle charging of depleted battery
• Optional ASGATE FET control
• Ideal diode control in turbo mode
ISL9237 supports On-the-Go (OTG) function for 2 and 3-cell
battery application. When OTG function is enabled, ISL9237
operates in the Reverse Buck mode to provide 5V at the USB
port.
• Reverse buck, boost and buck-boost operation from battery
• Two-level adapter current limit available
• Battery ship mode option
SMBus/I2C
that
The ISL9237 has serial communication via
allows programming of many critical parameters to deliver a
customized solution. These programming parameters include,
but are not limited to: adapter current limit, charger current
limit, system voltage setting and trickle charging current limit.
• SMBus and auto-increment I2C compatible
ISL9237EVAL2Z evaluation board is designed to demonstrate
the performance of ISL9237. The default value numbers of the
battery in series, the switching frequency and the adaptor
current limit charging function can be programmed by the
resistor from the PROG pin to GND. Those values also can be
set by SMBus.
• VOUT = 2.5V to 12.6V
Specifications
• VIN = 3.8V to 24V (no dead zone)
• MAX Icharge up to 6A
• fSW = 1MHz maxminum
Ordering Information
PART NUMBER
References
ISL9237EVAL2Z
DESCRIPTION
ISL9237 Buck-boost charger evaluation board
• ISL9237 datasheet
VADP
OPTIONAL
Rs1
VSYS
Q1
Q4
L1
UGATE2
PHASE2
BOOT2
PHASE1
BOOT1
UGATE1
LGATE1
LGATE2
Q3
Q2
VSYS
CSOP
CSIN
CSIP
ASGATE
CSON
ADP
Rs2
ACIN
ISL9237
ACOK
BGATE
PROCHOT#
GND
AMON/BMON
VBAT
BATGONE
VBAT
OTGPG/CMOUT
OTGEN/CMIN
VDDP
VDD
DCIN
PROG
COMP
SCL
SDA
PSYS
FIGURE 1. BLOCK DIAGRAM
May 26, 2016
UG075.1
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2016. All Rights Reserved
Intersil (and design) and R3 are trademarks owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
User Guide 075
Recommended Equipment
• 0V to 25V power supply with at least 6A source current capability
• Electronic load capable of sinking current up to 6A
• Battery emulator capable of sinking and sourcing current up to
6A
• Digital Multimeters (DMMs)
• 100MHz quad-trace oscilloscope
charging mode and OTG mode. Figure 3, which is the top view of
the evaluation board, highlights the key testing points and
connect terminals. For other modes or more information about
ISL9237, please refer to ISL9237 datasheet.
System Voltage Regulation
1. Set the power supply to 5V and, with the output disabled,
connect the (+) to J1 and the (-) end to J2.
2. Ensure jumpers JP3, JP4 and JP6 are shorted. SW1 and SW2
should switch to the low position.
Functional Description
The ISL9237EVAL2Z provides all circuits that are required to
evaluate the features of the ISL9237. A majority of the features
of the ISL9237, such as adjustable output voltage, On-the-Go
(OTG) mode, trickle charging mode for depleted battery, and
system power monitor at buck, boost and buck-boost modes are
available on this evaluation board.
Quick Start Guide
The number of battery cell and adaptor current limit default
values can be configured with a standard 1% 0603 resisor (R23)
from the PROG pin to GND. Table 22 in ISL9237 datasheet shows
the programing options. After the default number of cells in
series are set, the default values for MaxSystemVoltage and
MinSystemVoltage are set accordingly. These values can also be
changed through the SMBus control registers, which are
implemented with the Intersil GUI, shown in Figure 2.
Three LEDs are indicating ACOK, PROCHOT and OTGPG/CMOUT
status, respectively. For more details about the functions of these
three pins, refer to ISL9237 datasheet. Follow these steps to
evaluate the ISL9237 key functions,including system voltage
regulation, input current limit regulation, charging mode, trickle
3. Turn on the power supply,measure VSYS using the DMM
across (+) and (-) TP5. VSYS should read 8.38V. The current
meter on the supply should read <100mA.Increase VIN from
5V to 15V slowly. Monitor PH1 and PH2 to observe seamless
switching from boost mode to buck-boost mode and into buck
mode finally.
Input Current Limit Regulation
1. Keep VIN as a constant value between 3.8V and 24V. Set the
battery emulator voltage to 7.8V, connect the battery
emulator output to battery leads,J5 and J6. Then, turn on the
battery emulator; there is no charge and discharge current for
the battery, which is consistent to the BGATE signal of a high
voltage level.
2. Add an electrical load on VSYS and GND terminals, J3 and J4.
Turn on the load and increase the electrical load slowly; the
input current increases correspondingly and VSYS keeps
stable at 8.38V. The output voltage (VSYS) will start dropping
as the input current reaches the 1.5A input current limit. For
the input current limit details, refer to ISL9237 datasheet. If
the VSYS voltage is 150mV lower than the battery voltage,
BGATE FET will turn on at low voltage level such that the
battery supplies the current to the load.
FIGURE 2. GUI SNAPSHOT
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May 26, 2016
User Guide 075
PH1
PH2
(+) DMM
LEAD
(+) SUPPLY
LEAD
(-) DMM
LEAD
(-) SUPPLY
LEAD
(+) BATTERY
LEAD
USB PORT
FOR SMBus
BATGONE
LED 1, 2, 3
BGATE
(-) BATTERY
LEAD
FIGURE 3. EVALUATION BOARD CONNECTION GUIDELINE
Charging Mode
Trickle Charging Mode
1. Set the power supply to a constant value between 3.8V and
24V, then do Steps 1 and 2 in “System Voltage Regulation” on
page 2. Make sure the input current does not hit the limit.
2. Set the battery emulator voltage to 7.8V; connect the battery
emulator output to battery leads,J5 and J6.
3. Connect the USB cable at USB port for the SMBus; LED 1, 2
and 3 are all lighting.
4. Turn on the power supply; LED 3 goes out. Then turn on the
battery emulator and open Intersil ISL9237 GUI (Figure 2 on
page 2).Note: The USB interface with a green tick means the
GUI is ready to communicate with the evaluation board. If the
USB interface shows a red cross, the GUI is not ready to
communicate with the evaluation board. Click the “reset USB”
button until a green tick shows in the USB interface. If not
green, check the USB connection.
5. Select “2 cell” and click the “write all” button, all controller
register values are set to the default values correspondingly.
The system voltage is 8.4V, which is the value of
MaxSystemVoltage in the GUI. There is no charge and
discharge current for battery. Change the
“ChargeCurrentLimit” from 0A to 2A then click the “write”
button, the battery is in a 2A current charge operation. The
charge current value can be monitored in the GUI by clicking
the “Read” button in ChargeCurrentLimit column.Monitor the
BGATE signal status to confirm battery is in charging mode.
Note: Make sure the input current does not reach the input
current limit value, especially for a small VIN input.
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3
1. Do steps 1 through 5 in “Charging Mode” without any
changes.
2. Decrease the battery emulator voltage and monitor the
battery charging current. As long as the battery emulator
voltage is less than 5.2V (lower than SystemMinVoltage), the
battery enters trickle charging mode and the charge current
decreases to 0.26A. The trickle charge current value can be
changed through the SMBus control registers, refer to
ISL9237 datasheet.
Note: Make sure the input current does not reach the input
current limit value, especially for small VIN input.
OTG Mode
1. Set the battery emulator voltage at a constant value between
5.8V and 15V; connect the battery leads, J5 and J6, with the
output disabled.
2. Connect electric load on supply leads, J1 and J2, with the
output disabled.
3. Connect the USB cable at the USB port for SMBus; only LED 1
light is on. Turn on the battery emulator and electrical load
without adding any load.
4. Open the Intersil ISL9237 GUI, the OTGVoltage is the objective
voltage for load side, as shown in Figure 4 on page 4, and the
OTGCurrent is the OTG output current limit at load side. Those
values can be set as the customer needs in the reasonable
range. For their values range, please refer to ISL9237
datasheet.
UG075.1
May 26, 2016
User Guide 075
5. Select the “control1&2 registers” tab, enable the OTG
function at control1 register，then click the “write” button, as
shown in Figure 5 on page 4.
6. Switch SW2 on the evaluation board to the HI position; the
load voltage is regulated as an OTGVoltage value, set in
Figure 5, and the LED 3 light is on, which means the OTG
function is enabled.
7. Increase the electrical load slowly and monitor the load
voltage. As long as the load current is less than the
OTGCurrent limit value, the load voltage will be regulate at the
setting value.
FIGURE 4. OTG VOLTAGE AND CURRENT SETTING IN GUI
FIGURE 5. OTG FUNCTION ENABLE
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All NFETs and PFETs are 3x3 size
FOR NO ASGATE OPTION
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ISL9237EVAL2Z Schematic
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FIGURE 6. ISL9237EVAL2Z BOARD SCHEMATIC
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all have 3V3 or VDD pull up options
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UG075.1
May 26, 2016
User Guide 075
FIGURE 7. TOP OF BOARD
FIGURE 8. BOTTOM OF BOARD
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May 26, 2016
User Guide 075
Bill of Materials
MANUFACTURER PART
QTY UNITS
REFERENCE DESIGNATOR
DESCRIPTION
MANUFACTURER
ISL9237EVAL1ZREVBPCB
1
ea
SEE LABEL-RENAME BOARD
PWB-PCB, ISL9237EVAL1Z, REVB, ROHS
IMAGINEERING INC
C0603COG500-100KDE
1
ea
C43
CAP, SMD, 0603, 10pF, 50V, 10%, NP0,
ROHS
VENKEL
C0603X7R160102KNE
2
ea
C45, C82
CAP, SMD, 0603, 1000pF, 16V, 10%, X7R, VENKEL
ROHS
GRM188R71E104KA01D
4
ea
C38, C84, C85, C86
CAP, SMD, 0603, 0.1µF, 25V, 10%, X7R,
ROHS
GRM188R61E105KA12D
7
ea
C5, C6, C26, C31, C37, C81, C83 CAP, SMD, 0603, 1µF, 25V, 10%, X5R,
ROHS
C1608X7R1E224K
2
ea
C30, C36
CAP, SMD, 0603, 0.22µF, 25V, 10%, X7R, TDK
ROHS
C0603X7R160-472KNE
1
ea
C42
CAP, SMD, 0603, 4700pF, 16V, 10%, X7R, VENKEL
ROHS
GRM188R71E473KA01D
1
ea
C46
CAP, SMD, 0603, 0.047µF, 25V, 10%, X7R, MURATA
ROHS
C0603X5R100-475KNE
2
ea
C32, C33
CAP, SMD, 0603, 4.7µF, 10V, 10%, X5R,
ROHS
0
ea
C87
CAP, SMD, 0603, DNP-PLACE HOLDER,
ROHS
C2012X5R1E106K
17
ea
C7-C16, C18, C21, C22, C23,
C24, C40, C41
CAP, SMD, 0805, 10µF, 25V, 10%, X5R,
ROHS
TDK
16TQC68MYF
3
ea
C2, C3, C4
CAP-POSCAP, SMD, 7.3x4.3, 68µF, 16V,
20%, 50mΩ, ROHS
SANYO
PIMB063T-2R2MS-01
1
ea
L1
PWR CHOKE COIL, SMD, 6.95x6.6, 2.2µH, CYNTEC CO., LTD.
10A, 20%, ROHS
111-0702-001
3
ea
J1, J3, J5
CONN-GEN, BIND.POST, INSUL-RED,
THMBNUT-GND
JOHNSON COMPONENTS
111-0703-001
3
ea
J2, J4, J6
CONN-GEN, BIND.POST, INSUL-BLK,
THMBNUT-GND
JOHNSON COMPONENTS
131-4353-00
2
ea
TP13, TP14
CONN-SCOPE PROBE TEST PT, COMPACT,
PCB MNT, ROHS
TEKTRONIX
5002
51
ea
TP1-TP12, TP15-TP37,
TP43-TP58
CONN-MINI TEST POINT, VERTICAL, WHITE, KEYSTONE
ROHS
54819-0519
1
ea
J10
CONN-USB MINI-B RECEPTACLE, TH,
5CIRCUIT, R/A, ROHS
MOLEX
68000-236HLF
1
ea
JP6
CONN-HEADER, 1x3, BREAKAWY 1x36,
2.54mm, ROHS
BERG/FCI
69190-202HLF
3
ea
JP3, JP4, JP5
CONN-HEADER, 1x2, RETENTIVE, 2.54mm, BERG/FCI
0.230x0.120, ROHS
SPC02SYAN
3
ea
JP3, JP4, JP6-Pins 1-2
CONN-JUMPER, SHORTING, 2PIN, BLACK,
GOLD, ROHS
1
ea
D1
DIODE-RECTIFIER, SMD, SOT23, 30V,
200mA, DUAL DIODE, ROHS
597-3311-407NF
3
ea
LED1, LED2, LED3
LED, SMD, 1206, GREEN, 75mW, 3mcd,
567nm, ROHS
DIALIGHT
C8051F320-GQ
1
ea
U2
IC-USB MICROCONTROLLER, 32P, LQFP,
PROGRAMMED, ROHS
SILICON LABORATORIES
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MURATA
MURATA
VENKEL
SULLINS
UG075.1
May 26, 2016
User Guide 075
Bill of Materials (Continued)
MANUFACTURER PART
QTY UNITS
REFERENCE DESIGNATOR
DESCRIPTION
MANUFACTURER
ISL80101IRAJZ
1
ea
U3
IC-ADJ.V, 1A LDO REGULATOR, 10P, DFN,
3x3, ROHS
INTERSIL
ISL9237HRZ
1
ea
U1
IC-NOTEBOOK BATTERY CHARGER, 32P,
QFN, 4x4, ROHS
INTERSIL
2N7002-7-F
3
ea
Q8, Q9, Q10
TRANSISTOR, N-CHANNEL, 3LD, SOT-23,
60V, 115mA, ROHS
DIODES, INC.
SI7625DN-T1-GE3
3
ea
Q5, Q6, Q7
(ALT: SISS27DN-T1-GE3-T)
TRANSIST-MOS, P-CHANNEL, -30V, -35A,
8P, PWRPAK, ROHS
VISHAY
SISA14DN-T1-GE3
4
ea
Q1, Q2, Q3, Q4
TRANSISTOR-MOS, N-CHANNEL, 8P,
PWRPAK, 30V, 20A, ROHS
VISHAY
9C06031A2R00FGHFT
5
ea
R1, R2, R7, R10, R14
RES, SMD, 0603, 2Ω, 1/10W, 1%, TF,
ROHS
YAGEO
CR0603-10W-4R70FT
1
ea
R8
RES, SMD, 0603, 4.7Ω, 1/10W, 1%, TF,
ROHS
VENKEL
CR0603-10W-000T
18
ea
a) R4, R5, R6, R11, R12, R22,
R24, R40, R41, R42
RES, SMD, 0603, 0Ω, 1/10W, TF, ROHS
VENKEL
CR0603-10W-000T
0
ea
b) R43, R84, R85, R86, R89,
R90, R91, R92
RES, SMD, 0603, 0Ω, 1/10W, TF, ROHS
VENKEL
ERJ-3EKF1001V
4
ea
R27, R83, R87, R88
RES, SMD, 0603, 1k, 1/10W, 1%, TF,
ROHS
PANASONIC
CR0603-10W-1002FT
6
ea
R15, R16, R36, R38, R39, R81
RES, SMD, 0603, 10k, 1/10W, 1%, TF,
ROHS
VENKEL
CR0603-10W-1003FT
6
ea
R13, R21, R28, R31, R44, R45
RES, SMD, 0603, 100k, 1/10W, 1%, TF,
ROHS
VENKEL
1
ea
R23
RES, SMD, 0603, 147k, 1/10W, 1%, TF,
ROHS
RC0603FR-07220RL
3
ea
R32, R33, R34
RES, SMD, 0603, 220Ω, 1/10W, 1%, F,
ROHS
YAGEO
ERJ-3EKF4023V
1
ea
R9
RES, SMD, 0603, 402k, 1/16W, 1%, TF,
ROHS
PANASONIC
ERJ-3EKF5621V
1
ea
R82
RES, SMD, 0603, 5.62k, 1/10W, 1%, TF,
ROHS
PANASONIC
CR0603-10W-6041FT
1
ea
R25
RES, SMD, 0603, 6.04k, 1/10W, 1%, TF,
ROHS
VENKEL
WSLP1206R0100FEA
1
ea
RS2
RES-CURR.SENSE, SMD, 1206, 0.01Ω, 1W, VISHAY/DALE
1%, 75ppm, ROHS
WSLP1206R0200FEA
1
ea
RS1
RES-CURR.SENSE, SMD, 1206, 0.02Ω, 1W, VISHAY/DALE
1%, 75ppm, ROHS
GT11MSCBE
2
ea
SW1, SW2
SWITCH-TOGGLE, SMD, 6PIN, SPDT, 2POS, ITT INDUSTRIES/C&K DIVISION
ON-NONE-ON, ROHS
PMSSS 440 0025 PH
4
ea
Four corners
SCREW, 4-40x1/4in, PHILLIPS, PANHEAD, BUILDING FASTENERS
STAINLESS, ROHS
2204
4
ea
Four corners
STANDOFF, 4-40x3/4in, F/F, HEX,
ALUMINUM, 0.25 OD, ROHS
0
ea
C1
DO NOT POPULATE OR PURCHASE
0
ea
JP1, JP2
DO NOT POPULATE OR PURCHASE
0
ea
L2
DO NOT POPULATE OR PURCHASE
0
ea
R3, R35, R37
DO NOT POPULATE OR PURCHASE
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8
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May 26, 2016
User Guide 075
Bill of Materials (Continued)
MANUFACTURER PART
QTY UNITS
LABEL-DATE CODE
REFERENCE DESIGNATOR
DESCRIPTION
MANUFACTURER
0
ea
TP38-TP42
DO NOT POPULATE OR PURCHASE
0
ea
C19, C20, C25, C27, C28, C29,
C34, C35, C39, C44, C88-C97
DO NOT POPULATE OR PURCHASE
1
ea
AFFIX TO BACK OF PCB
LABEL-DATE CODE_LINE 1:
YRWK/REV#,LINE 2: BOM NAME
INTERSIL
RENAME PCB TO:
ISL9237EVAL2Z.
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PCB Layout Guidelines
PIN NUMBER
PIN NAME
LAYOUT GUIDELINES
BOTTOM PAD
33
GND
Connect this ground pad to the ground plane through low impedance path. Recommend use of at least 5 vias to
connect to ground planes in PCB to ensure there is sufficient thermal dissipation directly under the IC.
1
CSON
2
CSOP
Run two dedicated traces with decent width in parallel (close to each other to minimize the loop area) from the two
terminals of the battery current sensing resistor to the IC. Place the differential mode and common mode RC filter
components in general proximity of the controller.
Route the current sensing traces through vias to connect the center of the pads; or route the traces into the pads
from the inside of the current sensing resistor. The following drawings show the two preferred ways of routing current
sensing traces.
VIAS
CURRENT-SENSING TRACES
CURRENT-SENSING TRACES
3
VSYS
Signal pin. Provides feedback for the system bus voltage. Place the optional RC filter in general proximity of the
controller. Run a dedicated trace from system bus to the pin and do not route near the switching traces. Do not share
the same trace with the signal routing to the DCIN pin OR diodes.
4
BOOT2
Switching pin. Place the bootstrap capacitor in general proximity of the controller. Use decent wide trace. Avoid any
sensitive analog signal trace from crossing over or getting close.
5
UGATE2
6
PHASE2
Run these two traces in parallel fashion with decent width. Avoid any sensitive analog signal trace from crossing over
or getting close. Recommend routing PHASE2 trace to high-side MOSFET source pin instead of general copper.
The IC should be placed close to the switching MOSFET’s gate terminals and keep the gate drive signal traces short
for a clean MOSFET drive. The IC can be placed on the opposite side of the switching MOSFETs.
Place the output capacitors as close as possible to the switching high-side MOSFET drain and the low-side MOSFET
source; and use shortest PCB trace connection. Place these capacitors on the same PCB layer with the MOSFETs
instead of on different layers and using vias to make the connection.
Place the inductor terminal to the switching high-side MOSFET drain and low-side MOSFET source terminal as close
as possible. Minimize this phase node area to lower the electrical and magnetic field radiation but make this phase
node area big enough to carry the current. Place the inductor and the switching MOSFETs on the same layer of the
PCB.
7
LGATE2
8
VDDP
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Switching pin. Run LGATE2 trace in parallel with UGATE2 and PHASE2 traces on the same PCB layer. Use decent
width. Avoid any sensitive analog signal trace from crossing over or getting close.
Place the decoupling capacitor in general proximity of the controller. Run the trace connecting to VDD pin with decent
width.
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PCB Layout Guidelines (Continued)
PIN NUMBER
PIN NAME
LAYOUT GUIDELINES
9
LGATE1
Switching pin. Run LGATE1 trace in parallel with UGATE1 and PHASE1 traces on the same PCB layer. Use decent
width. Avoid any sensitive analog signal trace from crossing over or getting close.
10
PHASE1
11
UGATE1
Run these two traces in parallel fashion with decent width. Avoid any sensitive analog signal trace from crossing over
or getting close. Recommend routing PHASE1 trace to high-side MOSFET source pin instead of general copper.
The IC should be placed close to the switching MOSFET’s gate terminals and keep the gate drive signal traces short
for a clean MOSFET drive. The IC can be placed on the opposite side of the switching MOSFETs.
Place the input capacitors as close as possible to the switching high-side MOSFET drain and the low-side MOSFET
source, and use shortest PCB trace connection. Place these capacitors on the same PCB layer with the MOSFETs
instead of on different layers and using vias to make the connection.
Place the inductor terminal to the switching high-side MOSFET drain and low-side MOSFET source terminal as close
as possible. Minimize this phase node area to lower the electrical and magnetic field radiation but make this phase
node area big enough to carry the current. Place the inductor and the switching MOSFETs on the same layer of the
PCB.
12
BOOT1
Switching pin. Place the bootstrap capacitor in general proximity of the controller. Use decent wide trace. Avoid any
sensitive analog signal trace from crossing over or getting close.
13
ASGATE
Run this trace with decent width in parallel fashion with the ADP pin trace.
14
CSIN
15
CSIP
Run two dedicated traces with decent width in parallel (close to each other to minimize the loop area) from the two
terminals of the adapter current sensing resistor to the IC. Place the differential mode and common mode RC filter
components in general proximity of the controller.
Route the current sensing traces through vias to connect the center of the pads, or route the traces into the pads
from the inside of the current sensing resistor. The following drawings show the two preferred ways of routing current
sensing traces.
VIAS
CURRENT-SENSING TRACES
CURRENT-SENSING TRACES
16
ADP
Run this trace with decent width in parallel fashion with the ASGATE pin trace.
17
DCIN
Place the OR diodes and the RC filter in general proximity of the controller. Run the VADP trace and VSYS trace to
the OR diodes with decent width.
18
VDD
Place the RC filter connecting with VDDP pin in general proximity of the controller. Run the trace connecting to VDDP
pin with decent width.
19
ACIN
Place the voltage divider resistors and the optional decoupling capacitor in general proximity of the controller.
20
OTGEN/CMIN
21
SDA
22
SCL
23
PROCHOT#
Digital pin, open-drain output. No special consideration.
24
ACOK
Digital pin, open-drain output. No special consideration.
25
BATGONE
26
No special consideration.
Digital pins. No special consideration. Run SDA and SCL traces in parallel.
Digital pin. Place the 100kΩ resistor series in the BATGONE signal trace and the optional decoupling capacitor in
general proximity of the controller.
OTGPG/CMOUT Digital pin, open-drain output. No special consideration.
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PCB Layout Guidelines (Continued)
PIN NUMBER
PIN NAME
LAYOUT GUIDELINES
27
PROG
Signal pin. Place the PROG programming resistor in general proximity of the controller.
28
COMP
Place the compensation components in general proximity of the controller. Avoid any switching signal from crossing
over or getting close.
29
AMON/BMON
30
PSYS
Signal pin, current source output. No special consideration.
31
VBAT
Place the optional RC filter in general proximity of the controller. Run a dedicated trace from the battery positive
connection point to the IC.
32
BGATE
No special consideration. Place the optional RC filter in general proximity of the controller.
Use decent width trace from the IC to the BGATE MOSFET gate. Place the capacitor from BGATE to ground close to
the MOSFET.
Board Layout
FIGURE 9. TOP LAYER
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Board Layout (Continued)
FIGURE 10. INNER LAYER 1
FIGURE 11. INNER LAYER 2
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Board Layout (Continued)
FIGURE 12. BOTTOM LAYER
Typical Performance
FIGURE 13. BOOST MODE, OUTPUT VOLTAGE LOOP TO ADAPTER
CURRENT LOOP TRANSITION. VADP = 5V,
MAXSYSTEMVOLTAGE = 8.496V, VBAT = 7V, SYSTEM
LOAD 0.5A TO 10A STEP, ADAPTERCURRENTLIMIT = 3A,
CHARGECURRENT = 0A
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13
FIGURE 14. BOOST MODE, CHARGING CURRENT LOOP TO ADAPTER
CURRENT LOOP TRANSITION. VADP = 5V,
MAXSYSTEMVOLTAGE = 8.496V, VBAT = 7V, SYSTEM
LOAD 0.5A TO 10A STEP, ADAPTERCURRENTLIMIT = 3A,
CHARGECURRENT = 1A
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Typical Performance (Continued)
FIGURE 15. BUCK-BOOST MODE, OUTPUT VOLTAGE LOOP TO
ADAPTER CURRENT LOOP TRANSITION. VADP = 12V,
MAXSYSTEMVOLTAGE = 12.6V, VBAT = 11V, SYSTEM
LOAD 1A TO 10A STEP, ADAPTERCURRENTLIMIT = 3A,
CHARGECURRENT = 0A
FIGURE 16. BUCK-BOOST MODE, CHARGING CURRENT LOOP TO
ADAPTER CURRENT LOOP TRANSITION. VADP = 12V,
MAXSYSTEMVOLTAGE = 12.6V, VBAT = 11V, SYSTEM
LOAD 1A TO 10A STEP, ADAPTERCURRENTLIMIT = 3A,
CHARGECURRENT = 1A
FIGURE 17. BUCK MODE, OUTPUT VOLTAGE LOOP TO ADAPTER
CURRENT LOOP TRANSITION. VADP = 20V,
MAXSYSTEMVOLTAGE = 8.496V, VBAT = 7V, SYSTEM
LOAD 2A TO 10A STEP, ADAPTERCURRENTLIMIT = 3A,
CHARGECURRENT = 0A
FIGURE 18. BUCK MODE, CHARGING CURRENT LOOP TO ADAPTER
CURRENT LOOP TRANSITION. VADP = 20V,
MAXSYSTEMVOLTAGE = 8.496V, VBAT = 7V, SYSTEM
LOAD 2A TO 10A STEP, ADAPTERCURRENTLIMIT = 3A,
CHARGECURRENT = 2A
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Typical Performance (Continued)
FIGURE 19. BOOST MODE, OUTPUT VOLTAGE LOOP TO INPUT
VOLTAGE LOOP TRANSITION. VADP = 5V,
MAXSYSTEMVOLTAGE = 8.496V, VBAT = 7V,
VINDAC = 4.5V, SYSTEM LOAD 0.5A TO 10A STEP,
CHARGECURRENT = 0A
FIGURE 21. OTG MODE ENABLE, OTG ENABLE 150ms DEBOUNCE TIME
FIGURE 20. BOOST MODE, CHARGING CURRENT LOOP TO INPUT
VOLTAGE LOOP TRANSITION. VADP = 5V,
MAXSYSTEMVOLTAGE = 8.496V, VBAT = 7V,
VINDAC = 4.5V, SYSTEM LOAD 0.5A TO 10A STEP,
CHARGECURRENT = 1A
FIGURE 22. OTG MODE 0.5A TO 2A TRANSIENT LOAD,
OTG VOLTAGE = 5.12V
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is
cautioned to verify that the document is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
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